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Filotec USPs. FILOTEC - general features. Functional , technically oriented design Modular conception 78 different enclosure variants available in the standard product portfolio Variants with integrated cooling fins and mounting brackets - PowerPoint PPT Presentation

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Folie 1

23.11.2012BOPLA Product Marketing - M. Bnte1Filotec

USPs23.11.2012BOPLA Product Marketing - M. Bnte2FILOTEC - general features

Functional, technically oriented design

Modular conception

78 different enclosure variants available in the standard product portfolio

Variants with integrated cooling fins and mounting brackets

Customer- and application specific adaptions available via BOPLAs manufacturing services

23.11.2012BOPLA Product Marketing - M. Bnte3FILOTEC external design features

The technical design discretely perfectly blends in any application.Large-scale fontpanels and surfaces provide lots of mounting space for connectors, cable glands operating elements, etc.

Outside ribbing ensures an improved heat dissipation even without using heatsinks.Full aluminium body:

High mechanical strength Degree of protection IP40 EMC shielding23.11.2012BOPLA Product Marketing - M. Bnte4FILOTEC the modular conceptRectangular, flat surfaces ensure precise and cost-efficient machining.

The recessed, recatngular mounting area issuitable for cost efficient rectangular membrane keypads and decorative foils which do not require special stamping tools.Conventional screws no special tools required for assembly.23.11.2012BOPLA Product Marketing - M. Bnte5FILOTEC the modular concept

The split-profile enclosure concept ensures convenient access to the mounted PCBs during assembly and maintenance.Just in case

The simple frontpanels may be reproduced easily with no need for specialised tooling.Identical front and rear panels as well as identical upper and lower profiles help to streamline logistics and to keep stock-levels low. 23.11.2012BOPLA Product Marketing - M. Bnte6FILOTEC the modular concept

An optional profile with integrated heat sink keeps sensitive electronic components cool without additional time and effort.An optional profile with integrated wall mounting brackets simplifies installation.23.11.2012BOPLA Product Marketing - M. Bnte7FILOTEC Internal mounting space

Suitable for cost efficient rectangular PCBs with no need for complicated and expensive machining.Optimum utilisation of the mounting space and thus smaller overall dimensions of the electronic device.23.11.2012BOPLA Product Marketing - M. Bnte8FILOTEC

Is suitable for use in typical BOS-Ecoline and ALUBOS applications.

While BOS-Ecoline and ALUBOS are mainly used in handheld applications and thus feature an ergonomic design, FILOTEC focusses on a functional and reliable packaging of the electronics.

Please note that due to the split-profile enclosure concept the degree of protection may not be increased up to higher levels IP 40 is the maximum.BOCUBE Fields of application23.11.2012BOPLA Product Marketing - M. Bnte9Thank you very much

for

your kind attention.