characterization and electrochemical analysis of silver
TRANSCRIPT
Characterization and electrochemical analysis of silverelectrodeposition in ChCl–urea deep eutectic solvents
QISONG LI, HUIXUAN QIAN, XU FU, HAIJING SUN and JIE SUN*
School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang 110159, People’s Republic
of China
*Author for correspondence ([email protected])
MS received 14 April 2020; accepted 25 June 2020
Abstract. Electrochemical reduction behaviours of silver ions in ChCl–urea deep eutectic solvents (DESs) were
investigated by cyclic voltammetry. The results showed that equilibrium potential Eeq of the electrode system in ChCl–
urea DESs was -0.112 V. The Tafel curve was used to obtain the exchange current density j0 = 2.92 ± 0.2 cm-2 and the
transfer coefficient a = 0.16 ± 0.2. The nucleation and growth mechanism of silver were studied by cyclic current method.
The results showed that electrodeposition consisted of two processes, 3D nucleation with diffusion-controlled growth
j3D-dc(t) and a small amount of water in the reduction jWR(t). By calculating the percentage of different charge densities of
j3D-dc and jWR, the contribution rate of different processes to the total current was analysed. With the increase in potential,
the charge in water reduction process decreased, while the charge in silver 3D nucleation process increased. Scanning
electron microscope and energy spectrum scanning were used to characterize the surface and section micro-morphologies
of silver coating. The results showed that silver grew dendritically at -0.97 V, and the thickness was 22.98 lm. The
results of X-ray photoelectron spectroscopy showed that silver coating was composed of Ag2O and Ag.
Keywords. Deep eutectic solvents (DESs); silver; electrodeposition; electrochemical behaviour; microscopic
morphology.
1. Introduction
Owing to its excellent physical and chemical properties and
antibacterial properties, good corrosion resistance, high
electrical conductivity and excellent decorative properties,
metallic silver coatings are widely used in microelectronics,
aerospace, automotive and decorative industries [1–4]. For
the preparation of silver plating on different material sur-
faces, silver plating is mainly prepared by aqueous solution
and physical methods, such as magnetron sputtering [5,6].
For metallic silver coating obtained from aqueous solution,
the current conventional method is using a cyanide plating
method for the preparation of the coating [7]. In 2006, Fang
Jing-Li [8] systematically studied the relationship between
the half-wave potentials of 25 sulphur-containing organic
compounds and the coating brightness obtained in cyanide-
based plating solutions, and found that the half-wave
potentials of additives that can obtain specular brightness
fall at 0.6–0.9 V. This is because the cyanide bonding can
slow down the silver deposition rate, resulting in a negative
shift of the deposition potential, so that an excellent coating
can be obtained. Cyanide silver plating has many advan-
tages in coating production in today’s industrial production
due to its reliable coating quality, easy solution mainte-
nance and low cost. However, the use of cyanide also has
serious problems in industrial production, such as cyanide is
highly toxic and extremely unfriendly to the environment
[9,10]. These serious problems not only pose a threat to the
health of the operator, but also make bath and wastewater
treatment very expensive. In response to the problem of
silver cyanide plating, researchers have tried to use non-
cyanide plating solution for electrodeposition of metallic
silver coating [3,11]. With the deepening of research,
researchers have tried to use organic additives for elec-
trodeposition of silver, which can replace cyanide and
partially solve environmental pollution problems [12].
However, organic additives make the composition of the
solution more complicated and cause solution instability,
which is an urgent problem to be solved. When sensitive
ions are present, the coexistence of different species with
different abilities may affect the silver nucleation process
[13].
In recent years, due to the unique physical properties (low
melting point, low vapour pressure, high polarity range,
high thermal stability, good solvent properties, etc.) and low
toxicity, the application of ionic liquids (ILs) in the field of
electrodeposition has attracted wide attention of researchers
[14–21]. As a kind of ionic liquid, deep eutectic solvents
(DESs) have attracted the attention of researchers because
of their relatively low price, low toxicity, biodegradability,
Bull Mater Sci (2021) 44:14 � Indian Academy of Scienceshttps://doi.org/10.1007/s12034-020-02276-3Sadhana(0123456789().,-volV)FT3](0123456789().,-volV)
environmental protection and easy large-scale preparation
[22–25]. The formation of DESs is usually carried out by
combining choline chloride (ChCl) with a hydrogen bond
donor (such as ethylene glycol (EG), urea, renewable car-
boxylic acid, etc.) [26–29]. Compared with traditional ILs,
the DES formed by ChCl has the following characteristics:
(1) low price; (2) easy to store; (3) easy to prepare (by
simple mixing of two components); and (4) biodegradable
and biocompatible [30], thus, solving the problems of
purification and waste disposal commonly encountered by
ILs. Because they are not entirely composed of ions, they
cannot be defined as true ILs. The synthesis process of these
mixtures only requires the mixing of two components
(cheap, renewable and biodegradable) to form a deep
eutectic mixture without the formation of any additional
solvents or by-products [31–33]. Therefore, a large number
of DESs can be prepared because their individual compo-
sition and the composition are very flexible.
In the study of using DESs as the base solution for
electrodeposition, the electrochemical behaviour of differ-
ent metals in DESs, the nucleation mechanism of metals
and the influence of various factors in the preparation of
coatings have been deeply studied, and some research
results have been obtained. Sebastian et al [34] and Haoxing
Yang and Ramana G Reddy [35] studied the electrochem-
ical behaviour, nucleation mechanism and coating mor-
phology of Cu and Zn electrodeposition in the ChCl–urea
DES system, respectively. The results showed that Cu was
reduced in two steps, and the nucleation mode of Cu was
three-dimensional growth.
With the increase of overpotential, the growth morphol-
ogy of Cu changed from small granular to dendritic. In the
process of electrodepositing Zn, the diffusion coefficient of
zinc ions in the electrolyte was 7.85 9 10-9 cm2 s-1 at a
temperature of 363 K, and a pure zinc coating could be
obtained.
Regarding the research on the electrodeposition of silver
in ionic liquids, Roberta Bomparola et al [16] used
chronoamperometry method to study the nucleation of sil-
ver in the 1-butyl-3-methyl imidazolium tetrafluoroborate
ionic liquid, and in the conclusion, they obtained was that a
small overpotential was required to initiate the silver
deposition process at high temperatures, and a silver plating
layer of 0.3 lm was obtained by electrodeposition at 200�C.
In the study of electrodeposited silver using the ChCl–urea
DES system, the use of cyclic voltammetry (CV) is of great
help in the study of metal nucleation processes. Sebastian
et al [13] and Quentin Rayee et al [36] studied the under-
potential deposition of silver in a ChCl–urea system using
CV, chronoamperometry, etc., and the nucleation and
growth of the silver plating in the aqueous solution and the
eutectic solvent were compared. The results of these studies
indicated that in the ChCl–urea system, the current hys-
teresis loop occurred with the glassy carbon electrode as the
working electrode, and the nucleation of silver was three-
dimensional growth.
In the study of electrodeposition of silver in ionic liquids,
researchers usually studied the nucleation model of silver at
different temperatures or different potential conditions, but
rarely further analysed the mechanism [37]. From these
studies, it can also see that further analysis of the kinetics
and nucleation growth mechanism of silver in the ChCl–
urea deep eutectic solvent system will help to understand
the electrodeposition process of silver in this system.
Therefore, this paper discussed the factors that affected the
redox potential of each component in the solution. The use
of CV and chronoamperometry may provide further insights
into the mechanism and kinetic analysis of nucleation and
growth of silver. The nucleation mechanism of silver in
ionic liquids is of particular interest because detailed studies
on the information provided by the three-dimensional
nucleation of diffusion-controlled growth metal electrode-
position models in ILs have yet to be completed. In addi-
tion, this paper also studied the elemental composition and
cross-section of the silver coating deposited in the ChCl–
urea DES system.
2. Experimental
2.1 Experimental process
Choline chloride (ChCl), urea and silver nitrate (AgNO3)
used in the experiments were analytical reagents, and
the molar ratio of ChCl to urea was 1:2. At room
temperature, silver nitrate with a concentration of
0.1 mol l-1 was dissolved into the ChCl–urea DES
system to obtain a ChCl–urea–AgNO3 DES liquid
electrolyte for electrochemical behaviour study and
electrodeposition test. The brass sheets used as the base
material were polished with 240, 400, 1200, 2000#
sandpapers, respectively, and degreased with acetone,
thoroughly washed with absolute ethanol, and then
washed with deionized water for use. The other elec-
trodes were washed successively with acetone and
anhydrous ethanol, and dried for use.
CV, chronoamperometry and electrodeposition experi-
ments on the ChCl–urea–AgNO3 DES system were per-
formed by using the CS350 electrochemistry workstation. A
traditional three-electrode system was used in electrodepo-
sition experiments and the electrochemical behaviour tests.
The platinum (Pt) electrode was the counter electrode and
the silver (Ag) electrode was the reference electrode. The
glassy carbon electrode (diameter 3 mm, electrochemical
behavioural tests) and the brass plate (electrodeposition
experiments) were used as the working electrodes. In the
CV experiments, the scanning rate was 50 mV s-1 and the
test system temperature was 50�C. The temperature of
the silver electrodeposition experiment in the ChCl–
urea–AgNO3 DES system was 50�C and the deposition time
was 1 h.
14 Page 2 of 11 Bull Mater Sci (2021) 44:14
2.2 Characterization
Micro-morphology of the metal deposition coating was
characterized using scanning electron microscopy (SEM,
VEGA3) coupled with energy dispersive X-ray spec-
troscopy (EDS) and the elemental compositions of the
coating were performed using EDS analysis.
The X-ray photoelectron spectroscopy (XPS) analysis
using the ESCALAB250 System (Thermo VG company,
USA) with monochromatic AlKa (1486.6 eV) X-ray radi-
ation (15 kV and 20 mA) and hemispherical electron energy
analyzer was used to characterize the chemical state of the
elements. The survey spectra in the range of 0–1100 eV
were recorded in 1 eV steps for each sample, followed by
high resolution spectra over different element peaks in
0.1 eV steps, from which the detailed composition was
calculated. Curve fitting was performed after a Shirley
background subtraction by non-linear least square fitting
using a mixed Gauss/Lorentz function [38,39]. The spectra
were referenced to the C1s line of 284.6 eV. The signal was
collected 4 times per sample.
3. Results and discussion
3.1 Potentiodynamic study
Figure 1A shows the CV curve of the ChCl–urea–AgNO3
DES system. In the negative sweep process (i.e., reduction
process), there is an obvious reduction peak between -0.5
and -1.25 V. When the potential reaches to -0.97 V, the
current increases to a maximum value jmax = -41.48 lA
cm-2. This indicates that the reduction of Ag? in ChCl–
urea system is one-step reduction, Ag? ? Ag0. There is an
oxidation peak between -0.15 and 0.8 V in the positive
sweep process (i.e., oxidation process). At a potential of
0.12 V, an oxidation peak appears, and the peak current is
j = 48.6 lA cm-2. This oxidation peak corresponds to the
oxidation of silver, Ag0 ? Ag?.
At the potentials of 0.69 and 0.112 V, the reduction curve
intersects the oxidation curve to form a current hysteresis
loop. This is a marker for the nucleation and growth of
silver ions [40]. The test result of CV curve indicated that
Ag? was deposited on the glassy carbon electrode to form a
plating layer, and then Ag was oxidized and the plating
layer disappeared.
It can be seen from the CV curve (figure 1A) that the
current density tends to zero at a potential of -0.112 V, so
the potential can be considered to be the equilibrium elec-
trode potential of the Ag(0)/Ag(I) electrode system [41],
and the value of the equilibrium electrode potential is Eeq =
-0.112 V. According to g = E - Eeq, an g–j relationship
curve (shown in figure 1B) can be obtained. For the CV
curve shown in figure 1B, the overpotential interval
-0.1–0.1 V is intercepted, and g and j = jc - ja relationship
curve (shown in figure 1C) is made, where the ordinate is
the net current density. The curve shown in figure 1D is the
Tafel curve plotted from the data of figure 1C. By calcu-
lating the cathode branch slope of the Tafel curve, the
relationship curve between potential and current is gc =0.4658 - 0.3772 log jc, the exchange current density is J0 =2.92 ± 0.2 l cm-2, and the transfer coefficient is a = 0.16
± 0.2.
3.2 Potentiostatic study
Figure 2 shows a series of potentiostatic current density
transients recorded in the potential interval corresponding to
the reduction process of silver ions. Each curve has similar
characteristics, i.e., due to the electric double layer charg-
ing, the current rises rapidly within a short period of time
when the potential is applied. This is because the formation
and growth of the silver core on the surface of the electrode
causes an increase in current and reaches a maximum value
(tmax, Imax) in a short time. After a period of time, the
current begins to decrease as the concentration of silver-
containing electroactive components in the system decrea-
ses due to the deposition of metallic silver on the surface of
the working electrode. During the next period of time, the
current continues to decrease until the diffusion rate of
silver ions from the system to the electrode surface is the
same as the electrode reaction rate, and the current begins to
stabilize and the silver ion is reduced to metallic silver at
this rate. This phenomenon indicates that the reduction
process of silver ions in the ChCl–urea eutectic solvent
system is controlled by diffusion [18].
In the process of metal electrodeposition, metal ions are
adsorbed on the surface of the substrate and transferred to
atoms in the adsorbed state by charge transfer, and then
diffuse on the surface of the substrate. The nucleation
methods of metals can generally be divided into two-
dimensional and three-dimensional nucleations. To describe
the nucleation method of metals in eutectic systems,
researchers generally use the theory of three-dimensional
nucleation growth mechanism [42–44]. Three-dimensional
nucleation is divided into three-dimensional instantaneous
nucleation and three-dimensional progressive nucleation.
The actual current can be described using the following
function expression [16]:
3D instantaneous nucleation
i ¼ nFD1=2C=p1=2t1=2� �
1 � exp �N0pkDtð Þ½ �;
k ¼ 8pCM=dð Þ1=2:
ð1Þ
3D progressive nucleation
i ¼ nFD1=2C=p1=2t1=2� �
1�exp �bN0pk0Dt2=2
� �� �;
k0 ¼ 4=3 8pCM=dð Þ1=2: ð2Þ
Bull Mater Sci (2021) 44:14 Page 3 of 11 14
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5-0.00006
-0.00004
-0.00002
0.00000
0.00002
0.00004
0.00006
0.00008
0.00010 Amc
A/j-2
E/V
Eeq
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0-0.00006
-0.00004
-0.00002
0.00000
0.00002
0.00004
0.00006
0.00008
0.00010 B
mcA/j
-2
η/V
0.10 0.05 0.00 -0.05 -0.10
-15
-10
-5
0
5
10
C
ηc
j=jc-ja
ηa j=0 η=0
-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5
0.10
0.05
0.00
-0.05
-0.10
log|j/μAcm-2|
η/V
ηc=0.4658-0.3772logjc
ηa
ηc D
logja
logjClogj0
Figure 1. Typical cyclic voltammetry curve and related electrochemical data curve. (A) Typical cyclic voltammetry
curve (0.1 mol l-1 AgNO3 is dissolved in choline chloride and urea (1:2 M ratio) at 50�C, and the potential scan
started at -1.5 V in the negative direction at 50 mV s-1 sweep rate). (B) Relationship between current density and
overpotential, g = E - Eeq. (C) Relationship between net current and overpotential, g = E - Eeq. (D) Tafel plot
generated from experimental data in C.
0 2 4 6 8 10
0.000005
0.000010
0.000015
0.000020
0.000025
0.000030
0.000035
0.000040
-j/c
m-2
t/s
-0.623V -0.683V -0.703V -0.773V
Figure 2. Family of experimental current density transients
recorded in the system GCE/0.1 mol l-1 Ag dissolved in the
choline chloride and urea DES at the different overpotentials
indicated in the figure.
0 1 2 3 4 5 6
0.0
0.2
0.4
0.6
0.8
1.0
(j/j m
)2
t/tm
-0.623V -0.683V -0.703V -0.773V Instantaneous Progressive
Instantaneous
Progressive
Figure 3. Non-dimensional plots of some of the experimental
j–t transients.
14 Page 4 of 11 Bull Mater Sci (2021) 44:14
The dimensionless curve can be obtained after perform-
ing the dimensionless processing on the curve in figure 2,
and the result is shown in figure 3. However, it can be seen
that the curves do not completely conform to theoretical
three-dimensional instantaneous nucleation or theoretical
three-dimensional progressive nucleation model. When t/tm[1, the deviation increases. Especially after t/tm[2.5, the
curves completely deviate from theoretical three-dimen-
sional instant nucleation or theoretical three-dimensional
continuous nucleation. The characteristic features described
in Sun Jie et al’s [19] description when a concomitant
reaction (i.e., water reduction) is occurring on the diffusion-
controlled growing surfaces of 3D nuclei of the new phase
(i.e., cobalt) [37]. This indicates that the metal nucleation
process is not a single process and may include different
contributions, such as proton reduction and water reduction.
Therefore, the model of Palomar-Pardave et al [37] can
be used to analyse the constant potential current density
transient of silver in ChCl–urea DES system. According to
equation (3), the individual’s contribution to the total cur-
rent is j(t): 3D nucleation with diffusion-controlled growth,
j3D-dc(t), and water reaction jWR(t).
jtotal ¼ j3D�dc tð Þ þ jWR tð Þ; ð3Þ
j tð Þ ¼ ðP1 þ P4t�1=2Þ
� 1� exp �P2 t � 1� exp �P3tð Þð Þ=P3ð Þð Þð Þ;ð4Þ
P1 ¼ ZWRF�kWR 2c0M=pqð Þ1=2; ð5ÞP2 ¼ N0pkD; ð6ÞP3 ¼ A; ð7Þ
P4 ¼ 2FD1=2c0
� �= p1=2� �
; ð8Þ
k ¼ 8pc0=qð Þ1=2; ð9Þ
where ZWRF is the molar charge transferred during the
water reduction process, kWR is the rate constant of the
water reduction reaction, c0 and D are the bulk concentra-
tion and diffusion coefficient of Ag, respectively, M and qare the atomic mass and density of Ag, respectively, F is
Faraday’s constant.
The j–t data obtained in the experiment can be fitted
nonlinearly using equation (4) to obtain dynamic param-
eters, such as A, N0 and D. Figure 4 shows the constant
potential current density transient (marked as ‘—’) recor-
ded on the surface of a glassy carbon electrode in a DES
system with 0.1 mol l-1 AgNO3 dissolved at different
potentials and a theoretical curve (marked as ‘s’) fitted
using equation (4). From the fitting results (as shown in
figure 4), it can be seen that the experimental data
obtained using equation (4) have good fitting results. This
result shows that equation (3) describes the current density
transient response of silver deposition on the GCT surface
in DESs effectively. Table 1 lists the fitting parameters
and the diffusion coefficients of Ag in DESs at each
overpotential. The diffusion rate D is (0.29 ± 0.14) 9
10-8 cm2 s-1.
Under the potential conditions of -0.623 and -0.683 V,
the experimental j–t curve of silver nucleation and growth
on glassy carbon electrode was compared with the data
obtained by fitting the nonlinear equation (4) (as shown in
figure 5), and from this analysis, the individual’s contribu-
tion to total current can be seen. It is worth noting that the
main difference between these current density transients is
the contribution of water reduction, jWR. The analysis
results show that the surface properties of the cathode have
changed significantly due to silver electrodeposition, which
promotes the hydrogen evolution reaction. This result is
similar to the phenomenon found by Palomar-Pardave et al[45] in the electrodeposition of cobalt.
Qt ¼Z t
0
jdt: ð10Þ
Figure 6a and b shows the contribution curves of jWR and
j3D-dc under different potential conditions. By observing
figure 6 and the integrated area results of calculating the j–tdiagram of Q3D-dc and QWR (as shown in table 2) using
equation (10). It shows that as the potential increases, the
j3D-dc contribution also increases, while jWR decreases as the
potential increases, and the nucleation contribution domi-
nates. As the potential increases, the contribution rate of
water reduction decreases significantly. This result indicates
that increasing the potential can effectively improve the
three-dimensional nucleation of silver and effectively
inhibit the reduction of water.
3.3 Micro-morphology and composition analysis of Agcoating
Using the potential conditions of 0.65, 0.80 and 0.97 V,
respectively, for silver electrodeposition, it can be seen
from the results that as the potential increases, the
0 2 4 6 8 100.000005
0.000010
0.000015
0.000020
0.000025
0.000030
0.000035
0.000040
mcA/j-
-2
t/s
-0.773V-0.703V-0.683V-0.623V
Figure 4. Potentiostatic current density transients (marked as —)
and theoretical transients (s).
Bull Mater Sci (2021) 44:14 Page 5 of 11 14
micro-morphology of the silver coating changes from small
leaves to more loose pines. Sebastian et al [34] conducted a
silver electrodeposition study in the ChCl–urea eutectic
system, and a similar picture appeared in figure 7a. In the
process of metal electrodeposition, the metal needs to go
through four steps from the ionic state to the crystal, which
are (1) ionic liquid phase mass transfer, (2) pre-conversion,
(3) charge transfer and (4) crystal formation. In the solution
system with the slowest mass transfer rate, the concentra-
tion polarization caused by the slow mass transfer step
0 2 4 6 8 100.000000
0.000005
0.000010
0.000015
0.000020
0.000025
0.000030
jPR
mcA/j-
-2
t/s
-0.623V
j3D-dc
0 2 4 6 8 100.000000
0.000005
0.000010
0.000015
0.000020
0.000025
0.000030
0.000035
jPRmc
A/j--2
t/s
-0.683V
j3D-dc
Figure 5. The individual contributions to the total current due to the nucleation process (j3D-dc) and water reduction
(jWR). (According to equation (1) for the experimental current density transient recorded at different potentials.)
0 2 4 6 8 10
0.000000
0.000002
0.000004
0.000006
0.000008
0.000010
0.000012
(a)
-0.703V
-0.683V
-j/A
cm-2
t/s
-0.623V
-0.773V
0 2 4 6 8 100.000010
0.000015
0.000020
0.000025
0.000030
0.000035
0.000040
(b)
-j/A
cm-2
t/s
-0.623V
-0.683V
-0.703V
-0.773V
Figure 6. Individual contributions to the total current density (j(t)). (a) Water reduction, jWR. (b) Mass transfer
controlled 3D nucleation, j3D-dc.
Table 2. Current contribution rate in different processes.
-E (V) QWR% Q3D-dc% Qtotal%
0.623 34.36 65.35 100
0.683 16.22 83.78 100
0.703 2.41 97.59 100
0.773 3.39 96.61 100
Table 1. Related fit parameters and kinetic data obtained from the experimental potentiostatic current transients (depicted in figure 2
using equation (1)).
-E (V) A (s-1) 106 P1 (A cm-2) P2 (s-1) 104 P4 (A cm-2 s1/2) 108 D (cm2 s-1)
0.623 0.15 11.31 0.23 0.43 0.16
0.683 0.20 5.34 0.25 0.56 0.27
0.703 0.14 0.84 0.28 0.71 0.43
0.773 0.29 0.93 0.35 0.65 0.36
14 Page 6 of 11 Bull Mater Sci (2021) 44:14
controls the entire electrodeposition process, which easily
causes the sediment to become dendritic [46].
The dendritic growth is for the metal ion and hydrogen
ion in the electrolyte to quickly consume a high concen-
tration of electrons through discharge. The results of
Himanshu Singh et al [47] showed that dendritic mor-
phology is sensitive to potential. The authors also obtained a
silver coating with a dendritic microstructure in the ChCl–
urea system, and the results obtained through the
chronoamperometric experiment also proved that the
reduction process of silver ions in the ChCl–urea eutectic
solvent system was controlled by diffusion.
The EDS results show that the coating is mainly com-
posed of O, C, Ag, Cu and Zn, where Cu and Zn are matrix
elements, and C is a foreign substance. To study further, the
thickness of the coating, SEM and elemental mapping
images were analysed on the obtained cross-section of the
coating, and the results are shown in figure 8. It can be seen
from the cross-section view of the coating that the silver
plating layer uniformly covers the entire surface of the Cu–
Zn substrate with a thickness of about 22.98 lm.
As shown in figure 8b, the element linear scan of the
cross-section of the Ag plating layer shows that the elec-
trodeposited layer is mainly composed of Ag element,
which contains a small amount of O, C, Cu and Zn ele-
ments. It can be seen from the elemental mapping images of
the Ag coating (as shown in figure 9) that the distribution of
Ag, Cu and Zn elements is very obvious.
Figure 7. SEM micrographs of Ag electrodeposits on a Cu–Sn substrate at different potentials (a) 0.65,
(b) 0.8, (c) 0.97 V) and the energy-dispersive X-ray (EDS) analysis confirms the composition of the silver.
Bull Mater Sci (2021) 44:14 Page 7 of 11 14
Figure 10 shows the wide scanning spectrum of silver
coating and the narrow scanning spectra of silver and
oxygen obtained under the condition of -0.97 V potential.
The information of existing elements in Ag coating and
absorbed surface contamination can be obtained from the
wide scanning spectrum of XPS. Figure 10a shows the
typical XPS survey spectrum of the Ag coating surface. It
shows that the Ag film on the brass consisted primarily of
Figure 8. Cross-section sample of Ag electrodeposits on a Cu–Sn substrate and median line scanning.
Figure 9. Elemental mapping images of cross-section sample.
14 Page 8 of 11 Bull Mater Sci (2021) 44:14
Ag, O and C. Carbon has been found on sample as impu-
rities from handling the sample in air. Hydrogen could also
be present but cannot be detected by the XPS measurement
[48,49]. According to the fitting analysis of the Ag(3d5/2),
the Ag(3d5/2) peak can be deconvoluted into two peaks. The
chemical state of the Ag element and O element in the Ag
film can be observed from the analysis of the selected
narrow-scanned peaks for silver and oxygen elements. The
optimized deconvolution of the representative narrow scan
peaks for Ag and O are shown in figure 10b and c. Two
representative narrow scan spectra of the Ag3d peak can be
shown in the figure 10b. The first sub-peak for Ag(3d5/2) is
corresponding to the Ag2O and the second sub-peak for
Ag(3d5/2) is corresponding to the Ag. The selected narrow-
scanning of oxygen (O1s) shows that oxygen and silver
make up silver oxide (table 3).
It is worth noting that no matter the EDS test or the XPS
test, oxygen element can be found in the silver coating
obtained by the ChCl–urea eutectic solvent system.
According to the result description of the current density
transient in subsection 3.3, it can be inferred that the oxygen
element in the coating is due to the chemical reaction
between the trace water in the solution with silver. Aldana-
Gonzalez et al [50] and Manuel Palomar-Pardave et al [51]
have also found that water participates in the reduction of
nickel and iron in the ChCl–urea system. In the ChCl–urea
DES system, a small amount of water is reduced to
hydrogen and hydroxyl ions, and AgOH which is unsta-
ble in the solution is formed. AgOH dehydrates and further
decomposes to form Ag2O. The reduction process of silver
ions in ChCl-EG DESs can be expressed by equations
(11–14):
Agþ þ e� ! Ag; ð11Þ2H2O þ 2e� ! H2 þ 2OH�; ð12ÞAgþ þ OH� ! AgOH; ð13Þ2AgOH ! Ag2OðsÞ þ H2O: ð14Þ
4. Conclusion
The reduction process of silver ions in the ChCl–urea
eutectic solvent system is controlled by diffusion, and the
diffusion rate D is (0.29 ± 0.14) 9 10-8 cm2 s-1. The
metallic electrodeposition of Ag in this system cannot be
distinguished only by three-dimensional ‘instantaneous’ or
0 200 400 600 800 1000 1200
0.0
4.0x104
8.0x104
1.2x105
1.6x105
2.0x105
AgM
NN
Ag3
pAg3
p
AgM
5W
O1s
Ag3
d 5/2
C1s
Cou
nts
/ s
Binding Energy / eV
Survey(a)
360 365 370 3750.0
2.0x104
4.0x104
6.0x104
8.0x104
1.0x105
1.2x105 (b)
Binding Energy (eV)
Rel
ativ
e In
tens
ity
(c/s
) Ag3d3/2
Ag3d5/2
AgAg2O
Ag
525 530 535 540
3.0x104
3.5x104
4.0x104
4.5x104
5.0x104
5.5x104
6.0x104
(c)
Binding Energy (eV)
Rel
ativ
e In
tens
ity
(c/s
)
O1s O
Figure 10. XPS wide scanning spectrum and the narrow scan-
ning spectra of silver and oxygen elements. (a) Typical XPS
survey spectra for the silver coating. XPS narrow scanning
spectrum and fitting peaks of (b) Ag3d5/2 and (c) O1s.
Table 3. Data of the EDS analysis confirms the composition of silver.
Potential (V) Element Silver Copper Zinc Carbon Oxygen
0.65 Atomic wt% 58.97 20.83 11.16 7.49 1.54
0.80 Atomic wt% 69.37 15.71 9.40 3.28 2.24
0.97 Atomic wt% 77.12 3.98 2.50 9.69 6.71
Bull Mater Sci (2021) 44:14 Page 9 of 11 14
‘progressive’ nucleation under diffusion control. The cur-
rent density transient is composed of water reduction pro-
cess and 3D nucleation with diffusion-controlled growth,
and these two processes happen at the same time. The
reduction process of water can lead to the appearance of
silver oxide in the coating. Nucleation contribution is
dominant and water reduction contribution decreases with
the increase in potential. The three-dimensional nucleation
of silver can be improved by increasing the potential, and
the reduction of water can be inhibited at the same time.
The thickness of silver coating obtained in ChCl–urea DESs
was 22.98 lm and the compositions of the coating consisted
of Ag2O and Ag.
Acknowledgements
This work was supported by the project of Liaoning
Province-Shenyang National Laboratory for Materials
Science Joint Research Fund (Project No.: 2019JH3/
30100021).
References
[1] Cecilia I, Vazquez, Gabriela I and Lacconi 2013 J. Elec-troanal. C 691 42
[2] Andrew Basile, Anand I Bhatt, Anthony P O’Mullane and
Suresh K Bhargava 2011 Electrochim. Acta 56 2895
[3] Elena B Molodkina, Maria R Ehrenburg, Peter Broekmann
and Alexander V Rudnev 2019 Electrochim. Acta 299 320
[4] Paula Sebastian, Luis E Botello, Elisa Valles, Elvira Gomez,
Manuel Palomar-Pardave, Benjamın R Scharifker et al 2017
J. Electroanal. C 793 119
[5] Bek R Yu, Shuraeva L I and Ovchinnikova S N 2004 Russ.J. Electrochem. 40 1079
[6] Liu Xiuju, Gan Kang, Liu Hong, Song Xiaoqing, Chen
Tianjie and Liu Chenchen 2017 Dent. Mater. 33 e348
[7] Mirzaee M, Sadeghi M, Gholamzadeh Z and Shapour
Lahouti 2008 J. Radioanal. Nucl. 277 645
[8] Fang Jing-Li 2006 Electroplating additive (Beijing: National
Defense Industry Press)
[9] Abbott A P, Azam M, Ryder K S and Saleem S 2018 Trans.IMF 96 297
[10] de Oliveira G M, Barbosa L L, Broggi R L and Carlos I A
2005 J. Electroanal. C 578 151
[11] Aaboubi O and Housni A 2012 J. Electroanal. C 677–680 63
[12] Zarkadas G M, Stergiou A and Papanastasioum G 2004 J.Appl. Electrochem. 34 607
[13] Sebastian P, Valles E and Gomez E 2013 Electrochim. Acta112 149
[14] Zhao H, Holladay J E, Brown H and Zhang Z C 2007 Sci-ence 316 1597
[15] Dupont J, Souza R F D and Suarez P A Z 2003 Chem. Rev.
102 3667
[16] Roberta Bomparola, Stefano Caporali, Alessandro Lavacchi
and Ugo Bardi 2007 Surf. Coat. Technol. 201 9485
[17] Armand, Michel, Endres, Frank, MacFarlane and Douglas R
2009 Nature Mater. 8 621
[18] Sun Jie, Ming Ting-Yun, Qian Hui-Xuan and Li Qi-Song
2019 Electrochim. Acta 297 87
[19] Sun Jie, Ming Ting-Yun, Qian Hui-Xuan and Li Qi-Song
2019 Bull. Mater. Sci. 10 227
[20] Sun Jie, Ming Ting-Yun, Qian Hui-Xuan and Li Qi-Song
2018 Mater. Chem. Phys. 219 421
[21] Sun Jie, Ming Tingyun, Qian Huixuan, Zhang Manke and
Tan Yong 2018 Chem. J. Chinese 39 1497
[22] Duyuan Yue, Yongzhong Jia, Ying Yao, Jinhe Sun and Yan
Jing 2012 Electrochim. Acta 65 30
[23] Sheng-Li Yang and Zhang-Qun Duan 2016 Catal. Commun.
82 16
[24] Andrew P Abbott, Glen Capper and Katy J McKenzie 2007
J. Electroanal. Chem. 599 288
[25] Chaosheng Yuan, Kunkun Chu, Haining Li, Lei Su, Kun
Yang, Yongqiang Wang et al 2016 Chem. Phys. Lett. 661240
[26] Diana Lindberg, Mario de la Fuente Revenga and Mikael
Widersten 2010 J. Biotechnol. 147 169
[27] Anita Yadav, Jyotsna Rani Kar, Maya Verma, Saeeda Naqvi
and Siddharth Pandey 2015 Thermochim. Acta 600 95
[28] Rhoda B Leron, David Shan Hill Wong and Meng-Hui Li
2012 Fluid Phase Equilib. 335 32
[29] Hayyiratul Fatimah Mohd Zaid, Chong Fai Kait and
Mohamed Ibrahim Abdul Mutalib 2017 Fuel 192 10
[30] Denise Reinhardt, Florian Ilgen, Dana Kralisch, Burkhard
Konig and Gunter Kreisel 2008 Green Chem. 10 1170
[31] Ali Abo-Hamad, Maan Hayyan, Mohammed Abdul Hakim
Al Saadi and Mohd Ali Hashim 2015 Chem. Eng. J. 273 551
[32] Huixuan Qian, Jie Sun, Qisong Li, Haijing Sun and Xu Fu
2020 J. Electrochem. Soc. 167 102511
[33] Sonia Salome, Nuno M Pereira, Elisabete S Ferreira, Carlos
M Pereira and Silva A F 2013 J. Electroanal. C 703 80
[34] Sebastian P, Valles E and Gomez E 2014 Electrochim. Acta123 285
[35] Haoxing Yang and Ramana G Reddy 2015 Electrochim.Acta 178 617
[36] Quentin Rayee, Thomas Doneux and Claudine Buess-
Herman 2017 Electrochim. Acta 237 127
[37] Palomar-Pardave M, Scharifker B R, Arce E M and Romero-
Romo M 2005 Electrochim. Acta 50 4736
[38] Castle J E 2010 J. Electron. Spec. 178–179 347
[39] Castle J E and Salvi A M 2001 J. Electron. Spec. 114–1161103
[40] Stefano Caporali, Patrick Marcantelli, Cinzia Chiappe and
Christian Silvio Pomelli 2015 Surf. Coat. Technol. 264 23
[41] Li Di 2008 Beijing University of Aeronautics and Astro-nautics Press 5 385
[42] Mahdi Allam, Mohamed Benaicha and Achour Dakhouche
2018 Int. J. Hydrog. Energy 43 3394
[43] Azpeitia L A, Gervasi C A and Bolzan A E 2017 Elec-trochim. Acta 257 388
[44] Deborah J Lomax and Robert A W Dryfe 2018 Electroanal.Chem. 819 374
[45] Palomar-Pardave M, Aldana-Gonzalez J, Botello L E, Arce-
Estrada E M, Ramırez-Silva M T, Mostany J et al 2017
Electrochim. Acta 241 162
[46] Ren Guang-Jun 2016 Electroplating technology (Beijing:
China Building Materials Industry Press)
14 Page 10 of 11 Bull Mater Sci (2021) 44:14
[47] Himanshu Singh, Dheeraj P B, Yash Pratap Singh, Gaurav
Rathore and Mukesh Bhardwaj 2017Electroanal. Chem.785 1
[48] Sh H Liu, Wang D H and Ch H Pan 1988 X-ray photo-electron spectroscopy analysis (Beijing: Science Press)
[49] Moulder and John F 1995 Handbook of X-ray photoelectronspectroscopy (Eden Prairie, Minnesota, USA: Physical
Electronics)
[50] Aldana-Gonzalez J, Romero-Romo M, Robles-Peralta J,
Morales-Gil P, Palacios-Gonzalez E, Ramırez-Silva M T
et al 2018 Electrochim. Acta 276 417
[51] Manuel Palomar-Pardave, Jorge Mostany, Ricardo Munoz-
Rizo, Luis E Botello, Jorge Aldana-Gonzalez, Elsa M Arce-
Estrada et al 2019 J. Electroanal. C 851113453
Bull Mater Sci (2021) 44:14 Page 11 of 11 14