grid.pdf grid.pdf september 2009 · sf-ias - 10/27 | emergency generator paralleling switchgear,...

S e p t e mb e r 2 0 0 9 w w w . e - g r i d . n e t P a g e 1

GRID.pdf GRID.pdf

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September 2009

CHAPTER MEETINGS

SCV-Phot - 9/1 | "Virtual Tour" of the National Ignition Facility - world's largest, highest-energy laser system, fully operational ... [more]

SCV-EMC - 9/8 | Fundamentals of EMI Prevention - signal and power integrity, root causes, simulation, measurement ... [more]

SCV-EDS - 9/8 | Nanomaterials for Energy Applications - non-conventional PV and TE devices, interactions, validation ... [more]

SCV-CPMT+CAS - 9/9 | Molecular Modification of PCB Substrates for Fine Line Patterning - lithographic process, fine lines... [more]

SCV-ComSoc - 9/9 | Internet as an Information & Communications Utility: It's Getting Personal - discovery, management ... [more]

SCV-IMS - 9/9 | Sensing EEG Signals in Consumer Devices: Introducing the Brain to Main Street - measurement, noise ... [more]

SCV-MTT - 9/10 | Sub-Harmonically Pumped Mixer Circuit Designs - frequency conversion, fundamental limits, design process ... [more]

SCV-RAS - 9/10 | Challenges Impeding the Application of Unmanned Air Systems (UAS) - challenges, approaches, benefits ... [more]

SCV-SPS - 9/14 | Monitoring Video Quality Inside a Network - delays, jitter, congestion, service-level agreements, quality ... [more]

SCV-Nano - 9/15 | Silicon Inkjet-Printed High-Efficiency Solar Cells - phosphorous-doped nanoparticle, standard screen-print line ... [more]

SCV-Mag - 9/15 | A Model for Noise Power versus Density in a Perpendicular Digital Magnetic Recording System - effects ... [more]

SCV-CNSV - 9/15 | Medical Devices: Marketing Your Skills and Ideas - target market, product launch, sales channels, CRM ... [more]

OEB-PES - 9/16 | Medium Voltage VFD Technology - smaller, cheaper, friendlier, more reliable, ... [more]

SCV-CSS - 9/16 | High-Performance Distributed Robot Control over Ethernet ... - Moved to September 17 [more]

SPECTRUM - 9/17 | Robotics and Academic Research - Webinar: medical assist, bridge inspection, underwater crawlers ... [more]

SCV-GOLD - 9/19 | Paintballing at Los Gatos Pursuit - introductory level, safety briefing, includes lunch ... [more]

SCV-CAS+SPS - 9/21 | Low-Voltage Oversampling Analog-to-Digital Conversion - high-resolution, quantization, feedback, DSP ... [more]

SCV-CE - 9/22 | Introduction to Palm webOS: Building Applications for the Mobile Web - architecture, SDK, native scripting ... [more]

SF-IAS - 9/22 | Surge Suppression: New UL 1449 3rd Edition Requirements - compliance deadline, differences, add’l ratings... [more]

SF-PSES - 9/22 | Hazard Tracking System – Purpose, Design & Implementation - possible approach, tracking database ... [more]

Continued on Page 2 ====>

Conference Calendar

Aug 30 - Sept 4: 31st Annual EOS/ESD Symposium - Disneyland Hotel, Anaheim [more]

Sept 20-24: IEEE Energy Conversion Conference and Exposition - Double Tree Hotel, San Jose [more]

Sept 21-24: Embedded Systems Conference Boston - Haynes Conv'n Center, Boston [more]

Sept 23-25: CMOS Emerging Technologies Workshop - Vancouver, BC, Canada [more]

Sept 24-25: GSA Emerging Opportunities Expo and Conference - Santa Clara Convention Center [more]

Oct 15-16: Electromagnetic Compatibility Mini-Symposium - Hilton Hotel, Santa Clara [more]

Oct 20-22: Localization World Conference & Exhibits - Santa Clara Convention Center [more]

Oct 21-23: ARM TechCon3 and Exhibition - Santa Clara Convention Center [more]

Oct 26-28: Sprint Open Developer Conference - Santa Clara Convention Center [more]

Oct 27-29: AdvancedTCA/MicroTCA Summit - Santa Clara Convention Center [more]

Nov 15-19: Int'l Symposium for Testing and Failure Analysis - San Jose Convention Center [more]

CALLS FOR PAPERS: Mar 22-24: International Symposium on Quality Electronic Design – San Jose – Due Oct 17 [more] Mar 22-24: Asia-Pacific Symp on Electromagnetic Compatibility – Beijing, China – Due Oct 5 [more]

Support our advertisers

MARKETPLACE – Services page 3

Santa Clara Univ, Grad School or Engineering

Fall classes starting September 22 [more]

Technical Classes at UC-SC Extension [more] - Analog IC Design - I/O Concepts and Protocols: PCI Express, Ethernet, Fibre Channel - Data Warehouse Solutions and Business Intelligence - Network Storage Essentials - Practical Logic Design By Example - Wireless Communications

Professional Skills Courses [more] - Managing Time and Multiple Priorities - Presentation Skills - Clear Business, Technical, E-Mail Writing - Leadership - Strategic Thinking - Getting Things Done

http://spectrum.ieee.org/webinar/758689/

http://www.ewh.ieee.org/r6/scv/css/

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September 2009 V is i t us a t w w w . e - G R I D . n e t

Your Networking Partner ®

September 2009 • Volume 56 • Number 9

IEEE-SFBAC ©2009

IEEE GRID is the monthly newsmagazine of the San Francisco Bay Area Council of the Institute of Electrical and Electronics Engineers, Inc. As a medium for news for technologists, managers and professors, the editorial objectives of IEEE GRID are to inform readers of newsworthy IEEE activities sponsored by local IEEE units (Chapters, Affinity Groups) taking place in and around the Bay Area; to publicize locally sponsored conferences and seminars; to publish paid advertising for conferences, workshops, symposia and classes coming to the Bay Area; and advertise services provided by local firms and entrepreneurs.

IEEE GRID is published as the GRID Online Edition residing at www.e-GRID.net, in a handy printable GRID.pdf edition at the end of each month, and also as the e-GRID sent by email twice each month to more than 24,000 Bay Area members and other professionals.

Editor: Paul Wesling IEEE GRID PO Box 2110 Cupertino CA 95015-2110 Tel: 408 331-0114 / 510 500-0106 / 415 367-7323 Fax: 408 904-6997 Email: edi tor@e-gr id.net www.e-GRID.net

From the Editor … I ’ve heard engineers say that there are just

too many conferences in their special t ies. And wi th the economic downturn hi t t ing travel budgets, i t ’s very di f f icul t to travel to more than one conference or symposium each year.

But that ’s not a problem for our local engineers and managers here in the SF Bay Area – we have our choice of many leading-edge topical conferences, wi th no need for a irplane t ravel , hotel rooms, etc. Most major conferences come to S.F., San Jose, or Santa Clara at least once every few years – what a great advantage we have.

So, keep an eye on our GRID Conference Calendar – in the e-GRID every two weeks, on the cover of this GRID.pdf, in our Google Calendar, or in the banner ads on our website. You should spot one that wi l l advance your career, or prepare you for that next project!

How to save more money? Submit a paper to that conference next year that covers your interests. Speakers usual ly get a substant ial d iscount on registrat ion fees!

Paul

NOTE: This PDF version of the IEEE GRID – the GRID.pdf – is a monthly publication and is issued a few days before the first of the month. It is not updated after that. Please refer to the Online edition and Interactive Calendar for the latest information: www.e-GRID.net

DIRECTORS

Santa Clara Valley

Ram Sivaraman

Tom Coughlin

(Alt: Fred Jones)

Oakland East Bay

Victor Stepanians

Bill DeHope

San Francisco

Michael Butler

Dan Sparks

OFFICERS Chair: Dan Sparks

Secretary: Ram Sivaraman Treasurer: Bill DeHope

IEEE-SFBAC PO Box 2110

Cupertino, CA 95015-2110

IEEE GRIDCHAPTER MEETINGS (continued)

SCV-CPMT - 9/24 | Embedded Passives: Methodologies and Opportunities for Implementation - function, performance... [more]

SCV-RAS - 10/1 | Towards Robotic Cars - safer, more productive, self-driving, car sharing ... [more]

SCV-TMC - 10/1 | The Knowledge Transfer Bottleneck - agile development, documentation, reverse engng, mentoring ... [more]

SCV-CAS - 10/8 | Reverse Engineering in the Semiconductor Industry - challenges, teardowns, sophisticated analysis ... [more]

SCV-CPMT+CSS - 10/14 | Wider Applications for 3D Accelerometer MEMS: Sensing, Gaming, Therapy... [more]

SCV-CAS - 10/19 | Energy-efficient On-chip Power Mgmt: System, Circuit and Device Perspectives - improvements... [more]

SF-IAS - 10/27 | Emergency Generator Paralleling Switchgear, Power Switching Control Methodologies for Low & Medium Voltage Applications - transition types, control, protection... [more]

SCV-CE - 10/27 | Digital 3D - From Theater to Home - how it works, active players, remaining challenges ... [more]

SCV-CPMT - 11/11 | Nanopackaging: Nanotechnologies in Microelectronics Packaging - passives, interconnects ... [more]


Patent Agent Jay Chesavage, PE

MSEE Stanford 3833 Middlefield Road, Palo Alto 94303

[email protected]

www.File-EE-Patents.com

TEL: 650-619-5270 FAX: 650-494-3835

Do you provide a service? Would you like more inquiries?

Access 25,000 engineers and managers IEEE Members across the Bay Area Monthly and Annual Rates available

Visit our Marketplace (page 3)

Download Rates and Services information: www.e-grid.net/docs/marketplace-f lyer.pdf

GRID.pdf

e-GRID

Professional Services Marketplace – [email protected] for information

Say you found them in our GRID MARKETPLACE

MET Laboratories

EMC – Product Safety

US & Canada

• Electromagnetic Compatibility • Product Safety Cert. • Environmental Simulation • Full TCB Services • Design Consultations • MIL-STD testing • NEBS (Verizon ITL & FOC) • Telecom • Wireless, RFID (BQTF & EPCglobal Test Lab)

Facilities in Union City and Santa Clara

www.metlabs.com [email protected] 510-489-6300

IEEE-CNSV Consultants' Network

of Silicon Valley

• Become a member • Find a Consultant • Submit a Project

CaliforniaConsultants.org

• 20 Years of Experience • Fortune 500 Companies • Microsoft .Net, C#, C++, Java, … • Software, Firmware, Middleware, Web Applications • SCM, QA, and much more Experience/Expert ise

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• Turnkey transistor level design • Silicon-proven IP cores • Clocking and Data-Recovery • Analog Front Ends, Filters • High-performance ADCs • Reliable partner to ASIC vendors • Specialty I/Os

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mailto:[email protected]?subject=GRID_Inquiry:

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http://www.File-EE-Patents.com/

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http://www.e-grid.net/docs/marketplace-flyer.pdf


CALL FOR PAPERS

The symposium covers the entire scope of electromagnetic compatibility. Prospective authors are invited to submit original papers on their latest research results. We also solicit proposals for special sessions, industrial forums, workshops and tutorials. Please submit your papers via the Submission Portal.

Technical Topics: • EM Environment • EMC Measurement Techniques • EMC Management • EMC Standards & Regulations • Lightning Protection • System-Level EMC and Protection • Power System EMC • Antenna and Wave Propagation • Transportation EMC • Wireless Communication EMC • PCB & Electronic Packaging EMC and SI • Semiconductor device and IC EMC • Signal Integrity and Power Integrity • Computational Electromagnetics • Bio-Medical Electromagnetics • Nanotechnology for EMC

Oct. 20: Round Tables, Workshops, Focus Sessions Oct. 21-22: Main Conference and Exhibits Localization is the art and science of adapting products, services, and communications to an international language or culture to appear native to any targetted region At Localization World, attendees from more than 30 countries will learn about globalization best practices and the latest innovations in localization and international Web development from companies who are market leaders in international business. There will be two keynotes, including Dave Luhr, COO of international ad agency Wieden & Kennedy, and Chris Anderson, editor-in-chief of Wired Magazine. Speakers from Microsoft, the World Bank, Yahoo!, Apple, Dell, Cisco Systems, SalesForce.com, and Google, among others; will deliver case studies and presentations including topics such as cultural competency, rolling out products in multiple countries simultaneously, and the impact of multilingual content on business success.

Authors are requested to submit a preliminary paper of up to 4 pages in length, including title, author’s affiliation, abstract, figures and references. One additional page should contain the paper title, author’s affiliation, name of the corresponding author, his/her address, phone/fax numbers and e-mail address. Important dates Preliminary paper submission (up to 4 pages):

Oct. 5, 2009 (no extensions)

Notification of acceptance: Dec. 20, 2009 Final camera-ready paper due: Jan. 25, 2010 For more information, please visit the conference website:

www.apemc2010.org

October 20-22, 2009 Santa Clara Convention Center

Theme: Know-how for Global Success

Four Distinct Tracks:

Global Business Best Practices: Experienced business people provide practical insights for companies that want to venture with confidence into new international markets.

Localization Core Competencies: An introductory track for companies that need to localize, but are unsure where to start.

Advanced Localization Management: This track, the heart of Localization World , continues to provide the latest information on trends, processes, technologies and influences that shape the world of localization.

Managing Global Websites: Leading companies, each with an outstanding web presence, offer their expertise for launching and maintaining a worldwide web platform.

Save $100 through September 15th!

Academic discount of 50% available

Visit www.localizationworld.com Free parking, or take VTA’s light rail directly to the Conv Center

ASIA-PACIFIC EMC WEEK 2010 Asia-Pacific Symposium on Electromagnetic Compatibility &

Technical Exhibition on EMC RF/Microwave Measurement & Instrumentation

April 12 - 16, 2010 Beijing China

http://www.apemc2010.org/

http://www.localizationworld.com/

ISQED 201011th International Symposium on

QUALITY ELECTRONIC DESIGN

Call for PaPers

March 22-24 , 2010. San Jose, CA, USA

Papers are requested in the following areas

Design for Manufacturability/Yield & Quality (DFQ) Physical Design, Methodologies & Tools (PDM) Design Verification and Design for Testability (DVFT) EDA Methodologies, Tools, Flows & IP Cores; Interoperability and Reuse(EDA) Robust & Power-conscious Devices, Interconnects, and Circuits (PCC) Emerging/Innovative Process & Device Technologies and Design Issues (EDT) Package - Design Interactions & Co-Design (PDI) Design of Reliable Circuits and Systems (DFR) System-level Design, Methodologies & Tools (SDM)

Submission of PapersPaper submission must be done on-line through the conference web site at www.isqed.org. The guidelines for the final paper format are provided on the conference web site . Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 8 pages) along with an abstract of about 200 words. To permit a blind review, do not include name(s) or affiliation(s) of the author(s) on the manuscript and abstract. The complete contact author information needs to be entered separately. Please check the as-printed appearance of your paper before sending your paper. In case of any problems email [email protected]. Please note the following important dates:

The International Symposium on Quality Electronic Design (ISQED) is the leading Electronic Design & Design Automation conference, aimed at bridging the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design quality. ISQED is the pioneer and leading international conference dealing with design for manufacturability and quality issues front-to-back. ISQED emphasizes a holistic approach toward electronic design and intends to highlight and accelerate cooperation among the IC Design, EDA, Semiconductor Process Technology and Manufacturing communities. ISQED spans three days, Monday through Wednesday, in three parallel tracks, hosting over100 technical presentations, several keynote speakers, panel discussions, workshops/tutorials and other informal meetings. Conference proceedings are published by IEEE and posted in the digital library. Proceedings CD ROMs are published by ACM. In addition, continuing the tradition of reaching a wider readership in the IC design community, ISQED will continue to publish special issues in leading journals. The authors of high quality papers will be invited to submit an extended version of their papers for the special IEEE journal issues, such as TCAD, etc.

A pioneer and leading multidisciplinary conference, ISQED accepts and promotes papers related to the manufacturing, design and EDA. Authors are invited to submit papers in the various disciplines of high level design, circuit design (digital, analog, mixed-signal, RF), test & verification, design automation tools; processes; flows, device modeling, semiconductor technology, advance packaging, biomedical and bioelectronic devices. The details of various topics of paper submission are as follows:

www.isqed.org

Paper Submission DeadlineAcceptance NotificationsFinal Camera-Ready paper

Oct. 17, 2009November 24, 2009January 3, 2010

www.isqed.org

ISQED, ASQED, and ISQED-ASIA are registered trademarks of the International Society for Quality Electronic Design.

September 2009 Visit us at www.e-GRID.net

http://www.isqed.org



http://www.isqed.org/




Santa Clara Valley

Day One: October 15 Proper PCB Design for

Signal Integrity and EMC Control By Dr. Bruce Archambeault

Registration & Continental Breakfast: 7:00 AM

Morning Session: 8:00 AM – 12:00 Noon Introduction to General SI/EMC What is Inductance?

-- Full Definition -- Partial inductance -- Incomplete Inductance

The Ground Myth Where Does the Current Flow?

-- Plane discontinuities -- Vias -- Mother/Daughter Cards

Pseudo-Differential Nets Return Current Spread I/O Filter Design

Lunch: 12:00 PM – 1:00 PM

Afternoon Session: 1:00 PM – 5:00 PM Power Integrity & Decoupling Power/Ground planes

-- Source of Noise -- Board resonance issues -- Decoupling capacitor values -- Timely charge delivery -- Decoupling capacitor connection inductance -- Predicting Noise source levels

Mixed mode PCB design --RF, digital and analog

Shielding -- How does shielding really work?

SI and EMC issues for high speed differential cables -- Skew -- Rise/fall time mismatch -- Weak link

Using Signal Integrity tools for EMC design Other software tools for EMC design

NOTES: 1. There will be 30 minute mid-morning and mid-afternoon breaks scheduled each day. 2. The registration fee includes one copy of the technical program (including P-Spice CD), continental breakfast, lunch, refreshment breaks each day, and the reception at the conclusion of the event.

Day Two: October 16 Use of PSPICE in

Solving EMC Problems By Dr. Clayton Paul

Continental Breakfast/Exhibits Open: 7:30 AM

Morning Session: 8:00 AM – 11:30 AM Part I Basic Skills and Concepts

(1) Wavelength and Electrical Dimensions (2) Spectral Content of Digital Signals (3) Transmission Lines and Signal Integrity

Part II Partial Inductance and Power Integrity (1) Ground Bounce and Power Rail Collapse (2) Loop Inductance (3) What is Partial Inductance? (4) Partial Inductances of Segments of a Current Loop (5) Physical Meaning of Partial Inductance (6) Uses of Partial Inductance

Lunch: 11:30 AM – 1:00 PM

Afternoon Session: 1:00 PM – 4:00 PM Use of PSPICE in Solving EMC Problems

An Interactive Tutorial

Note: Attendees will load a free copy of PSPICE onto their laptop computers to simulate EMC problems. So, it is imperative that all attendees bring laptop computers, so that all take full advantage of this learning experience. Reception: 4:00 PM – 5:00 PM There will be an exhibition on Friday by vendors of EMC design, test and measurement related products and services. During the reception in the exhibit area, heavy appetizers and a hosted bar will be available. IEEE members are welcome to attend the reception only at NO CHARGE, provided a registration form is submitted in advance. Thus, if you can’t join us for the entire day, drop by for the reception and exhibition to network with the speakers and attendees. You can meet the speakers, and you might even win a raffle prize! Registration Rate: Before 8/31 After 8/31 Non-Member $350 $400 IEEE Member $300 $350 Student/Un-Employed $75 $125

For more information, and to register:

www.e-grid.net/docs/0910-emc.pdf

SCV EMC 2009 Mini SymposiumOctober 15-16

Hilton Santa Clara Featuring Dr. Clayton Paul and Dr. Bruce Archambeault

http://www.e-grid.net/docs/0910-emc.pdf


Visit www.embedded.com/boston

The Embedded Systems Conference Boston brings together embedded designers from around the globe, offering high-caliber, solutions-oriented technical sessions, and providing invaluable opportunities to network with peers and suppliers. ESC is the place to get the toughest technical questions asked and answered. The event delivers real-time embedded advice from experienced industry experts in 85 classes, talks and full-day tutorials, exhibitors across the embedded industry with the tools you need, and solution-swapping opportunities with your peers in discussion groups.

Product Exhibition

See the latest hardware, software, and development tool solutions from leading vendors in the electronics industry. Watch product demonstrations and hear about new product launches. Speak to product experts, compare products side-by-side and share experiences with your peers. Hear first-hand about tomorrow's technology today. Over 150 exhibitors will be on the 2009 show floor displaying an array and depth of products that will offer answers to any of your tough design questions.

Shoptalks

Grab a cup of coffee and join us for these popular early morning gatherings. Moderated by notable conference instructors, these free-form discussions are a great opportunity to swap ideas with your peers on common embedded development problems. The focus depends on the attendees present and their interests.

Brown Bag Lunches

Moderated by notable conference instructors, these informal discussions are a great opportunity to swap ideas with your peers on common embedded development problems. Bring your lunch and topics you’d like to discuss.

Signature Sponsor Gold Sponsor

ESC Tracks

Build Your Own Embedded System C and C++ Commercial and Open Source Operating Systems Consumer Electronics Debugging and Verification Design Team Management Designing for Power Efficiency Graphics, Displays and Lighting Improve Productivity at the HW/SW Interface Industrial and Automation Multi-core, Multi-threading, and Virtualization Multimedia and Signal Processing Programmable Logic Real-Time Development Security Sensors (including MEMS) Software Development System Integration and Test System-Level Design Issues (Hardware and Software) What Engineers & Developers need to know about IP Wired and Wireless Technologies (Connectivity)

Tutorials

Design of High Availability Embedded Systems Hardware Interfacing in C Managing Embedded Projects Embedding TCP/IP Real-Time Kernels

Flexible Registration Packages

• 1-day, 3-day, or the All-Access Pass value • Group rates – bring your team (save up to 25%) • IEEE Members use code “IEEE10” for 10% discount • Free Expo Registration • Free WiFi

Visit www.embedded.com/boston

Hynes Convention Center Boston, MA

September 21-24, 2009

http://www.embedded.com/boston/

http://www.embedded.com/boston/


UCSC Extension offers practical engineering courses in Silicon Valley and online to help hardware, software and IT professionals develop and advance their skills. We are the largest professional engineering educator in Silicon Valley.

Check out our brand new facility at 2505 Augustine Drive, Santa Clara, near the Great America Parkway/ Bowers Ave exit off Hwy 101. This mid-August move will make our career-oriented courses even more accessible to the Silicon Valley engineering community. “Real-time" courses, and "real-world" instructors

– Take one course or a whole certificate.

Find out more. Download our Program Brochure with year-round Course Tables:

Get on our mailing list for the Course Catalog

October 1, 2009

9:00 AM – 6:00 PM

Santa Clara Convention Center

The GSA Emerging Opportunities Expo & Conference is the semiconductor industry’s must-attend event. The 2009 program features more than 75 exhibiting companies and a full day of educational programming to address emerging opportunities changing the landscape of the semiconductor supply chain, with valuable networking opportunities for developers to review and understand the products and services of supply-chain partners. Platinum, Gold Sponsors

UPCOMING CLASSES FOR ENGINEERS – IN SANTA CLARA

Analog IC Design, Introduction (3799 - 013)

Starts September 19

I/O Concepts and Protocols: PCI Express, Ethernet, and Fibre Channel (22177) Starts Sept 21

Data Warehouse Solutions and Business Intelligence (3502 - 026) Starts September 26

Network Storage Essentials (21940 - 003) Starts September 28

Practical Logic Design By Example (22607 - 001) Starts September 29

Wireless Communications, Introduction (5455 - 015) Starts September 30

To register for an Overview session, visit

www.ucsc-extension.edu*

Keynotes: The “Innovation Imperative" Business Model,

Doug Grose, CEO, GlobalFoundries Energy Harvesting, Peter Henry, VP-GM, Analog Devices Small Footprint SoC for Portable Medical Instrumentation,

Murugavel Raju, Texas Instruments Opportunities for High Performance Semiconductor

Solutions in Cloud Computing, Dr. Francis Ho, Senior Director Business Development, Inphi Corporation

Home Networking: Opportunities and Challenges, Vinay Gokhale, Senior VP Marketing & Business Development, Entropic Communications

Smart Grids, Robert Dolin, Vice President and Chief Technology Officer, Echelon

Enabling 3G Wireless Digital Distribution In Emerging Markets, John Rizzo, Chief Executive Officer, Zeebo

No-cost registration/admission thru Sept 25th Includes Lunch and Cocktail Networking Reception

Full details at

www.gsaglobal.org/expo

http://www.ucsc-extension.edu/EngTech

http://www.gsaglobal.org/expo


Have you ever wanted to continue your education in engineering while you continued working? Santa Clara University’s School of Engineering offers graduate degree and non-degree programs to both full-time students and working professionals. Simplified registration for the Autumn Open University. Graduate-level instruction. Up to 12 units may be transferred to a graduate-degree program. Early-morning classes: - Linear Algebra - Speech Coding - Applied Math - Intro to Systems Engineering (and more)

Evening classes: - Web Architecture & Protocols - Logic Design Using HDL - IC Fab Processes - Nanoelectronics - Advanced RFIC Design - Low Power Designs of VLSI Circuits (and more)

Saturday classes: - Wireless Mobile Networks - Design of SOCs - Law, Technology, IP (and more)

Email Olivia Jenq with inquiries: [email protected]

IEEE Professional Skills Courses

Managing Time and Multiple Priorities – Date/Time: Wed, Sept 9, 8:30AM-12:30PM – Location: TIBCO Software, Palo Alto – Fee: $300 for IEEE Members; $350 non-members

"I enjoyed this class very much. I thought it was very informative and useful. It really made me more aware of how I can organize my time."

Presentation Skills for Engineers – Date/Time: Tues, Oct 13, 8:30AM-4:30PM – Location: TIBCO Software, Palo Alto – Fee: $500 for IEEE Members; $550 non-members

This class is top notch! Peter is very experienced and provided me with lots of good tips I can use on all my presentations. Definitely worthwhile. -TIBCO Software

5 Habits of Intentional Leadership – Wed-Thurs, Oct. 28-29, 8:00AM-5:00PM – Location: Synopsys, Sunnyvale

Fee: $625 for IEEE Members; $700 non-members Identify leadership strengths, find opportunities to take risks needed for growth; build collaboration, teamwork and trust; strengthen the ability in others to outperform.

Improve your skills – register for one of these classes, or for others coming up this spring. Bring a team!

Prepare for that next project or assignment!

To remain competitive in Silicon Valley's changing environment, engineers need to update their knowledge base. The School of Engineering offers professional Certificates and Open University programs, as well as graduate degrees, for those who are driven to become leaders in their fields.

Registration starts August 19 Classes begin September 22

50% SCU Engineering Alumni discount

Located in the heart of Silicon Valley, with easy parking

Review autumn Open University courses:

www.scu.edu/engineering/graduate

SCV Chapters, Technology Management & Components, Packaging and Manufacturing Technology Societies

Getting Things Done Across Organizational Borders

– Date/Time: Tuesday, Nov 3, 9:00AM-5:00PM – Instructor: Dr. Andrew Oravets – Location: Synopsis Corp, Sunnyvale – Fee: $400 for IEEE Members; $500 non-members

"Right-sizing" and restructuring have put new emphasis on lateral communication and inter-departmental cooperation. This seminar introduces you to innovative practices for dealing with people who do not report to you-but whose assistance and support are critical. You will be provided with new perspectives on the root causes of your communication blockages with others, as well as, practical techniques for assessing the styles of others, uncovering their needs and reaching mutually satisfying agreements.

Situational Leadership II – Date/Time: Tues-Wed, Nov 3-4, 9:00AM-5:00PM – Location: TIBCO Software, Palo Alto – Fee: $725 for IEEE Members; $800 non-members

Designed to open up the communication process between leader and employee so conversations on skill development, motivation, and performance occur.

For complete course information, schedule, and registration form, see our website:

www.EffectiveTraining.com

Santa Clara University School of Engineering Graduate Programs

SCU Autumn Open University


http://www.scu.edu/engineering/graduate

http://www.effectivetraining.com/calendar.php?loc=local


AdvancedTCA and MicroTCA are the open-

standard modular COTS platforms, revolutionizing the industry. Learn how you can reduce equipment costs and development time while making systems more flexible and more maintainable.

Summit themes include the creation of standards-based telecom equipment, design methods, interfaces, reduction of cost and development time, and making equipment more flexible and more maintainable.

The Summit consists of half-day tutorials, panel discussions, forums, keynotes, paper sessions, workshops, and special sessions.

Who Should Attend? • Embedded systems developers • Hardware and software design engineers • Network equipment manufacturers • Telecom engineers • Military/defense equipment contractors

Courses and Tutorials: - Introduction to AdvancedTCA/ MicroTCA - Next-Generation Power and Cooling - Wireless Applications - kServer Applications - Multicore Technology - Systems Integration - Hardware Development

Sessions and Panels: - Hardware - Design Tips - COTS Ecosystem - Security in AdvancedTCA Applications - The Users Talk Back - Embedded Linux - Top Ten Things You Need to Know - Developing Next-Generation COTS Solutions - Learn how to develop next-generation networks and

wireless systems using AdvancedTCA and MicroTCA - Learn from experts how to design, debug, and test

AdvancedTCA and MicroTCA hardware - Evaluate the economics of AdvancedTCA and

MicroTCA

Reduced Fees through October 22nd

Full information:

www.AdvancedTCAsummit.com

Oct 27-29, 2009 Santa Clara Convention Center

http://www.AdvancedTCAsummit.com/

http://www.ieee.org/join



Sprint is hosting its ninth annual Open Developer Conference, held locally in the Santa Clara Valley. All application developers and content providers are encouraged to attend! You will learn how to leverage the full suite of open development capabilities available from Sprint. Come to the Partner Pavilion to meet and mingle with many of Sprint's wireless data ecosystem partners including handset OEMs, software platform providers and application companies. Need user experience design help? Specialists in the field of UI design and research will hold on-site clinics, working with you to increase the appeal and usability of your applications.

We would like to recognize and thank our initial 2009 Sprint Open Developer Conference sponsors:

PREMIERE sponsors PLATINUM sponsors GOLD sponsors

Learn. Code. Deliver. All on the Sprint Now NetworkTM

Lightning Pitches: Share your working applications or embedded device idea with Sprint and get it into the market NOW. Enter your submission by October 15. If chosen, you'll have a 15-minute 'Lightning Session' with Sprint to show why it should be the next great application to launch on the open market.

Developer Sandbox: a place for developers to play. With sample service, applications, widgets and code, the Sprint experts have brought you the blocks to build your next working application.

Breakout Sessions: Gain in-depth knowledge from experts across every facet of the wireless ecosystem. These sessions will be a mixture of product capability overviews and in-depth technical coding dives. Learn first-hand details from inception to application delivery to the market.

After-Hours Coding Camps: Create applications and services on-site. Work with technical SMEs and your peers to put your learning to the test.

Blogging Lounge: Lounge in comfort while you chat on Twitter, Sprint Forums and other blogs during the conference. Topics that will be covered in various sessions: ● Mobile:

Palm Pre, Android, Java, OSGI, RIM Blackberry, Web, Windows Mobile

● Network/Product Capabilities: LBS, Messaging, M2M / Embedded, 4G

● Implementation and Feedback: Usability labs, Coding sessions

● Monetize Your Content: Lightning Pitches, Strategies, Support

Much, Much MORE!

Early Bird pricing – $250 through September 15!

Save $100

For full details, and to register, visit:

developer.sprint.com/devcon2009

2009 Sprint Open Developer Conference

http://developer.sprint.com/devcon2009/



3 days of in-depth technical training Exhibition of ARM Ecosystem Partners Keynote Presentations, Panel Sessions,

and Special Training Workshops

Get the Solutions for your ARM-Powered Designs

ARM TechCon3 targets the three critical areas of design: energy efficiency, Internet everywhere, and MCU and tools. It is a technical, engineering-oriented event organized by the ARM Partner ecosystem for engineers exploring or currently developing ARM hardware, software and systems design. It is an event that specifically enables designers to leverage expertise from a vast array of companies in all phases of the product development cycle, from hardware to software, opening a world of opportunity for you and your company. This is the industry’s only event providing in-depth technical classrooms and workshops on tools, technologies and design methodologies for the three primary initiatives in the embedded market.

The ARM Connected Community is the largest ecosystem in the embedded industry, consisting of over 550 companies spanning the gamut from semiconductor manufacturers to third-party IP providers – from EDA and Tools to OS providers. The breadth of the ARM Connected Community enables the designer to leverage expertise from a vast array of companies in all phases of the product development cycle.

Keynote Talks Opening Keynote Speaker: T.J. Rodgers, president & CEO, Cypress Semiconductor, and on the board of SunPower Corp. … plus keynotes from ARM, Mozilla,and CalTrans. Register today:

www.ARMtechcon3.com

Save $200 through Sept. 30th – only $495 for a full 3-day conference pass!

A free Exhibition-Only pass includes access to the exhibits, keynotes, special industry training sessions, and special events.

THREE PROGRAM FOCUS AREAS: Energy Efficiency and Design In an era of dwindling fossil fuels, energy efficiency is front and center in everyone's mind, particularly engineers using energy-efficient SoC strategies to minimize power requirements. The EE sessions will showcase the latest design and verification tools, and software and hardware for designing low-cost, low-power silicon devices.

Internet Everywhere The Internet is transforming the way people live, conduct business, manage their health, entertain themselves, and more. The IE sessions will be dedicated to providing the latest design strategies and tools for developing pervasive, mobile and wearable computing devices, covering the full spectrum of design and application issues.

MCU and Tools Readily-available microcontrollers and the development tools that support them are the backbone of the Embedded Industry. The MCU and Tools sessions will unveil new offerings and demonstrate the breadth of MCUs that are available, together with an array of hardware and software development tools enabling engineers to get their products to market more quickly than ever before.

ABOUT ARM ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM's comprehensive product offering includes 32-bit RISC microprocessors, graphics processors, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the company's broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies.

Platinum Sponsors: Exhibit at ARMTechCon3! Don’t miss this opportunity to showcase your ARM-based products or technology solutions. Increase ROI, : launch new products, influence target customers, expand your visibility. Contact Vaughn Orchard, Convergence Promotions, [email protected], 949.246.7055.

http://www.ARMtechcon3.com/



IEEE Energy Conversion Conference and Exposition provides a premier venue for showcasing new technologies, concepts and applications covering all aspects of efficient energy conversion and utilization, offering industry participants the opportunity to connect with their customers, vendors and with other researchers in the community. Participants include companies and individuals engaged in the research, development, manufacturing, support, application and education in the energy conversion, efficiency and sustainability areas. ECCE will also provide a neutral venue for industry-wide standards activity that can accelerate the development of new emerging energy-related products and markets.

Plenary Session: A plenary session includes presentations from several world renowned experts in the broader energy area including Arthur Rosenfeld, Commissioner of California Energy Commission, and Martin Eberhard, founder of TESLA Motors.

Rap Session: Three rap sessions are planned with leading experts on various energy related topics. These popular sessions allow an informal discussion with experts on issues that will have a big impact on society. The sessions include:

Venturing the Smart Grid Advanced Transportation Challenges Green Loads

Exposition and Industrial Seminars: ECCE hosts an exposition where market leaders in the energy and energy conversion field showcase their services and products for their customers. ECCE also provides a unique opportunity for industrial seminars that will provide an opportunity for companies to present the underlying details of their new products and technologies. To exhibit at ECCE, or participate in a seminar, please download the Prospectus:

www.ecce2009.org/Exhibition.html

Catherine Portner, [email protected]

IEEE ECCE 2009 combines two of the most successful international conference programs – the IEEE Power Electronics Specialists Conference (PESC) and the Industrial Power Conversion Systems Department of the IEEE Industry Applications Society Annual Conference – into one significant conference and exposition with a focus on energy conversion, efficiency, and sustainability.

September 20-24, 2009

Double Tree Hotel, San Jose

Tutorials, Sessions, Exposition

Tutorials: ● Advanced Thermal Management Materials for Energy Conversion ● Fundamentals and Application Engineering of Electrochemical Capacitors ● Sensorless Drives with PM Synchronous Machines ● Ocean Wave Energy: Fundamentals, Challenges, and Opportunities ● EMI Causes, Measurement, and Reduction Techniques for Switch-Mode Power Converters ● High-Power Variable Speed Drives: Performance Issues, Application Guide, and Network Studies ● Grid Converters for PV and WT Systems ● Application-based Design of Large PM Machines and Associated Power Conversion Systems

Technical Sessions: Over 600 papers in oral and poster sessions. Topics include: Green Energy Systems:

• Renewable and Alternative Energy • Solar and Wind Energy Conversion • Fuel Cell Systems • Distributed Microgrids • Grid Interface of Renewable Energy • Grid Level Energy Storage • Fast Control of Utility Grid • Coordinated Control of Renewable Sources & Loads

Energy Efficiency and Conservation: • Energy Efficient Lighting • Motor Drives in Commercial & Industrial Applications • Reducing Energy Consumption in Data Centers

Transportation Applications: • Plug-in Hybrid Electric Vehicles • Battery Management for PHEV and EVs • Electrical System Optimization for Cars • Energy Storage for Mobile Applications • Power Conversion for Rail and Mass Transit

Industrial Applications: • Large Motor Drives and Converters • Off-Shore Motor Drive Design • Power Quality, Grid Interface and EMI • Reliability, Diagnostics and Prognostics

Core Technology Issues: • Modeling, Analysis and Simulation • Motor and Drive Integration • Power Converter Design and Optimization • Control Issues • Design and Optimization of Machines and Actuators • Packaging Techniques for High Power Density

Converters and Drives

For more information and to register:

www.ecce2009.org

IEEE INDUSTRY APPLICATIONS SOCIETY

http://www.ecce2009.org/Exhibition.html


http://www.ecce2009.org/


Conference: Sunday, Nov 15 -Thursday, Nov 19 Exposition: Tuesday-Wednesday, Nov 17-18 Short Courses: Sat, Nov 14 & Thurs/Fri Nov 19-20

ISTFA’09 combines technical sessions, tutorials, an exhibition, and user group meetings with a focus on making the full experience a strong benefit for the attendee. The limited number of selected, high-quality papers only requires two tracks throughout the program, for good access

11 Technical Sessions • Emerging Concepts • Photon Beam-based Techniques I & II • Nanoprobing • Circuit-edit • Sample Preparation • Alternative Energy Photovoltaic FA • Failure Analysis Process • Packaging/Assembly Level FA • Photon Beam-based Techniques • Advanced Metrology and System Level FA • plus Panel Discussion, Poster Papers

6 Education Short Courses We continuously update the tutorial sessions with new and cutting-edge topics related to failure analysis. • Practical Transmission Electron Microscopy for IC Failure Analysis • FIB Sample Preparation for Failure Analysis • Differentiating between EOS and ESD for Failure Analysis • Finance and Management of Failure Analysis: Principles and Applications • Failure Analysis of Photovoltaic Devices • Fault Isolation

Technology-Specific User Groups User Group meetings in the evenings, to provide a convenient forum for users of a specific technique to meet, share ideas, and discuss relevant issues in a non-commercial environment. Planned topics this year:

Optical Techniques - Growth and Limitations Resolution of Nanoprobing Focused Ion Beam (FIB) Fast ASIC Fault Isolation: Efficiency and

Accurate Resolution of Software-Based Fault Isolation

. Theme: It’s All About Resolution.

2-day Microelectronics Tutorials Sunday, Nov. 15: choice of: Fault Isolation, Technology-specific FA, or Die and Defect Access. Monday, Nov. 16: choice of: Fault Isolation, Technology-specific FA, Microscopy, The Periphery of FA, Lab Management, or FIB.

2009 Keynote Address “Failure Analysis of World Trade Center – A Structural Engineer's Findings and Viewpoint” Prof. Luis A. Prieto-Portar, Florida Int’l University

Exposition The ISTFA Exposition is North America’s largest trade show of FA-related equipment and services. This promises to be an exciting year on the show floor where you will see the latest advances and be able to network with vendors for problem-solving advice. Bring your questions, needs and concerns, and get solutions to your FA problems! The ISTFA Exposition is your once-a-year chance to see many of the leading suppliers in one place.

ISTFA is the best venue for learning new failure analysis techniques, challenges and directions. It also provides ample opportunities for you to participate and network through the question-and-answer periods, the user groups, the panel discussions, the exhibition, and the luncheon and poster session.

Register by September 18 – Save up to $200. Additional information is on the ISTFA web site:

www.ISTFA.org

Discounted fees for EDFAS and ASM Members. Non-members of EDFAS receive a full year’s membership with their registration.

To exhibit at ISTFA, please contact Kelly Thomas at [email protected]

EDFAS General Membership Meeting Wednesday, November 18

The Electronic Device Failure Analysis Society (EDFAS) annual General Membership Meeting & Luncheon is open to all current members, as well as interested prospective members.

35th International Symposium for Testing and Failure Analysis

November 15-19, 2009 San Jose Convention Center

http://www.ISTFA.org/



The CMOS Emerging Technologies Workshop is a research and business event for those who want to discuss and discover new and exciting high tech opportunities. The format of the talks resembles in-depth tutorials describing state-of-the-art technology and future research directions rather than presenting specific research results or commercial products. The 6th annual workshop will be held downtown Vancouver with numerous opportunities for personal exploration of surrounding tourist attractions.

No formal proceedings will be printed but attendees will receive PDF copies of all presentation material. Selected and expanded workshop papers are edited as books with a number of the titles already published or in preparation – see the website. The EOS/ESD Symposium features research, technology, and solutions to increase understanding, enhance quality and reliability, reduce and control costs, and improve yields and productivity. You’ll find technical papers that emphasize the latest research and technology; basic, intermediate, and advanced tutorials; exhibits of ESD control products and services; workshops; authors' corners; and more. 15 Technical Sessions, including: ● Component Testing ● Factory/Materials ● System Level Testing ● On-Chip Protection ● Numerical Simulation, Modeling, Reliability ● Extremely Sensitive Devices, MR-Heads, MEMS ● On-Chip ESD Failure Case Studies ● Academia Invited Papers 10 Workshops, including: ● Controlling ESD in Modern Cleanroom Manufacturing Environments ● Requirements and EDA Tools for ESD Design Verification ● ESD Control and Design for Extremely Sensitive Devices ● CDM Requirements From IC Design Challenges and Production Control Methods Technically co-sponsored by the IEEE Electron Devices Society.

Plenary Session Talks: Prof. John Rogers, UI-UC, Stretchable Si CMOS: From Electronic Eyeball Cameras to Conformal Brain Monitors

Roberto Saracco, Senior Director, Telecom Italia Future Center, Emerging Applications and Telecom Business Trends Sessions: (see full Program on website) - Communications - Biomedical Circuits - Biomedical Engineering - Wireless - Nanotechnology/Nanoelectronics - Microsystems - RF Circuits - Mixed-Signal - I/O Circuits - Converter Circuits - Optical/Medical Imaging - Photonics - VLSI - SOC - Radiation Detectors/Imagers - Circuits for Radiation - Silicon Technology - Programmable Devices - EDA Design Tools - Business Development Registration is now open! Plan to attend …

www.CMOSet.com*

27 Tutorials: ● ESD On-Chip Protection in Advanced Technologies● ESD Basics for the Program Manager ● ESD Protection and I/O Design ● How-To's of In-Plant ESD Survey and Evaluation Measurements ● Ionization and Answers for the Program Manager ● On-Chip ESD Protection in RF Technologies ● Latch-up Physics and Design ● Cleanroom Considerations for the Program Manager ● Troubleshooting On-Chip ESD Failures ● SPICE-Based ESD Protection Design ● Impact of Technology Scaling on ESD High Current Phenomena ● EOS/ESD Failure Models and Mechanisms ● Packaging Principles for the Program Manager ● Automated Handling and Processes ● Advanced ESD/EMI/EOS Auditing Techniques ● Perfect ESD Storm ● Charged Device Model Phenomena and Design and 10 more!

Plenary Session: Emerging Trends of Medical Devices and Opportunities for Semiconductor Chip Technology

NEW: Lowered Hotel Rates, more benefits! Download the Advance Program:

www.esda.org/symposia.html

2009 Vancouver Workshop

CMOS Emerging Technologies Workshop Theme: Research & Business Opportunities Ahead

September 23-25, 2009 Vancouver, BC, Canada

31st Annual EOS/ESD Symposium & Exhibits

The International Technical Forum on Electrical Overstress and Electrostatic Discharge

August 30-September 4, 2009 Disneyland Hotel, Anaheim

http://cmoset.com/2009_Vancouver_Workshop.html

http://www.esda.org/symposia.html


"Virtual Tour" of the National Ignition Facility

Speaker: Dr. Jeff Wisoff, National Ignition Facility,

Lawrence Livermore National Laboratory Time: Networking/Pizza Social at 6:00 PM,

Presentation at 7:00 PM Cost: none Place: National Semiconductor Building E

Auditorium, 2900 Semiconductor Drive, Santa Clara

RSVP: via the website, for food quantity Web: www.ewh.ieee.org/r6/scv/leos

Dr. Peter J.K. "Jeff" Wisoff is the Deputy

Principal Associate Director in the NIF & Photon Science Directorate at Lawrence Livermore National Laboratory. A former NASA astronaut and veteran of four Space Shuttle flights, Jeff completed his BS in physics from UVa in '80 and MS/PhD in applied physics from Stanford in '82 and '86 respectively. He came to LLNL and NIF in the fall of 2001 as a deputy associate project manager for systems engineering. In 2003, he became the associate project manager for small optical systems on NIF, which included responsibility for the front end of the laser and laser diagnostics. Jeff currently serves as the principal deputy in the management of the NIF and Photon Science Directorate.

The National Ignition Facility (NIF), the world's largest and highest-energy laser system, is now fully operational at Lawrence Livermore National Laboratory (LLNL). NIF is now being prepared to begin ignition experiments with the goal of demonstrating laser-driven inertial confinement fusion ignition and fusion energy gain in the laboratory for the first time. This presentation will feature photos and videos showing the interior of NIF and descriptions of how NIF works and its important missions in national security, energy security and basic science.

TUESDAY September 1, 2009

SCV Photonics


Fundamentals of EMI Prevention Speaker: Chris Herrick, EMI Application Engineer,

ANSYS, Inc. Time: Networking & Social at 5:30 PM,

Presentation at 6:30 PM Cost: none Place: Applied Materials Bowers Cafeteria, 3090

Bowers Ave., Santa Clara RSVP: not required Web: www.ewh.ieee.org/r6/scv/emc

Chris Herrick received his BSEE from Tufts University near Boston Massachusetts. His first work experience came as an intern for Digital Equipment Corporation over the summers while an undergrad. He worked in the Signal Integrity team and performed board and system level analysis. Chris then went on to receive his MSEE from Stanford University in Palo Alto. His focus was on Communication systems. While attending school, Chris worked at Hewlett-Packard in the Signal Integrity team for server development. Post graduation, he worked for Sanmina-SCI performing SI analysis, writing white-papers and developing via-technology patents. He joined Ansoft Corporation in 2004 and is currently a Technical Lead in the San Jose area. Since joining Ansoft, Chris has become the resident expert on practical EMI simulations and has organized two technical seminars on EMC.

EMI continues to be a challenging problem for high

speed electronics but preventing it is no longer the Black Magic of years past. Proper Signal and Power Integrity are crucial to first-pass chamber success. This presentation will provide an introduction to EMC and the root causes of EMI related to Package and PCB design. Capacitor placement, plane impedance, current return path and common mode conversion will be discussed. Various simulation and measurement results from real world designs will be shown.


SCV Elecromagnetic Compatibility


Nanomaterials for Energy Applications

Speaker: Prof. Nobby Kobayashi, UC Santa Cruz Time: Networking & pizza at 6:00 PM,

Presentation at 6:15 PM Cost: none Place: National Semiconductor, Building E1,

Conference Center, 2900 Semiconductor Drive, Santa Clara

RSVP: not required Web: www.ewh.ieee.org/r6/scv/eds

Nobuhiko P. Kobayashi is a professor at the University of California Santa Cruz (UCSC). Current research projects include synthesis and characterization of nanometer-scale materials and devices with emphasis on solid-state energy conversion (sponsored by Defense Advanced Research Program Agency and Office of Naval Research) and future computing systems (sponsored by Hewlett-Packard Laboratories and NASA). Prior to joining UCSC, Prof. Kobayashi was involved in developing electronic materials at Hewlett-Packard Laboratories for ultra-high density electrical switches to build memories and logic required for future computing systems. He was also involved in semiconductor nanowire photonics for optical interconnect necessary for advanced computing systems. He worked at Lawrence Livermore National Laboratory, developing semiconductor materials for both ultra-high speed diagnosis systems for the National Ignition Facility funded by the U.S. Department of Energy and the optical code division multiple access (optical-CDMA) funded by the Defense Advanced Research Project Agency. From 1999 to 2001, Prof. Kobayashi was at Agilent Laboratories, developing light emitting diodes, vertical cavity surface emitting lasers, and ultra-wide band fiber-optics and wireless communications. Prof. Kobayashi earned his M.S. and Ph.D. degrees in materials science from University of Southern California in 1994 and 1998. Prof. Kobayashi has published over 100 journal and conference papers including more than 15 invited talks and papers and contributed to 4 book chapters. Prof. Kobayashi is currently serving on various program committee members/conference chairs/co-chairs including SPIE International Symposium on Defense, Security and Sensing 2009, SPIE Optics and Photonics/Nanoscience and Engineering, WCECS ICCE 2009, and ICCCAS/Memristors and Memristive Systems 2009 as well as a proposal reviewer of the U.S. Department of Energy

Development of next-generation energy resources

that are reliable and economically/environmentally acceptable is a key to harnessing and providing the resources essential for the life of mankind. Our research focuses on the development of novel semiconductor platforms that would significantly benefit energy harvesting, in particular, from light and heat. In these critical application fields, traditional semiconductor solid-state devices, such as photovoltaic (PV) and thermoelectric (TE) devices based on a stack of single-crystal semiconductor thin films or single-crystal bulk semiconductor have several drawbacks – for instance; scalability-limits when ultra-large-scale implementation is envisioned for PV devices, and performance-limits for TE devices in which the interplay of both electronic and phonon systems is important. In our research, various types of nanometer-scale semiconductor structures (e.g., nanowires and nanoparticles) coupled to or embedded within a micrometer-scale semiconductor structure (i.e., semiconductor nano-micrometer hybrid platforms) are explored to build a variety of non-conventional PV and TE devices. Two core projects are to develop semiconductor nano-micrometer hybrid platforms based on (1) semiconductor nanowires electrically connected to an array of micrometer-scale semiconductor pillars or thin films and (2) metallic nanoparticles embedded within a micrometer-scale semiconductor thick film. The semiconductor nano-micrometer hybrid platforms are studied within the context of their basic electronic, optical, and thermal properties, and their dependence on chemical interactions with the environment, which will be further assessed and validated by comparison with theoretical approaches to draw comprehensive pictures of physicochemical properties of these semiconductor platforms.

TUESDAY September 8, 2009SCV Electron Devices


Molecular Modification of PCB Substrates for Fine Line

Patterning Speaker: Werner Kuhr, Ph.D., VP-Research,

ZettaCore, Inc., Englewood, CO Time: Optional dinner at 6:30 PM; Presentation at

7:30 PM Cost: $25 if reserved by Sept 7; $30 at door (no

cost for presentation) Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy

101 at Montague Expressway), Santa Clara RSVP: via the DoubleKnot registration page, from

website Web: www.cpmt.org/scv

Werner G. Kuhr is currently Founder and Vice President of Research, ZettaCore, Inc. which supplies molecular electronic solutions to the semiconductor and microelectronics market. Previously, he was a professor of chemistry at the University of California, Riverside, where his research was focused on the development of nano-scale techniques for the design and characterization of electrochemical devices. Professor Kuhr has published over 100 scientific papers, delivered over 100 invited lectures at conferences and universities across the world, and been issued twenty-eight U.S. and international patents. He earned B.S. and M.S. degrees in Chemistry from Stevens Institute of Technology (1980-82) and earned his Ph.D. in Chemistry from Indiana University (1986). He is currently serving on the board of advisors of the College of Natural and Agricultural Sciences, University of California, Riverside. He has been the recipient of a number of awards including a Presidential Young Investigator Award from the National Science Foundation (1989); a Young Investigator Award from the Society of Electroanalytical Chemistry (1993) and the Jubilee Silver Medal from the Chromatographic Society, England (1994).

ZettaCore® has developed a new Molecular

Interface™ technology, where a molecular adhesion layer is created for smooth epoxy substrates to allow the electroless deposition and electroplating of copper onto unroughened epoxy surfaces. Molecules are attached to smooth PCB substrates via a thermally-induced reaction of the molecular species with the substrate surface, after which the high affinity of the molecule-modified surface for metal ions facilitates electroless plating of the copper, which is then used as a seed layer to electroplate larger quantities of copper utilizing conventional processes. This process allowed the fabrication of PCB substrates with fine line patterning of the metal layers (e.g., 20/20, 18/18, 14/14, 12/12 microns and 8/8 microns) using only a slight modification of standard lithographic processes using the semi-additive patterning process. Good stability to HAST and other accelerated stress tests were obtained on all of these structures, indicating that treatment with the molecular adhesion process significantly improved the ability to pattern copper lines at fine line spacing. Similar results were obtained using an analogous process for the lamination of epoxy prepreg onto smooth copper surfaces.

WEDNESDAY September 9, 2009

SCV Components, Packaging and Manufacturing Technology

Patent Agent Jay Chesavage, PE

MSEE Stanford 3833 Middlefield Road, Palo Alto 94303

[email protected]

www.File-EE-Patents.com

TEL: 650-619-5270 FAX: 650-494-3835


The Internet as an Information and Communications Utility:

It's Getting Personal Speaker: Dr. Wei-Min Lu, CTO, Anchora Time: Presentation at 6:00 PM Cost: none Place: National Semiconductor, Building E,

Conference Room, 2900 Semiconductor Dr, Santa Clara

RSVP: not required Web: www.ewh.ieee.org/r6/scv/comsoc

Wei-Min Lu is currently the CTO of Anchora, a

provider of personalized information discovery and management services. As an expert in information storage and retrieval, machine learning, information security, Internet, and decision and control, he has extensive experience in developing complete solutions to meet market and industry needs; He served in key engineering and management positions at IBM, Hitachi, Tesaria, and NASA-JPL. He was the president of IEEE ComSoc – SCV from 2002 to 2004. He received the Ph.D. (EE/Math) from CalTech and B.Sc. from Tsinghua University, China.

The convergence of personal computers and

networking has made the internet a ubiquitous and permanent infrastructure. People regard the Internet as an information and communications utility that is as important as telephone and electricity services. One ideal for the personal information utility is that we always have the right information in the right place, in the right form, and of sufficient completeness and quality to meet our current need. However, as the information is proliferating on the Internet at an unprecedented rate, people are overwhelmed by the vast amount of information available to them. There is no easy and guaranteed access to the most personally-relevant information for individual Internet users. The Internet is far from reaching its potential to deliver the benefit as an information and communication utility to individual users. We have witnessed a lot of effort on improving the accessibility of quality information on the Internet for the last 10 years. A wide range of tools and technologies are now available for the management of personal information of different types. But this diversity has become part of the problem leading to other problems such as information fragmentation. In this talk, we will first examine the requirements for personalized information discovery and management. Then, we will review the recent development of technologies and solutions on information discovery and management; we will focus on examining the advantages and limitations of different solutions, such as web search engines and social information discovery and aggregation. We will then introduce some alternatives to address the existing scalability and personalization issues in information discovery and management. In particular, we will examine what are the basic technological requirements for turning the Internet into a real personal information and communications utility for each individual user


SCV Communications

• 20 Years of Experience • Fortune 500 Companies • Microsoft .Net, C#, C++, Java, … • Software, Firmware, Middleware, Web Applications • SCM, QA, and much more Experience/Expert ise

www.esw.com [email protected] (408) 328-9240


Sensing EEG Signals in Consumer Devices: Introducing

the Brain to Main Street Speaker: Dr. Thomas Sullivan, NeuroSky Inc. Time: Refreshments at 6:00 PM, Presentation at

6:30 PM Cost: none Place: Board Room, Cogswell College, 1175

Bordeaux Dr, Sunnyvale RSVP: by email to [email protected] or 408-201-

1976 Web: ewh.ieee.org/r6/scv/ims

Thomas Sullivan, PhD. is currently the Director of

Technology Development at NeuroSky, Inc. a company that produces biosensor technologies, and the industry leader in Consumer, Brain to Computer Interface systems. Dr. Sullivan has led the research and development department in the inception and production of the ThinkGear dry-electrode EEG systems, currently being employed by NeuroSky's industry leading partners. Prior to his tenure at NeuroSky, Dr. Sullivan practiced for several years as an analog circuit designer at Burr-Brown Corporation. Dr. Sullivan holds a Ph.D. in Electrical Engineering and Cognitive Science from University of California, San Diego.

Electroencephalography (EEG) is the measurement of voltages on the scalp caused by activity within the brain that is commonly applied to treatment and assessment in traditional medical fields. In this presentation, the characteristics of the EEG signals will be introduced, along with the challenges of accurately measuring these signals - issues such as circuit noise, offsets, and impedances, etc. Also included will be the additional challenges associated with sensing these signals in a consumer device as well as the potential consumer EEG technologies application to mass market.


SCV Instrumentation and Measurement


Sub-Harmonically Pumped Mixer Circuit Designs

Speaker: Bert Henderson, Cobham Sensor Systems Time: Refreshments and Social at 6:00;

Presentation at 6:30 PM Cost: none Place: Agilent Technologies, Main-building,

Aristotle Room, 5301 Stevens Creek Blvd, Santa Clara

RSVP: not required Web: www.ewh.ieee.org/r6/scv/mtt

Bert Henderson is a Distinguished Fellow of Technology with Cobham Sensor Systems in San Jose, working on microwave and millimeter-wave multifunction subassemblies. He received the BSEE from UC Davis in 1978, and MSEE from UC Berkeley in 1979. Bert has been in various design and management positions, and is responsible for the design of numerous mixer products. He has written numerous technical articles; has six patents for mixers and filters; and in 2007 he was a recipient of the Tyco Electronics Key Innovator Award.

Sub-harmonically pumped (SHP) mixers are important contributors to solving critical frequency conversion problems in systems. The most prevalent device technologies use Schottky anti-parallel diode pair (APDP), and FET or BJT.devices. SHP mixers excel in applications requiring low LO leakage power, low cost LO sources, or operate at very high frequencies. This presentation covers fundamental limits and the design process, and surveys numerous published diode and FET SHP examples.

THURSDAY September 10, 2009 SCV Microwave Theory and Techniques


Challenges Impeding the Application of

Unmanned Air Systems (UAS) Speaker: Chad Partridge, President, Sensing

Systems, Inc. Time: Presentation at 7:00 PM Cost: none Place: Carnegie Mellon University - Silicon Valley,

Room 118 (West wing), Moffett Field RSVP: not required Web: www.ewh.ieee.org/r6/scv/ras

Chad Partridge is President, Sensing Systems, Inc. (Sensing), and on the Board of Directors for the Association of Unmanned Vehicle Systems International (AUVSI). As President of Sensing, Mr. Partridge manages sales, marketing, and finance while also maintaining roles in product strategy and development. In addition, he has been instrumental as an architect of the Tungsten Media Toolkit, a software development kit for media management and exploitation. Mr Partridge has an extensive background in software/hardware design, machine vision, sensing, automation, robotics, and control and has worked on various projects involving the development of complex autonomous systems.

Mr. Partridge holds an degree in Electrical Engineering from Stanford University, a Master of Science Degree in Electrical Engineering from the University of Illinois, and a Bachelor of Science Degree in Computer Engineering from the University of Michigan. He has published in both the Journal of Robotics Research and the Journal of Robotics Systems.

As public awareness and, in turn, demand of Unmanned Air Systems (UAS) is increasing, regulatory challenges are limiting applications and leaving would-be suppliers and users at a competitive disadvantage. Chad Partridge presents on UAS applications, regulatory aspects impeding their use, and what might be done by those that could benefit from UAS services.

THURSDAY September 10, 2009

SCV Robotics and Automation


Monitoring Video Quality Inside a Network

Speaker: Dr. Amy Reibman, AT&T Labs (SPS

Distinguished Lecturer) Time: Fast Food & drinks at 6:30 PM;

Presentation at 7:00 PM Cost: $2 donation recommended Place: National Semiconductor, Building E,


RSVP: not required Web: www.ewh.ieee.org/r6/scv/sps

Amy R. Reibman is a Distinguished Lecturer in the IEEE Signal Processing Society. She received the B.S., M.S. and Ph.D. degrees in electrical engineering from Duke University in 1983, 1984, and 1987, respectively. From 1988 to 1991, she was an assistant professor in the Department of Electrical Engineering at Princeton University. In 1991 she joined AT&T Bell Laboratories, and became a Distinguished Member of Technical Staff in 1995. She is currently a Lead Member of Technical Staff in the Communication Sciences and Artificial Intelligence Research Department at AT&T Laboratories.

Dr. Reibman was elected IEEE Fellow in 2005, for her contributions to video transport over networks. In 1998, she won the IEEE Communications Society Leonard G. Abraham Prize Paper Award. She was the Technical co-chair of the IEEE International Conference on Image Processing in 2002; the Technical Co-chair for the First IEEE Workshop on Multimedia Signal Processing in 1997; the Technical Chair for the Sixth International Workshop on Packet Video in 1994.

Dr. Reibman's research interests include video compression systems for transport over packet and wireless networks, video quality metrics, superresolution image and video enhancement, and 3-D and multiview video.

As broadband access connectivity becomes more

prevalent, more users are streaming video over the Internet, or watching video that has been transmitted over a network. However, the best-effort service model and shared infrastructure of most networks means that network impairments (such as delays, jitter, congestion, and loss) may affect viewing experiences. Network service providers are increasingly interested in measuring the quality of the video that is provided on their network. This can aid in monitoring compliance of service-level agreements (SLAs) between Internet Service Providers (ISPs), hosting centers, and content providers; alert operators to potential performance problems; and help in root-cause analysis and debugging.

We consider the problem of evaluating the quality of transported, compressed video from the perspective of a network service provider. Traditional video quality metrics require original and decoded pixels to be available. However, neither are easily available inside the network. Therefore, we have developed no-reference techniques that estimate visual quality, relying only on (potentially lossy) bitstreams available inside the network.

In this talk, we present an overview of the problem with measuring video quality in the network and present two quality metrics: one for broadcast MPEG-2 video and the other for streaming video over the Internet.


SCV Signal Processing


A Model for Noise Power versus Density in a Perpendicular Digital

Magnetic Recording System Speaker: H. Neal Bertram, Western Digital Time: Pizza and cookies at 7:00 PM; Presentation

at 7:30 PM Cost: none Place: Western Digital, 1710 Automation Parkway,

San Jose RSVP: not required Web: www.ewh.ieee.org/r6/scv/mag

Dr. Neal Bertram received his B.A. from Reed

College in Portland, OR in 1963 and his Ph.D. at Harvard University in Cambridge, MA in 1968. From 1968 to 1985 he was employed by the Ampex Corporation in Redwood City, where he worked on fundamental problems in magnetic tape recording. In 1985 he joined the University of California at San Diego as an Endowed Chair Professor in the Electrical Engineering and Computer Sciences Department associated with the (then) newly created Center for Magnetic Recording Research. At UCSD, Dr. Bertram directed a research program in the physics of magnetic recording, including studies of polycrystalline thin film media, magnetoresistive heads, and fine particle tape systems. In addition he has created graduate courses in magnetic recording theory, analysis of recording materials, and magnetic recording measurements.

In Dec. 2005 he became an emeritus professor and moved to Northern California. From 2005-2009 Dr. Bertram worked part time for the Hitachi Corporation and visited CMRR monthly. Currently he is employed by Western Digital part time. At WD Professor Bertram evaluates signal, noise, thermal effects and BER.

In 1986, Dr. Bertram was a IEEE Distinguished Lecturer, and in 1987 he was named an IEEE Fellow. He has published a book entitled "Theory of Magnetic Recording”. In 1999 he received the annual technical achievement award from INSIC (International Storage Industry Consortium). In 2003 Dr. Bertram won the IEEE Reynolds B. Johnson Information Storage Award. Dr. Bertram was cited for "fundamental and pioneering contributions to magnetic recording physics research."

Noise power versus linear density in a

perpendicular recording system exhibits an unusual behavior. At the lowest densities the noise initially increases linearly with density. At a medium density, given by the transition parameter, the curves approximately level until about twice the initial curvature point. Above that secondary point the noise power then increases and eventually levels.

In this talk a simple explanation for this behavior is presented. The key phenomenon is the trade-off of DC-AC noise versus transition noise levels. At low densities the transition noise dominates and yields the linear increase with density. At the first critical density where the noise flattens the transition noise begins to decrease and the DC noise increases, becoming AC erasure noise. The net leveling is the

sum of these two effects. At the second critical density the transition noise has vanished and the further increase is dominated by the high density AC erased noise. This theory will be published by H.N. Bertram and M. E. Schabes, in IEEE Transactions on Magetics, Aug 2009.


SCV Magnetics


Medical Devices: Marketing Your Skills and Ideas

Speaker: Dennis F. Falkenstein, Medical Device

Consulting Time: 7:00 PM Cost: none Place: KeyPoint Credit Union, 2805 Bowers Ave.,

Santa Clara RSVP: not required Web: www.CaliforniaConsultants.org

CNSV member Dennis Falkenstein has been in the

medical device/software field for 35 years. He has been involved at various levels of marketing emerging medical technologies.

Graduating from the University of Wisconsin with a BSEE and MBA, Dennis went on to work for industry leaders large and small including Marquette Electronics, Searle Radiographics and Siemens Healthcare. After a short stint in design, he was attracted to the customer relations and requirements end of the business.

Dennis progressed from sales to sales management, and ultimately to Vice President of Sales and Marketing. The success of several products in diagnostic imaging, networking and patient treatment were attributable to his teams. Dennis' current business is Medical Device Consulting, through which he works for large and small companies in the U.S., Europe and Asia.

Engineers can develop very interesting and unique ideas to feed innovations into the healthcare industry. Technology is providing many answers to patient care, treatment and monitoring, but many of these promising ideas never reach the market. This is not because they lack great promise, but instead they were never introduced properly. This can be very frustrating to engineers at start-ups and even large companies since many companies lack effective marketing and sales skills.

This talk will explore many of the aspects that need to be considered in the success of marketing any product, especially in the medical device arena. The information is meant to be an overview of considerations that are needed in the development of a successful product launch.

Some of the topics to be covered are; * Target Market * Competing technologies and companies * Possible component for a larger company * Target pricing: cost vs. value-added * Sales channels: direct vs. distributor * Regulatory considerations: FDA, HIPAA, SOX * Increasing Patient Outcomes * How does the customer pay for the device?

Reimbursement/CMS * CRM: What is it? * Service and maintenance issues

If you are consulting directly with engineers or with

management in the medical field, you will increase your value by understanding a few of these principles. There are design requirements that directly tie to the success of the product within the industry. These requirements are not always apparent to the engineer, and in fact they may not have been well thought out when drafting the requirements specifications. Your clients will welcome your understanding of certain marketing issues no matter what your specialty is.


SCV Consultants' Network of Silicon Valley


Silicon Inkjet-Printed High-Efficiency Solar Cells

Speaker: Homer Antoniadis, CTO, Innovalight, Inc. Time: Registration & light lunch 11:30 AM;

Presentation at 12:00 PM Noon Cost: IEEE Members and Students $5, Non-

Members $10 Place: National Semiconductor Bldg E-1 CMA

Room. 2900 Semiconductor Drive, Santa Clara

RSVP: through the website Web: www.ieee.org/nano

Dr. Homer Antoniadis brings a rich background

of technical and engineering leadership in photovoltaics and other large area optoelectronic applications to Innovalight. His 15-year career spans Osram Opto Semiconductors, Hewlett-Packard Labs, Agilent Technologies and Xerox, and he is widely recognized as a regular invited lecturer and conference chair at leading industry events. At Osram he led the product development efforts from R&D through production for a variety of OLED displays. He also brings valuable knowledge and experience in the area of high-throughput, low-cost, printable electronic technologies.

Dr. Antoniadis has more than 50 publications in photovoltaics, OLEDs, polymer materials and amorphous silicon and has 17 issued US patents. He has a PhD and MS in Physics from Syracuse University and a BS in Physics from Ioannina University, Greece.

We have developed methods for making high

efficiency Cz-Si wafer-based solar cells using Innovalight's proprietary Silicon Ink technology. Our approach uses n-type Silicon Ink, a phosphorous doped silicon nanoparticle colloidal dispersion and industrial ink-jet printing systems, to form high efficiency emitters on p-type silicon wafer absorbers. The cell fabrication approach utilizes the same tools and materials used in a standard screen printed solar cell manufacturing line with only one additional tool, a printing system, which is used to deposit and dry the n-type Silicon Ink. This simple process improves the efficiency of standard screen printed solar cells by more than 1% absolute with minimal impact on manufacturing cost.

TUESDAY September 15, 2009 SCV Nanotechnology


Medium Voltage VFD Technology Speaker: Art Kerchner, MV Products, Rockwell

Automation Time: Light dinner and presentation at 6:00 PM Cost: none Place: Rockwell Automation, 3000 Executive

Parkway, Suite 210, San Ramon RSVP: by email to [email protected] Web: www.oebpes.org

Art Kerchner is an expert at the application of variable speed drives. For 25 years he, has held positions in Rockwell Automation’s variable speed drives business. He has been responsible for the sales, marketing, training, and technical support of the Allen-Bradley brand of variable frequency drives and motors. Currently, Art is a Senior Industry Specialist – MV Products. He is charged with business development for application of MV drives in the Water and Wastewater markets. He works with municipalities, specifying engineers, rotating equipment OEM’s, electrical, mechanical and general contractors on water delivery systems utilizing medium voltage motor control.

Medium Voltage VFD’s have been applied to wide variety of applications over the last 40 years. As the drives become more popular in commercial and industrial use, manufacturers have developed and built their succeeding generations of drives with the goals of delivering more value to the user by making them smaller, cheaper, friendlier, and more reliable. We will examine the various topologies offered. A discussion of low voltage vs. medium voltage can follow, if time allows.


OEB Power & Energy

September 2009 V is i t us a t w w w . e - G R I D . n e t Page 28

Outdoor Paintballing at Los Gatos Pursuit

Info: No paintballing experience needed, level will

be introductory. Arrive at 10AM for safety briefing.

Time: 10:00 AM - 1:30 PM Cost: $40 for IEEE members, $45 for nonmembers

(includes gun, helmet, ammo, pizza lunch) Place: Los Gatos Persuit, Bear Creek Rd and

Skyline Blvd, Los Gatos RSVP: through website Web: www.ewh.ieee.org/r6/scv/gold

Gary Sasaki, President of DIGDIA, has been covering digital media and entertainment industries for over a dozen years. He is a market analyst and strategic consultant with customers that include multinational corporations and startups.

Come Paintballing with IEEE GOLD, students and other chapters at LosGatosPursuit on Saturday 9/19! Meet GOLD (Graduates Of Last Decade) members, student and regular IEEE members from throughout the SF Bay Area

You don't need to be an IEEE member; nonmembers very welcome. Invite your friends/classmates/coworkers!

Transport/carpooling: people are encouraged to provide carpooling details when signing up (have ride/need ride...). We will try to pair off suitable people and swap your details, beyond that it's up to you. Details: - min age 18. No paintballing experience needed,

level will be introductory. Arrive on time at 10am for safety briefing.

- They provide the guns, helmet and ammo (500 paintballs for 3 hrs). Try not to use all your ammo, else you have to pay $$ for more. They also have very experienced helpful referees to keep everything civilized.

- You need to bring proper clothing: long-sleeve teeshirt/sweater, sweatpants, footwear. Cap recommended.

- Bring a change of clothes and plan to change after (LGP doesn't have changing rooms, only PortaPotties). Paintballs are fully washable. Seat covering for your car and a towel are recommended.

- Bring sunblock and drinking water. - deadline for signup is Thu 9/17 at 6pm (but we

expect to sell out way earlier). No refunds after 9/17.

- Pizza Lunch: provided at 1pm (included in price)

SATURDAY September 19, 2009 SCV Grads of the Last Decade (GOLD)


Low-Voltage Oversampling Analog-to-Digital Conversion

Speaker: Dr. Bruce A. Wooley, EE Deptartment,

Stanford University Time: Networking/Pizza at 6:30 PM, Presentation

at 7:00 PM Cost: $2 donation for food Place: National Semiconductor, Building E,


RSVP: not required Web: ewh.ieee.org/r6/scv/cas

Bruce A. Wooley is the Robert L. and Audrey S.

Hancock Professor of Engineering at Stanford University. He received the B.S., M.S. and Ph.D. degrees in Electrical Engineering from the University of California, Berkeley in 1966, 1968 and 1970, respectively. From 1970 to 1984 he was a member of the research staff at Bell Laboratories in Holmdel, NJ, and he joined the faculty at Stanford in 1984. At Stanford he has served as the Chair of the Department of Electrical Engineering, the Senior Associate Dean of Engineering and the Director of the Integrated Circuits Laboratory. His research is in the field of integrated circuit design, where his interests include low-power mixed-signal circuit design, oversampling A/D and D/A conversion, circuit design techniques for video and image data acquisition, high-speed embedded memory, noise in mixed-signal integrated circuits, and circuits for wireless and wireline communications.

Prof. Wooley is a Fellow of the IEEE and a past President of the IEEE Solid-State Circuits Society. He has served as the Editor of the IEEE Journal of Solid-State Circuits and as the Chairman of both the International Solid-State Circuits Conference (ISSCC) and the Symposium on VLSI Circuits. Among the awards he has received are the University Medal from the University of California, Berkeley, the IEEE Journal of Solid-State Circuits Best Paper Award, recognition for his Outstanding Contributions to the Technical Papers of the International Solid-State Circuits Conference, the IEEE Third Millennium Medal, the Outstanding Alumnus Award from the EECS Department at the University of California, Berkeley, and the IEEE Solid-State Circuits Technical Field Award.

Through the exchange of resolution in time for that

in amplitude, oversampling methods are now widely used to enable the realization of high-resolution analog-to-digital converters in scaled CMOS VLSI technologies. So-called oversampling modulators combine coarse quantization at sampling rates well above the Nyquist rate with feedback and subsequent digital signal processing to avoid the need for precision analog circuits. Such modulators were originally conceived in the mid-twentieth century in the form of delta modulators, which digitize the rate of change of a signal, rather than the signal itself. However, noise-shaping modulators that directly encode the signal proved to be a more robust approach and have subsequently come into widespread use. In particular, cascades of inherently stable sigma-delta (or, equivalently, delta-sigma) modulators are an efficient means of extending the dynamic range of oversampling converters that are largely immune to both analog circuit imperfections and fundamental stability concerns. This presentation begins with an overview of both architectural and circuit issues associated with the design of noise-shaping modulators, and then presents examples of some approaches to their implementation under increasingly severe constraints on power dissipation and supply voltage.

MONDAY September 21, 2009

SCV Communications with Circuits and Systems


Introduction to Palm webOS: Building Applications

for the Mobile Web Speaker: Mitch Allen, VP and Software CTO, Palm Time: Pizza and drinks at 6:30 PM, Presentation at

7:00 PM Cost: IEEE members $5, non-members $10,

students free Place: Oak Room, Hewlett Packard, 19447

Pruneridge Avenue, Cupertino RSVP: not required Web: www.ewh.ieee.org/r6/scv/ce

Mitch Allen is VP and

Software CTO at Palm Inc. He led the webOS engineering team through the early design stages, and more recently, the SDK and developer tools program. His current focus is with ‘smart’ applications and how they will transform mobile computing. O'Reilly Media will be publishing a book about developing for Palm's new mobile platform, written by Mitch and the webOS development team. The book -- titled Palm webOS: The Insider’s Guide to Developing Applications in JavaScript, using the Palm Mojoˇ Framework -- is the first official resource for programming with webOS.

A preview of the Palm Pre is available at: www.palm.com/us/products/phones/pre/index.html#video

It would be hard to miss the sweeping changes

going on with mobile application development. The convergence of mobile phones and the web is driving the next generation of application as mobile web applications, and it seems that we are seeing breakthroughs almost every day.

But enabling this is a far greater challenge than simply providing a fast, fully featured web browser on a phone. The basic mobile usage model demands an event-driven, multi-tasking model for application execution, and a new UI paradigm to replace that of the conventional web browser. And where once the client operating system would provide a complete, closed platform that application developers relied on for their applications, the Web itself is emerging as a significant part of the platform. Client operating systems have a critical role in facilitating access to the web platform, while providing the expected tight integration with device hardware and a great user experience.

This year, Palm introduced its next generation operating system, Palm® webOS™ and more recently released the webOS SDK to developers. Palm webOS is based upon an innovative design that integrates a window-based modern operating system with a web technology runtime that allows developers to build applications using common web languages and tools, without the restriction of working within a web browser. The application model is based on an integrated web runtime and the Mojo framework, a JavaScript framework with powerful UI services, local storage, and methods to access application, cloud, and system services.

The webOS application model retains the strengths of web development, but with the type of access and power that has typically been associated with native, embedded applications. Applications are built using JavaScript, HTML and CSS, and while similar to web applications, webOS applications are actually native applications. This application model allows developers to use the same languages and tools to build powerful mobile applications that they use to build conventional web content.

The new generation of applications is different from applications built before now, despite the common languages, tools and APIs. These new mobile applications can leverage data acquired through web services filtered by the mobile user’s personal data to inform the user of relevant events or information in a timely way -- ToDo lists that remind you to pick up milk on the way home or a calendar

TUESDAY September 22, 2009 SCV Consumer Electronics


app that not only reminds you of your trip to New York the next day, but that also that the weather is 40° colder and rainy, or an alarm clock that wakes you early because there is an accident on your route to work. This is just the beginning of the mobile web and the applications that will define it. Outline:

- Strategic context and vision – describe context both at Palm and within industry 2003-2006 when webOS was conceived and challenges that the team overcame. Vision for web-centric application models, web services and mashups; how this drives changes in the platform architecture and in applications themselves.

- Introduction to webOS – description and demo of webOS; review of software architecture, application model and APIs.

- Building webOS Applications – SDK, tools and APIs; description of development workflow and demo of a simple application and inspection of its structure and content; discussion of porting and comparison to web and native application development in other environments; review of development strategies for different types of applications.

- Synergy & Services – review of Synergy, and the range of Application, System and Web Services available to the application developer; the role of web services in the platform and how applications can take advantage of them.

- What’s Next? - a look at the potential of the model on application development; examination of the implications of the integration of web services in the platform and the potential for new and different usage


Surge Suppression: New UL 1449 3rd Edition Requirements

Speaker: Gary Fox PE, General Electric Company Time: Social and Networking at 5:30 PM,

Presentation at 6:00 PM, Dinner at 7:00 PM Cost: $25 (at the door), $10 for IEEE Student

Members Place: Sinbad's Restaurant, Pier 2 The

Embarcadero, San Francisco RSVP: by email to [email protected],

415.558.4591, for reservations and to qualify for the drawing

Web: www.ieee.org/sf-ias Gary H. Fox, PE, received his BSEE from

California Polytechnic State University, San Luis Obispo in 1978. He has been employed by General Electric Company for 31 years. His current assignment is a Senior Specification Engineer for GE Consumer & Industrial in Concord, providing application and technical support for power distribution/control equipment and lighting. Previous assignments included experience in field testing and maintenance of power equipment, project management, and power system analysis.

Mr. Fox is a Senior Member of the IEEE Industry Applications (IAS) and IEEE Power & Energy Societies and has been an active participant in the IEEE since 1989. He has authored several papers on protective relay application and surge protection. The IEEE officer positions he has held include Chair for the San Francisco Chapter, IAS; Chair, San Francisco Section; and Chair, San Francisco Bay Area Council. He was a recipient of the IEEE Third Millennium Medal. He has been a licensed Professional Engineer since 1982.

Requirements for a new safety standard for surge

protective devices (SPD) are almost upon us. UL 1449, 3rd edition was published in September of 2006. In order to maintain UL certification, all manufacturers are required to be in compliance no later than September of 2009. This 3rd edition of the standard not only encompasses all of the changes that were designated in the revisions to the 2nd edition in February of 2007, but also an even more stringent set of safety requirements. This presentation will review the major differences between UL 1449 2nd Edition and UL 1449 3rd Edition, including: Changes in terminology, ANSI status, Additional testing requirements, Additional ratings and markings

This presentation has been certified for continuing education credit (0.1 CEUs/1 PDH). Documentation will be recorded at GE Learning Central.


SF Industry Applications


Hazard Tracking System – Purpose, Design &

Implementation Speaker: Jon Derickson, Product Safety Manager,

BAE Systems Time: Optional dinner at 5:30 PM at El Torito;

Program at 7:00 PM at Applied Materials Cost: none, for meeting (no-host dinner) Place: Dinner at El Torito Mexican Restaurant,

2950 Lakeside Drive, Santa Clara; Meeting at Applied Materials, Bowers Café, 3090 Bowers Ave, Santa Clara

RSVP: not required Web: www.ewh.ieee.org/r6/scv/pses

Jon Derickson is Product Safety Manager at BAE

Systems, leading a team of engineers responsible for system safety of the Bradley Fighting Vehicle and other tracked and wheeled vehicle programs within the US Combat Systems Line of Business. His other responsibilities include identifying, assessing and/or developing product safety technologies, tools, techniques, and/or processes for implementation within BAE. Jon planned and executed system safety and design for environment programs for segments of the US Army’s Future Combat System (FCS). The FCS is a highly complex integration of advanced sensor technologies with a family of manned and unmanned vehicle systems. Specific concerns included an armed robotic vehicle and manned ground vehicles with a medical treatment platform planning to use remote surgery systems.

Jon has an MS in Computer Engineering from San Jose State University and a BS from Cal Poly. He has won several awards, including the Presidents Achievement Award from the International System Safety Society and an award from BAE Systems related to development of hazardous voltage safety policies, procedures and training. He is a member of the System Safety Society and the Society of Automotive Engineers, a PE in Safety and Certified Safety Professional.

Product safety standards are moving towards

using “Hazard Based Safety Engineering” principles, instead of prescriptive constructions. For that approach to be feasible, hazards and controls must be identified and tracked. In fact, requirements for a hazard database already exist in some military standards.

This presentation will describe a possible approach to designing and implementing a hazard tracking database. The need for clear and complete information that is readily available, and the expected use and outcomes of such a system, will be discussed.

If you already have put together a similar database for your organization or projects, you will want to see this systems-based approach to hazard tracking and risk evaluation. If you have not, it is even more important to attend.


SCV Product Safety Engineering

MET Laboratories

EMC – Product Safety

US & Canada

• Electromagnetic Compatibility • Product Safety Cert. • Environmental Simulation • Full TCB Services • Design Consultations • MIL-STD testing • NEBS (Verizon ITL & FOC) • Telecom • Wireless, RFID (BQTF & EPCglobal Test Lab)

Facilities in Union City and Santa Clara

www.metlabs.com [email protected] 510-489-6300


Embedded Passives: Methodologies and Opportunities

for Implementation Speaker: John Savic, Cisco Systems Time: Optional lunch at 11:45 AM; Presentation

at 12:15 PM Cost: $15 if reserved by Sept 21; $20 at door

(no cost for presentation) Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy

101 at Montague Expressway), Santa Clara

RSVP: via the DoubleKnot registration page, from website

Web: www.cpmt.org/scv

John Savic was with Motorola for 16 years working on developing enabling technologies that enhance the functionality of HDI-PWB's. He holds numerous patents on HDI circuit and Embedded Passives (EP) manufacturing processes and has overseen the implementation of EP technology into over 80 million cell phone products. Currently John is with Cisco Systems where he is responsible for the development and implementation of advanced substrate technologies for improving the performance of BGA packages for next generation ASIC applications.

Embedded Passives (EP) has evolved over the

last several years, demonstrating value as a versatile means for enhancing the functionality of the PWB by improving circuit performance, simplifying assembly processes and enabling product miniaturization. The value of EP technology has been demonstrated in numerous RF and logic circuit designs by incorporating thin film decoupling capacitors as well as Polymer Thick Film (PTF) resistors. The full potential of EP has yet to be realized due to a cacophony of industry offerings and much-displaced initial expectations. Success in implementation depends on selecting the appropriate application and diligent trade-off analysis during the design stage. This discussion will highlight some mainstream EP technologies and demonstrate the value that was realized through various product implementations.

THURSDAY September 24, 2009



The Knowledge Transfer Bottleneck

Speaker: Steve Bockman, founder, North Bay Agile

SIG Time: Guided Networking at 6:30 PM; Light dinner

at 7:15 PM; Presentation at 7:45 PM Cost: Light Dinner: $10 (IEEE member), $13 (non

member) - Cash or check at the door; add $3 without reservation

Place: Ramada Inn, 1217 Wildwood Ave (near Lawrence Expy and 101), Sunnyvale

RSVP: through the website Web: www.ieee-scv-tmc.org

Steve Bockman is an independent software developer and certified ScrumMaster who began his career in 1977 in a utility position, installing software packages for a manufacturer of business computers. Since then he has worked in the fields of speech recognition, terrain analysis, computer graphics, desktop publishing, industrial automation and web applications.

Steve's first exposure to anything Agile occurred in 2000, but his involvement began in earnest in 2005 while participating in the development of a client/server application where changing requirements were part of the ground rules. Steve was responsible for introducing many Agile principles and practices to the project, and has been an Agile coach and innovator since that project's inception.

As the founder of North Bay Agile, a special interest group dedicated to the pursuit and study of Agile software development in the San Francisco North Bay, Steve continually strives to communicate the essence of Agile development to novices and advanced practitioners. He has given presentations on estimation, test-driven development, pair programming and refactoring at North Bay Agile, BayXP, BayAPLN , BAADD and Agile Open California 2008, as well as at the Agile2007 and Agile2008 conferences.

In software development there are many ways to

transfer the knowledge about how to build a product to the people who do the actual building. Production can be severely hampered, however, if that knowledge is being produced more rapidly than it can be consumed. This is the knowledge transfer bottleneck.

In this highly interactive workshop we will explore three different methods for knowledge transfer (documentation, reverse engineering and mentoring) by employing them to construct a fleet of aircraft of unusual design. We'll compare and contrast the results, draw analogies between manufacturing and software development, and learn how to remove the bottleneck.

Pre-dinner Guided Networking will be facilitated

by one of TMC’s chapter officers. Attendees are encouraged to think about the night’s theme – the knowledge transfer roadblock. We’ll discuss examples from attendees experiences. In the process we’ll get to find out what fellow meeting attendees are doing in their work.

THURSDAY October 1, 2009

SCV Technology Management


Towards Robotic Cars Speaker: Prof. Sebastian Thrun, Computer Science

and Electrical Engineering Dept, Stanford University

Time: Presentation at 7:00 PM Cost: none Place: Carnegie Mellon University - Silicon Valley,

Building 23, Moffett Field RSVP: not required Web: www.ewh.ieee.org/r6/scv/ras

Sebastian Thrun is a

Professor of Computer Science and Electrical Engineering at Stanford University, where he directs the Stanford Artificial Intelligence Laboratory. Thrun's research focuses on Artificial Intelligence and Robotics. He is probably best known for his victory in the DARPA Grand Challenge, and his second place finish in the DARPA Urban Challenge - both robotic competitions organized by the US Government to foster the field of autonomous robotics. Thrun has published 11 books, over 300 technical papers, and has won numerous awards, including most recently the Science Prize of the City of Braunschweig, Germany. Thrun is an elected member of the National Academy of Engineering (USA) and of the German Academy of Sciences.

This talk will introduce the audience to the

fascinating world of robotic cars. Most of us use cars in our daily lives; yet cars are inefficient, unsafe, and environmentally wasteful. Robotic technology promises to overcome some of these shortcomings, by making cars safer; drivers more productive; and also by reducing the burden to the environment by enabling new models of car sharing. Thrun will present Stanford's research on the basic artificial intelligence behind this new emerging technology. In particular, he will report from two recent autonomous car competitions, organized by DARPA, and dubbed "Grand Challenge" and "Urban Challenge." Machine perception, computer vision, machine learning, and probabilistic computation all play major roles in the design of these systems. Thrun will shed light onto the inner workings of these robots, and discuss the impact of self-driving cars on society once the technology is sufficiently matured.


SCV Robotics and Automation


Reverse Engineering in the Semiconductor Industry

Speaker: Randy Torrance, Chipworks Time: Networking/Pizza at 6:30 PM, Presentation

at 7:00 PM Cost: $2 donation for food Place: Cadence Design Systems, Building 5, 2655

Seely Avenue, San Jose RSVP: not required Web: ewh.ieee.org/r6/scv/cas (scroll down)

Randy Torrance leads the Circuit Analysis team for the Technical Intelligence group at Chipworks. During Randy's 22 years in the technology industry he has held senior technical and management positions in the IC design and electronic systems areas.

Prior to joining Chipworks Randy was Director of IC Technology Development for Atmos/Mosys, and was responsible for teams designing cutting-edge embedded memory macros. Before that he spent 12 years at Mosaid, where he held positions ranging from Senior Design Engineer through Manager IC Design to Director of IC Design, Switching Products. Here he led groups designing commodity and custom memories, and large ASICs for the graphics and networking markets.

Randy holds a B.A.Sc. and M.A.Sc. in Electrical Engineering from the University of Waterloo.

The continuous drive of Moore's law to increase the integration level of silicon chips has presented major challenges to the reverse engineer, obsolescing simple teardowns and demanding the adoption of new and more sophisticated technology to analyze chips. The following types of analysis will be covered in detail: product teardown; techniques used for system-level analysis, both

hardware and software; circuit extraction, taking the chip down to the

transistor level and working back up through the interconnects to create schematics;

process analysis, looking at how the chip is made, and what it is made of.

This presentation is an update of the invited paper given at the 2007 IEEE Custom Integrated Circuits Conference (CICC) with more focus on circuit extraction and cross-referencing between circuit schematics and the 1000's of physical layout images obtained through generating a mosaic of scanning electron microscopy across all device layers.


SCV Circuits and Systems

• Turnkey transistor level design • Silicon-proven IP cores • Clocking and Data-Recovery • Analog Front Ends, Filters • High-performance ADCs • Reliable partner to ASIC vendors • Specialty I/Os

MobilitySemi.com

408-738-5509

3940 Freedom Cir, Santa Clara


Wider Applications for 3D Accelerometer MEMS: Sensing, Gaming, Therapy

Speakers: Ed Brachocki, Kionix; Richard Smith and

Susan Feighery, Palo Alto Veterans Administration Health Care

Time: Optional dinner at 6:30 PM; Three presentations at 7:15 PM

Cost: $25 if reserved by Oct. 10; $30 at door (no cost for presentations)

Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara



Ed Brachocki is Director of Marketing at Kionix, a

global leader in the design and fabrication of high-performance silicon-micromachined MEMS inertial sensors. Ed is the former CEO of Go-Video, a publicly traded consumer electronics company specializing in dual deck video players and digital TVs, that grew from $12 million to $210 million in revenues during Ed's tenure. Go-Video was acquired by Sonicblue, where Ed took on the role of vice president of product marketing, adding responsibility for the Rio MP3 and ReplayTV product lines. Ed's career in the consumer electronics industry dates back to 1988 when he was part of the start-up team for LG's worldwide mobile phone business.

In 2006 Ed co-founded ActionXL, a joint venture with Kionix. The focus of ActionXL is to bring motion-based technology to the gaming and health and wellness markets. Today ActionXL is wholly-owned by Kionix and develops concept content, hardware and tools and collaborates with established companies from videogame corporations to movie studios to major healthcare providers and others to bring motion awareness to a broad array of products.

Ed holds a BS degree from Fairfield University, Fairfield, CT. He has served on the Boards of a number of high tech companies and has been a presenter in both hardware and software tracks at the Intel Developer Forum regarding the design and development of Media Appliances.

Richard K. Smith and Susan Feighery: next page

Brachocki: Advances in inertial sensor integration -- through embedded solutions, embedded intelligence and integrated sensing -- are driving new motion-based products and applications. Two of these applications, Gaming and Healthcare, are merging to create submarkets for products and services in both industries. This talk will explore how one leading accelerometer company has expanded their offerings to include gaming content as part of a solutions approach to this growing market, and we will look at two healthcare companies, one big and one small, who are using motion and gaming technologies to offer healthcare solutions to customers and patients alike. Advances in inertial sensor integration -- through embedded solutions, embedded intelligence and integrated sensing -- are driving new motion-based products and applications (see figure). Two of these applications, Gaming and Healthcare, are merging to create submarkets for products and services in both industries. This talk will explore how one leading accelerometer company has expanded their offerings to include gaming content as part of a solutions approach to this growing market, and we will look at two healthcare companies, one big and one small, who are using motion and gaming technologies to offer healthcare solutions to customers and patients alike.

Smith and Feighery: Aimed primarily at video game fans, the Nintendo Wii gaming system has taken on a different and evolving therapeutic role. Today, the Wii has become a fun part of the rehabilitation process and a form of "therapy" for veterans and returning service members at the VA Palo Alto Health Care System (VAPAHCS) Polytrauma program. The Polytrauma Unit, which cares for severely injured servicemembers with Traumatic Brain Injury (TBI) and other serious and often life-threatening injuries, has introduced the Wii system during Recreation Therapy treatment sessions.

Polytrauma refers to the complex patterns of injury commonly seen in personnel injured during Iraq and Afghanistan deployments. Polytrauma typically results from blast injury caused by improvised explosive devices or rocket-propelled grenades. The combination of high-pressure waves, explosive fragments, and falling debris produce multiple injuries, including brain injury, amputations, burns, wounds, fractures, blindness and hearing loss.

WEDNESDAY October 14, 2009

SCV Components, Packaging and Manufacturing Technology with Control Systems


The magnitude of these injuries and the circumstances in which they occur can cause additional psychological stress to patients and their families. Consequently, their care requires a full complement of medical, surgical, rehabilitation and mental health personnel and services. From a recreation therapist perspective, the emphasis and treatment goal of using the Wii may include increasing the patient's hand-eye coordination, improving balance, strength and movement, and overall safety in their environment. The activities are something patients enjoy and benefit from and continue using when they go home. From the patient perspective, it's all about "having fun." While bowling, a patient mentioned that he never knew "therapy" could be such fun. It helps patients get back into communicating and socializing with their families, friends and comrades in other locations. The virtual togetherness is a great way to help them in their recovery and rehabilitation process.

The inpatient Polytrauma program currently has three recreational therapists, who meet with patients during individual and groups sessions. "Using the Wii system and gaming can enhance part of the treatment session. Arm movements during boxing and recreation therapy sessions can also address issues brought up in other areas, such as physical therapy. Much of the responsibility for the transitional outpatient Recreation Therapy programs is in the hands of Susan Feighery, Lead Recreational Therapist. The program's work involves applying current technology to meet the clinical needs of recently wounded combat service personnel. For example, the program uses the Wii Brain Academy game to increase cognition, memory, and mathematical and visual scanning skills with head-injured patients. In addition, the Wii Sports program allows patients, families and friends to compete athletically, while the recreation therapist measures and monitors the physical recovery process.

The recently released Wii Fitness program teaches other mind/body fitness skills through innovative activities, such as yoga and hula hoop contests. Additionally, all Wii programs, when clinically utilized, can address specific patient deficits via interventions involving behavioral, social, physical and cognitive applications, which can then be directly transferred to the patients' home environment when they return to their local communities. There is a huge learning curve, but tools such as Wii and the XBox360 make treatment sessions enjoyable for both patients and clinicians. Using gaming technologies is breaking new clinical grounds, new treatment strategies are developed.

Richard K. Smith is the Supervisor of Polytrauma Recreation Therapy programs at Palo Alto Veterans Administration Health Care system. He is nationally certified as a CTRS-Certified Recreation Therapist and CBIS-Certified Brain Injury Specialist. He currently is a member of a working group with the Department of Veterans Affairs to develop and formulate a National Assistive Technology Labs project at Palo Alto VA HCS which will also be implemented at 4 primary Polytrauma Rehabilitation Centers nationally.

He has utilized Assistive technology applications for rehabilitation for many years and as a Recreation Therapist works with gaming systems and various adapted technologies for treatment of various severely injured patients, veterans and service members. He has a special interest in new gaming applications and simulation technologies which can be adapted or modified for serving patients at various stages in the rehabilitation process.

Susan Feighery has had more than 20 years of experience functioning as a clinician in the fields of Polytrauma, substance abuse, PTSD, community-based health care, sexual trauma, sub-acute, head-injury, visual/hearing impairments and behavioral health services. Nineteen years in the Armed Forces included service as both an enlisted personnel (E-3 to E-5P) and a Medical Service Corps Officer (2LT-CPT). Military background includes: Commander of a Military Treatment Facility (MTF); Operations Officer for a Special Operations battalion (active secret clearance from 1996-2001); acting team leader (Environmental Science Officer) for a Public Health team; specialist on a Combat Stress Control Team (combat environment); and EMT/medic. Private, non-government experience includes: Ad Hoc Faculty instructor at the University of Wisconsin-La Crosse, Consultant and Training Coordinator at the Oneida Nation Indian Reservation, and Director of the Easter Seals residential camp. She has an MS in Therapeutic Recreation from the University of Wisconsin.


Energy-efficient On-chip Power Management: System, Circuit and Device Perspectives

Speaker: Dr. Eduard Alarcón, Universitat Politecnica

De Catalunya (and CAS Distinguished Lecturer)

Time: Networking/Pizza at 6:30 PM, Presentation at 7:00 PM

Cost: $2 donation for food Place: Cadence Design Systems, Building 5, 2655

Seely Avenue, San Jose RSVP: not required Web: ewh.ieee.org/r6/scv/cas (scroll down)

Eduard Alarcón (S'96, M'01) received the M. Sc. (national award) and Ph.D. degrees in electrical engineering from the Technical University of Catalunya (UPC), Barcelona, Spain, in 1995 and 2000, respectively. Since 1995 he has been with the Department of Electronic Engineering at the Technical University of Catalunya, where he became Associate Professor in 2000. During the period 2006-2009 he has been Associate Dean of International Affairs at the School of Electrical Engineering, UPC. From August 2003 to January 2004, he was a Visiting Professor at the CoPEC center, University of Colorado at Boulder. He has co-authored more than 130 international scientific publications, 3 book chapters and 2 patents, and has been involved in different national and US R&D projects. His current research interests include the areas of analog and mixed-signal integrated circuits, on-chip power management circuits, wireless energy transfer and nanonetworks. He has given 12 invited or plenary lectures and tutorials in Europe, America and Asia, and has been elected by the IEEE CAS society as distinguished lecturer for 2009-2010. He was recipient of the Myril B. Reed Best Paper Award at the 1998 IEEE Midwest Symposium on Circuits and Systems. He was the invited co-editor of a special issue of the Analog Integrated Circuits and Signal Processing journal devoted to current-mode circuit techniques, and a special issue of the International Journal on Circuit Theory and Applications. He co-organized two special sessions related to on-chip power management at IEEE ISCAS03 (Bangkok, Thailand) and IEEE ISCAS06 (Kobe, Japan) and a tutorial at IEEE ISCAS09 (Taipei, Taiwan). He was the 2007 Chair of the IEEE Circuits

(continued, next column)

Trends in portable applications such as mobile

terminals for next generation communications proceed in the direction of increasing the computational load while concurrently reducing size and enhancing operating lifetime. Conversely, the density of energy sources is only expected to slightly increase. In front of this scenario, there exists a demand in improved power management integrated circuits to avoid a powering crisis in future systems-on-chip. The ultimate step consequently consists in the fully monolithic integration of the power converter together with the circuits that constitute its load within either the same substrate or chip package, yielding a complete Powered System on a Chip (PSOC). This lecture will cover efficient energy processing circuits within an integrated circuit environment, which requires a multidisciplinary approach through concurrence of analog and mixed-signal IC design, power electronics and control theory disciplines. Topics covered will encompass on-chip power supply design and implementation, efficiency optimization, IC-compatible power inductors and capacitors, power MOSFET switches and efficient switch drivers, analog current-mode controller IC design, digital controllers, system and circuit-level design of on-chip adaptive power management techniques, adaptive wideband envelope-tracking power supplies for RF power amplifiers, and adaptive voltage scaling for low-power microprocessor and DSP supply.

and Systems Society Technical Committee of Power Systems and Power Electronics Circuits. He was the technical program co-chair of the 2007 European Conference on Circuit Theory and Design - ECCTD07 (Seville, Spain), track chair of the IEEE ISCAS 2007 (New Orleans, US), IEEE MWSCAS07 (Montreal, Canada), IEEE ISCAS 2008 (Seattle, US), ECCTD’09 (Antalya, Turkey) and IEEE MWSCAS09 (Cancun, Mexico). He served as an Associate Editor of the IEEE Transactions on Circuits and Systems - II: Express briefs (2006-2007) and currently serves as Associate Editor of the Transactions on Circuits and Systems – I: Regular papers (2006-2009).

MONDAY October 19, 2009

SCV Circuits and Systems


Digital 3D - From Theater to Home

Speaker: Gary Sasaki, President, DIGDIA Time: Pizza + Drinks, Networking at 6:30 PM,

Presentation at 7:00 PM Cost: $5 for IEEE members, $10 for non-

members, free for students Place: HP Oak Room, 19447 Pruneridge Avenue

(Building 48), Cupertino RSVP: not required Web: ewh.ieee.org/r6/scv/ce

Gary Sasaki, President of DIGDIA, has been covering digital media and entertainment industries for over a dozen years. He is a market analyst and strategic consultant with customers that include multinational corporations and startups.

Digital 3D is the talk of the town in multiple industries from theater, broadcast, consumer electronics and more. Why now? How does it work? Who is doing what? What are some of the remaining challenges?

TUESDAY October 27, 2009SCV Consumer Electronics


Emergency Generator Paralleling Switchgear, Power Switching

Control Methodologies for Low & Medium Voltage Applications

Speaker: Douglas Kristensen, Manager – US Sales,

Thomson Technology Time: Social and Networking at 5:30 PM,

Presentation at 6:00 PM, Dinner at 7:00 PM Cost: $25 (at the door), $10 for IEEE Student

Members Place: Sinbad's Restaurant, Pier 2 The

Embarcadero, San Francisco RSVP: by email to [email protected],

415.558.4591, for reservations and to qualify for the drawing

Web: www.e-grid.net/docs/0910-sf-ias.pdf

Douglas Kristensen is Manager, US Sales, at Thomson Technology, a Regal-Beloit Company, located in Langley (Vancouver), British Columbia Canada. He has more than 20 years of industry experience focused in Power Generation Systems and Paralleling Switchgear. He joined Thomson Technology in 1988 as an Application Engineer and has performed a variety of roles ranging from both product and business development to leading the application engineering and sales administration group to his present position and Thomson Technology as Manager – US Sales.

Power Generation Systems with single or multiple generators with a typical combined output that may vary from 1 to 30MW and are designed with a variety of different power switching control methodologies within Paralleling Switchgear to achieve safe, reliable power switching between the Utility & Generator supplies. This presentation will review the common power switching control techniques used in industry today:

- Open Transition - Momentary Closed Transition - Soft-Load Closed Transition - Continuous Parallel Generation for load testing

and/or load management.

Topics will include prime mover/synchronous generator review, and differences/considerations with respect to control and protection needs of engine/generators for these applications.

TUESDAY October 27, 2009

SF Industry Applications


Nanopackaging: Nanotechnologies in

Microelectronics Packaging Speaker: James E. Morris, Department of Electrical &

Computer Engineering, Portland State University, and CPMT Society Distinguished Lecturer

Time: Optional dinner at 6:30 PM; Presentation at 7:30 PM

Cost: $25 if reserved by Nov 9; $30 at door (no cost for presentation)

Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara



Jim Morris is an ECE Professor at Portland State University, Oregon, and Professor Emeritus at SUNY-Binghamton, having served as Department Chair at both, and is an IEEE Fellow. He has B.Sc. and M.Sc. degrees in Physics from the University of Auckland, NZ, and a Ph.D. in EE from the University of Saskatchewan, Canada, and was the first Director of Binghamton's Institute for Research in Electronics Packaging. Jim has served the IEEE CPMT Society as Treasurer (1991-1997), BoG member (1996-1998), VP for Conferences (1998-2003), Distinguished Lecturer (2000- ), CPT-Transactions Associate-Editor (1998- ), IEEE Nanotechnology Council representative (2007- ), and won the 2005 CPMT David Feldman Outstanding Contribution Award. He has edited four books on electronics packaging, including one published last year on Nanopackaging, established the Nanotechnology Council’s Nanopackaging TC, and contributes to IEEE Nanotechnology magazine. He was General Conference Chair of Adhesives in Electronics (1998), Advanced Packaging Materials (2001), and Polytronic (2004). His research is currently focused on ECAs, nanoelectronics, and nanoelectronics packaging. He is actively involved in international engineering education, was founding chair of the IEEE Education Society's Oregon Chapter, and has spent the past year in visiting positions with the University of Greenwich, Chalmers University of Technology, Dresden University of Technology, Helsinki University of Technology (with a Nokia-Fulbright Fellowship), and the University of Canterbury, New Zealand (on an Erskine Fellowship).

While the electronics industry continues to look for

the next nanoscale device to take over from the MOSFET, other nanotechnologies are already being developed for microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes (CNTs.) Composite materials are applicable to all the passive components, (high-k dielectrics, cermet resistors, inductors, and antennas), electromagnetic interference shielding, electrically conductive adhesives, dispensable conductive interconnect "inks," underfill fillers, and solder enhancement. CNTs find a similar range of applications within composites, but also as thermal and electrical interfaces. There are other nanoscale structures with great packaging potential, and all of these technologies offer new challenges for effective computer modeling, while new nanoscale modeling techniques provide the tools to understand old effects in new ways. Little work seems to be going on, however, on the packaging requirements of the nanoelectronics technologies of the future.

WEDNESDAY November 11, 2009


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