grid.pdf grid.pdf march 2012march 2012 page 1 grid.pdf grid.pdf scv-ce - 2/28 ultraviolet...
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M a r c h 2 0 1 2 w w w . e - g r i d . n e t P a g e 1
GRID.pdf GRID.pdf
March 2012
CHAPTER MEETINGS SCV-PSES - 2/28 | Connected Health Safety – Regulatory and Industry Challenge - networked systems, patient safety ... [more]
SCV-CE - 2/28 | Building Innovation Platforms for Consumer Electronic Product Development - speed, design, platforms ... [more]
SCV-PACE - 2/29 | Career Networking Dinner - buffet dinner to meet, network, exchange career opportunities ... [more]
SCV-TMC - 3/1 | Problems, Big Problems, and Damn Problems - human vagaries, networks, politics, strategies ... [more]
SCV-Phot - 3/6 | Overview of Radiation Sources for Extreme Ultraviolet Lithography - laser excitation, arc plasma ... [more]
SCV-MTT - 3/8 | Improvements in Amplifier Design Using Lossless Feedback - high-gain, low-noise, narrow band, S-parameters ... [more]
SCV-CAS - 3/12 | New Architecture for Next-Generation User-Centric Mobile Device - mobile cloud, interfaces, open OS ... [more]
OEB-Life - 3/13 | So - What About Nuclear Energy? - fission, carbon free, new orders, status, potential ... [more]
SCV-Mag - 3/13 | Topological Insulators for Electronics Device Applications - edge states, charge transport, applications ... [more]
SCV-CS - 3/13 | Creating System-On-Chips: Mixing HW & SW Successfully - complexity, embedded IP, design, verification ... [more]
SPECTRUM - 3/14 | Common Platform Virtual Technology Forum 2012 - full-day webinar: collaboration, innovation, next-gen ... [more]
SCV-CPMT - 3/14 | 3D Chip Stacks: New Nano Thermal Interface Materials - thermal conductivity, CNTs, measurements ... [more]
SCV-ComSoc - 3/14 | Evolution and Future of Optical Transport Networks; Photonic Integrated Circuits - 3 talks and panel ... [more]
SCV-PV - 3/14 | PV Panel Rollout: Reliability, Testing, Certification - status, needed improvements, resources, next steps ... [more]
CS Webinar - 3/15 | Continuous Integration for Agile Embedded Software Development - webinar: embedded SW, testing ... [more]
CS Webinar - 3/15 | The Tyranny of Benchmarks: Past, Present and Future Challenges in High Performance Computing – webinar [more]
OEB-PES - 3/15 | Tour of Finelite High Performance LED Facility - Ambient task lighting, luminaires, factory tour ... [more]
SCV-Nano - 3/20 | Novel Flexible Acoustic Devices - graphene, silver nanowires, fabrication, characterization ... [more]
SCV-CNSV - 3/20 | Developing Mobile Apps for Fun and Profit - small agile apps, developing, selling ... [more]
SCV-EMBS - 3/21 | Decentralization of Care: The Circle of Enabling Technologies - analysis, comm’n, computational advances ... [more]
OEB-IAS - 3/22 | Electrical System SCADA in an Industrial Setting - monitoring, faults, shutdown, back online ... [more]
SF-IAS - 3/23 | 1-day Seminar: Electrical Distribution Equipment Spec Writing - plus Short Circuit, Arc Flash Analysis ... [more]
SCV-Nano - 4/6 | Emerging Non-Volatile Memory Technologies: Full Day Symposium - speakers from UCB, Sandia, Stanford ... [more]
SCV-IT - 4/25 | Simulating a Gaussian Process from Coin Flips: Stationary Codes, Entropy, and Approximation ... [more]
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MARKETPLACE – Services page 3
Career Development Professional Skills Courses [more]- Presentation Skills - Meeting Management - and more
Santa Clara University Grad School of Engineering Spring Open University [more]
- Early-morning, evening, Saturday classes Spring Quarter classes start April 2nd
Chapter Short Courses & Seminars Short Circuit Coordination, Arc Flash Analysis & Specification Writing Refresher [more]- one-day seminar on March 23rd
Emerging Non-Volatile Memory Technologies: Full Day Symposium - April 6 [more]
A Tribute to Gregg Botlz (1958 – 2001) [more]
from the OEB IAS Chapter
Conference Calendar
Mar 4-8: Optical Fiber Communication Conference (OFC/NFOEC) - Los Angeles Convention Center [more]
Mar 18-22: Semiconductor Thermal Measurement and Management Symposium - San Jose [more]
Mar 19: Interdisciplinary Engng Design Education Conference (IEDEC) - Techmart, Santa Clara [more]
Mar 19-22: Int'l Symsposium on Quality Electronic Design (ISQED) - Techmart, Santa Clara [more]
Mar 26-29: Embedded Systems Conference - Silicon Valley (ESC) - San Jose Convention Center [more]
April 15-19: IEEE Int'l Reliability Physics Symposium (IRPS) - Hyatt Regency Anaheim [more]
April 16-20: IEEE Conference on Massive Data Storage (MDS) - Asilomar, Pacific Grove [more]
May 6-11: CLEO: Laser Science to Photonics Applications - San Jose Convention Center [more]
May 14-17: Android Developer Conference (AnDevCon) -Hyatt Regency Burlingame [more]
Call for Papers: Asilomar Conference on Signals, Systems and Computers Nov 4-7, 2012: Due May 1 [more]
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 2
Your Networking Partner ®
March 2012 • Volume 59 • Number 3
IEEE-SFBAC ©2012
IEEE GRID is the monthly newsmagazine of the San Francisco Bay Area Council of the Institute of Electrical and Electronics Engineers, Inc. As a medium for news for technologists, managers and professors, the editorial objectives of IEEE GRID are to inform readers of newsworthy IEEE activities sponsored by local IEEE units (Chapters, Affinity Groups) taking place in and around the Bay Area; to publicize locally sponsored conferences and seminars; to publish paid advertising for conferences, workshops, symposia and classes coming to the Bay Area; and advertise services provided by local firms and entrepreneurs.
IEEE GRID is published as the GRID Online Edition residing at www.e-GRID.net, in a handy printable GRID.pdf edition at the end of each month, and also as the e-GRID sent by email twice each month to more than 24,000 Bay Area members and other professionals.
Editor: Paul Wesling IEEE GRID PO Box 2110 Cupertino CA 95015-2110 Tel: 408 331-0114 / 510 500-0106 / 415 367-7323 Fax: 408 904-6997 Email: edi tor@e-gr id.net www.e-GRID.net
From the Editor
This is the age of social interaction through the internet. Many of us engineers now keep in touch with other professionals through LinkedIn, track activities in Google Calendar or Facebook, and use our Smart Phones for many other activities.
So, it makes sense for the GRID – and our SF Bay Area IEEE activities – to migrate to apps. After spending some months studying the characteristics that make many of the popular apps useful and user-friendly, I’m now starting the specs for an e-GRID app – two, actually, for iPhone and Android. As I envision them, they’ll let you choose to scan all upcoming chapter meetings – or only those in one or more of our 11 Categories. You can enter keywords that best characterize your interests, so that the app will show you all complying meetings. Once you find one of interest, you can add it to your Calendar, with reminders so you don’t miss it. And you’ll be able to forward meeting announcements to your friends, so they can also attend.
My intention is to implement these in HTML5, CSS and Javascript – so that the resultant code can then be compiled into an iPhone app, an Android app, and perhaps other targeted systems. This will give us the best multi-platform capability and updateability going forward.
Now for the appeal: If you’ve implemented apps before, and would be available to assist me (such as doing the actual coding), I’d like to hear from you. The SFBAC officers have authorized me to offer to cover your basic dues for the next year, as a reward (and you’ll gain recognition as the programmer for the app). Please give me a call or send an email if you can help!
Best regards,
Paul
NOTE: This PDF version of the IEEE GRID – the GRID.pdf – is a monthly publication and is issued a few days before the first of the month. It is not updated after that. Please refer to the Online edition and Interactive Calendar for the latest information: www.e-GRID.net
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Secretary: Fred Jones Treasurer: Dan Sparks
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IEEE GRID
March 2012 V i s i t us a t w w w . e - G R I D . n e t Page 3
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March 2012 V is i t us a t w w w . e - G R I D . n e t Page 4
Industry Applications Society, Oakland East Bay mourns the loss of a dedicated volunteer, contributor, leader, and friend. Gregg Boltz passed away on Friday, November 4, 2011, after battling cancer. Gregg is survived by his wife and two daughters.
Gregg served as an officer of the Chapter for 12
years (6 years as Chairman) and has been instrumental in its success. He was known for his broad and deep knowledge and experience in power engineering, for his wit and candor, and for his strong faith. Gregg is loved and remembered for making fellowship an integral part of the monthly technical dinner meetings.
Gregg was a Supervising Engineer with Brown and
Caldwell, an engineering consulting firm specializing in water, wastewater, and environmental engineering projects. He received a Bachelor of Science degree in Engineering from San Francisco State University. He worked in the field of electrical power distribution since 1984. Gregg was well respected for his competence, knowledge and experience in design of electrical distribution systems up to 35kV, plant control and instrumentation systems, and for his extensive field experience relative to on-site inspection, field design, and troubleshooting during plant start-up. Gregg was a registered professional engineer in the state of California.
At monthly technical dinner meetings, Gregg would
regularly interject his technical (and non-technical) viewpoints, usually well colored with dry humor. Conversations with Gregg often were about some challenging aspect of an electrical project. Gregg was always willing to offer his insight and advice. He also liked to debate technical viewpoints with colleagues at meetings. When not talking technical, Gregg could often be found sharing stories of his on-going home improvement projects, most of which he completed himself. Although his viewpoints on politics were strictly conservative, Gregg was very liberal in his willingness to express his views.
In his final months, Gregg still managed to attend
IEEE meetings. It was evident that he treasured his friendships with fellow members and wanted to share a few more laughs and stories with his friends at the IEEE meetings.
Gregg made a lasting impression on everyone he
met. He made immeasurable contributions to IEEE through his many years of dedicated service. Gregg was a friend, colleague, supervisor, technical expert, leader, husband, and father. Gregg will truly be missed.
In lieu of flowers, contributions may be made to a
scholarship fund for college for his youngest daughter, Michele. Contributions in her name may be sent to: Boltz College Fund, 25-A Crescent Drive #216, Pleasant Hill, CA 94523.
A Tribute to Gregg Boltz (1958-2011)
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 5
45 Short Courses include: - Optical Control Plane Concepts, Technologies and Practices - WDM in Long-Haul Transmission Systems - Metro Network: The Transition to Ethernet - Next Generation Transport Networks: The Evolution from Circuits to Packets - ROADM Technologies and Network Applications - Modeling and Design of Fiber-Optic Communication Systems - Introduction to Ethernet Technologies - New Developments in Optical Transport Networking (OTN) - 40G/100G Ethernet Technologies and Applications - Multi-Layer Control Plane Technologies: Hybrid Networks - Hands-on Workshop on Fiber Optic Measurements and Component Testing - Test and Measurement of High-Speed Communications Signals - Basic Fiber Optics for the Absolute Beginner - 40/100 Gb/s Transmission Systems, Design and Trade-offs (and many more)
Technical Conference March 4-8, 2012 •
Exposition March 6-8, 2012
Los Angeles Convention Center
If you work in Access/FTTx, Datacom, Carrier/Transport/Telecom, Test and Measurement, Green Technology, Optical Grids, or any optical communications field, this is the one event you can’t afford to miss.
Register Today!
For more information:
www.ofcnfoec.org
Optical Fiber Communication Conference and Exposition and
the National Fiber Optic Engineers Conference (OFC/NFOEC)
the technology of the future
at today’s leading event Sponsored by: Non-Financial Technical Co-Sponsor: ®
Don’t miss the comprehensive technical conference featuring the latest advances in the research and development of new technologies in optical communications.
• Must-attend Plenary Session featuring three exceptional keynote speakers
• More than 100 Invited Presentations given by experts in the field
• More than 100 sessions of Peer-Reviewed technical presentations, including talks on the latest in datacomm, 100G, FTTX, PON and beyond
• Up-to-the-minute research presented in Postdeadline Sessions
• Various Short Courses providing continuing technical education
• Business trends, insights and analyses by leaders in the field at the Service Provider Summit and Market Watch
• World’s largest optical fiber exhibition with 600 exhibiting companies
PLUS…Networking Opportunities, On-Site Job Interviews and Career Sessions, Show Floor Activities and more!
R i t b d SAVE!
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 6
San Francisco IAS Chapter One-Day Seminar
Friday, March 23, 2012 Hilton Pleasanton
-- Includes lunch, handouts, book Morning Session: Electrical Distribution Equipment Specification Writing Refresher
Chris Lovin, P.E., Eaton Cutler Hammer
Gary Fox, Senior Specification Engineer, General Electric
Jim Avery, Sales Engineer, IEM
Finn Schenck, Schneider Electric (Square D Company) Afternoon Session: Short Circuit, Coordination and Arc Flash Analysis
Glyn J. Lewis, P.E., Applied Power
Member of IEEE, NFPA, NETA AND IAEI; registered in the State of California; has performed over 500 analytical studies on electrical distribution systems in the areas of short circuit analysis, coordination, load flow and motor starting.
For 50 years, IRPS has been the premier conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment.
IRPS provides numerous opportunities for
attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world. We look forward to seeing you in Anaheim!
8:30 AM – 4:40 PM (8:00 AM – Registration/Breakfast)
Each attendee receives: · “Construction Specifications Writing” (book) · Speakers’ presentation notes and handouts
Stay Current – Attend This Seminar Great Networking Opportunity
$250.00 Total Cost
Pre-registration required
Please register online:
sfias2012seminar.eventbrite.com Or download the full flyer for more information:
www.e-grid.net/docs/1203-sf-ias.pdf
Sessions on: - Memory - Process Integration/3D/TSV - Compound/Opto Electronics - Failure Analysis - Circuits Reliability - Chip-Package Interaction - BEOL Dielectrics - Transistors/TFTs - Soft Errors - ESD and Latchup - Compound/Opto Electronics - Photovoltaic Devices - Thermo-Mechanical/MEMS - System Reliability - Medical Electronics
Two-Day Tutorial Program (April 15-16)
Evening Workshops. Vendor Exhibits.
“Year in Review” Session
Register by March 18th, for best rates – save $100!
For more information:
www.irps.org
Short Circuit Coordination & Specification Writing
2012 International Reliability Physics Symposium
April 15-19, 2012 Hyatt Regency Orange County
Anaheim
REGISTER NOW!
sponsored by: Also feAturing:
cleo: expocleo: Market Focus
ADVANCE REGISTRATION DEADlINE: 19 MarcH 2012
POSTDEADlINE PAPERS SubmISSION DEADlINE: 30 MarcH 2012
hOuSING DEADlINE: 6 aprIL 2012
Visit www.cleoconference.org
technical conference: 6–11 May 2012exhibit: 8–10 May 2012san Jose Mcenery conVention centersan Jose, ca, Usa
cleo: QeLs–FundaMentaL scIence
cleo: scIence & InnovatIons
cleo: appLIcatIons & tecHnoLogy
cleo:2O12 Laser science tO PhOtOnic aPPLicatiOns
cleo: 2012 covers the full spectrum from laser science to photonic
applications. attend cleo: 2012’s complete and up-to-date technical
program of nearly 1,700 presentations on innovative, cutting-edge topics.
register by 19 March
and save!
March 2012 Visit us at www.e-GRID.net Page 7
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 8
CALL FOR PAPERS 46th Annual Asilomar Conference on
Signals, Systems, and Computers
Asilomar Hotel and Conference Grounds Pacific Grove, California
November 4-7, 2012
www.asilomarssc.org
Authors are invited to submit papers before May 1, 2012, in the following areas: A. Communications Systems: 1. Modulation and Detection, 2. Error Control Coding, 3. OFDM / Multicarrier, 4. Cognitive Radio, 5. Adaptive Waveforms, 6. Wireless Security/Privacy, 7. Power line communication, 8. DSL and Wireline Technologies, 9. 60GHz, 10. Optical Communications, 11. 4G Applications
B. MIMO Communications and Signal Processing: 1. Space-Time Coding and Decoding, 2. Channel Estimation and Equalization, 3. Multi-user MIMO, 4. Base Station Cooperation, 5. Limited Feedback Techniques, 6. Interference Management
C. Networks: 1. Transmission Techniques for Ad Hoc Networks, 2. Wireless Sensor Networks, 3. Network Information Theory, 4. Cooperative Diversity, 5. Relays, 6. Heterogeneous Networks, 7. Cognitive/Adaptive Sensor Networks
D. Signal Processing and Adaptive Systems: 1. Compressive Sensing, 2. Machine Learning Based Statistical Signal Processing, 3.Information Theoretic Signal Processing, 4. Cognitive Information Processing, 5. Adaptive Filtering, 6. Fast Algorithms
E. Array Signal Processing: 1. Source Localization, 2. Source Separation, 3. Adaptive Beamforming
4. Robust Methods, 5. Computational Aspects, 6. Applications (Sonar, Radar, Microphone arrays, etc.)
F. Biomedical Signal and Image Processing: 1. Medical Image Analysis, 2. Imaging Modalities, 3. Advances in Medical Imaging, 4. Biomedical Signal Processing, 5. Biomedical Applications, 6. Bioinformatics, 7. Image Registration and Multi-modal Imaging, 8. Image Reconstruction, 9. Computer Aided Diagnosis, 10. Functional Imaging, 11. Visualization
G. Architecture and Implementation: 1. Energy efficient design, 2. High-speed computer arithmetic, 3. Reconfigurable signal processing, 4. Multicore, manycore and distributed systems, 5. Algorithm and architecture co-optimization, 6. System-level representation and synthesis, 7. Cyber-physical system prototypes/testbeds H. Speech, Image and Video Processing: 1. Speech Processing, 2. Speech Coding, 3. Speech Recognition, 4. Narrowband / Wideband Speech and Audio Coding, 5. Document Processing, 6. Models for Signal and Image Processing, 7. Image and Video Coding, 8. Image and Video Segmentation, 9. Image and Video Analysis, 10. Image / Video Security, Retrieval and Watermarking, 11. Image and Video Enhancement / Filtering, 12. Biometrics and Security, 13. Wavelets
Submissions should include a 50 to 100 word abstract and an extended summary (500 to 1000 words, plus figures). Submissions must include the title of the paper, each author's name and affiliation, and the technical area(s) in which the paper falls with number(s) from the above list. Check the conference website (www.asilomarssc.org) for specific information on the electronic submission process. Submissions will be accepted starting February 1, 2011. No more than FOUR submissions are allowed per contributor, as author or co-author. All submissions must be received by May 1, 2011. Notifications of acceptance will be mailed by mid July 2011, and author information will be available on the conference website by late July 2011. Full papers will be due shortly after the conference and published in early 2012. All technical questions should be directed to the Technical Program Chair, Dr. Erik G. Larsson, e-mail [email protected] or the General Chair, Dr. Miloš Doroslovački, e-mail [email protected].
CONFERENCE COMMITTEE
General Chair: Miloš Doroslovački, The George Washington University Technical Program Chair: Erik G. Larsson, Linköping UniversityConference Coordinator: Publication Chair: Michael Matthews, ATK Space Systems Publicity Chair: Linda DeBrunner, Florida State University Finance Chair: Frank Kragh, Naval Postgraduate School
The site for the 2012 Conference is at the Asilomar Conference Grounds, in Pacific Grove, CA. The grounds border the Pacific Ocean and are close to Monterey, Carmel, and the scenic Seventeen Mile Drive in Pebble Beach.
The Conference is organized in cooperation with the Naval Postgraduate School, Monterey, CA, and ATK Space Systems, Monterey, CA. The IEEE Signal Processing Society is a technical co-sponsor of the conference.
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 9
Have you ever wanted to continue your education in engineering while you continued working? Santa Clara University’s School of Engineering offers graduate degree and non-degree programs to both full-time students and working professionals. Simplified registration for the Spring Open University. Graduate-level instruction. Up to 12 units may be transferred to a graduate-degree program.
Early-morning classes: - SoC Formal Verification Techniques - Analog Integrated Circuits - Phase-Locked Loops - Advanced Mechatronics (and more)
Evening classes: - Intro to Nano-Bioengineering - Digital Signal Processing - VLSI Design - Computer Architecture - Logic Design Using HDL - Global Technology Development (and more)
Saturday classes: - Secure Coding in C & C++ - Law, Technology & IP - Introduction to Biofuels Engineering (and more)
Email LeAnn Marchewka with inquiries: [email protected]
Highlighting the latest research in the architecture, design, implementation, and evaluation of massive storage and parallel I/O systems.
Tutorials Monday, April 16
Covering distributed file systems: Lustre, GPFS, OrangeFS, Ceph, and HDFS.
Invited Papers Tuesday & Wednesday, April 17-18
IBM, Whamcloud, Hortonworks, Texas Memory, Dell, DataDirect, Ceph, Clemson, U-Minn, JPL and more!
Research Papers Thursday & Friday, April 19-20
Prepare for that next project or assignment! To remain competitive in Silicon Valley's changing environment, engineers need to update their knowledge base. The School of Engineering offers professional Certificates and Open University programs, as well as graduate degrees, for those who are driven to become leaders in their fields.
Classes begin April 2nd
50% SCU Engineering Alumni discount
Located in the heart of Silicon Valley, with easy parking
Review spring Open University courses:
www.scu.edu/engineering/graduate
April 16 — 20, 2012
Asilomar
Conference Grounds
Pacific Grove
– Tutorials – Sessions
– Research – Vendors
Save, through March 16
Keynote Speaker: Peter Ungaro President & CEO, Cray
Selected paper Topics:
- Efficiencies in the Exascale Era - Density roadmap for tape, disk, and flash - HPC storage - Highly Reliable Flash Memory - Archiving and Digital Preservation - Linear Tape File System - Limits to Scalability - Hadoop File System - HPC Petascale File Systems … and many more.
Register by March 16th for Earlybird rates
Visit: www.storageconference.org
Santa Clara University School of Engineering Graduate Programs
SCU Spring Open University
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 10
Emotional Intelligence -- Date/Time: Thursday, March 15, 9:00 AM – 5:00 PM -- Location: – Tibco, Palo Alto -- Fee: $425 for IEEE Members; $500- non-members
Communicate to Manage Expectations -- Date/Time: Tuesday, April 17, 9:00 AM – 5:00 PM -- Location: – Tibco, Palo Alto -- Fee: $400 for IEEE Members; $500- non-members
Flexibility: Understanding Differences and Conflict -- Date/Time: Thursday, May 3, 9:00 AM – 5:00 PM -- Location: – Tibco, Palo Alto -- Fee: $425 for IEEE Members; $500- non-members
Upgrade your skill set – prepare for future challenges
AnDevCon Comes Back to Burlingame!
AnDevCon III is the technical conference for software developers building or selling Android apps. Whether you're an enterprise developer, work for a commercial software company, or are driving your own start-up, if you are building Android apps, you need to attend AnDevCon. You’ll find hundreds of experienced developers and engineers (like you) choosing from more than 50 classes to bring Android open source development to a high level. Exhibit Hall hours:
Wednesday May 16, 11:00 am – 7:00 pm Thursday May 17, 11:00 am – 2:30 pm
“This was a great conference! The scope and breadth of
classes gave a great opportunity to learn more about Android development in general AND gave the
opportunity to network with other people at all levels. It's a great learning place with wonderful people!”
Andrew Mauer, Sr. Project Manager, B-Line Express, Inc.
SCV Chapters, Technology Management & Components, Packaging and Manufacturing Technology Societies
Delegation and Coaching: The Winning Combination -- Date/Time: Thursday, April 26, 9:00 AM – 5:00 PM -- Location: – Tibco, Palo Alto -- Fee: $400 for IEEE Members; $500- non-members
Specific techniques needed to assess and delegate a task, support performance, and resolve performance problems.
Getting Things Done Across Organizational Borders -- Date/Time: Tuesday, May 87, 9:00 AM – 5:00 PM -- Location: – Synopsys, Mtn View -- Fee: $400 for IEEE Members; $500- non-members
For complete course information, schedule, and registration form, see our website:
www.EffectiveTraining.com*
May 14-17, 2012 Hyatt Regency Burlingame
Technical Classes Keynotes, Exhibits, more
Keynotes: Chet Haase, Android Team, Google Roman Guy, Software Engineer, Google
Technical Classes: - Android Fundamentals - Protecting Your Android Source Code - Patterns for Writing Power-Lean Apps - Building HTML5 Apps for Phone or Tablet - Bringing Android Apps to the BIG Screen - Android's Linux Heritage - Android Services Black Magic - Android Business Essentials Responsive Mobile Design in Practice Remixing Android - Advanced Design Implementation - Performance Java for Android - PhoneGap: Cross the Gap from HTML5 to Mobile … plus dozens more
Earlybird registration thru March 2 – save $500 And save $100 by using Code “IEEE”
on 4-day passport, or for free exhibits admission.
For information and to register, visit
www.AnDevCon.com
IEEE Professional Skills Courses
LeadingInnovation and Quality
KEYNOTESPreliminary list of keynote speakers includes:
TECHNICAL SESSIONSISQED Technical sessions start on Tuesday March 20, and continue until the after-noon of Wednesday, March 21. Beside the above plenary sessions, and workshops, the program consists of over 20 technical sessions featuring near 100 papers on various challenging topics. A partial list of topics is shown below. Detail program would be available on the web at www.isqed.org.
REGISTRATIONPlease refer to ISQED web site at www.isqed.org for information regarding the tutorials, conference, and hotel registration. Direct all conference inquiries to [email protected]. Early registration is recommended to take advantage of the discounted registration fee.
Tom Beckley - Corporate Vice President, Cadence Design SystemsChristophe Muller - Director & Professor, Institut Carnot STAR Dean M. Tullsen - Professor, University of California, San Diego Jos Huisken - Principal Researcher, IMEC-NL
Upholding Moore’s Law by Transistor InnovationsRafael Rios - IntelDesign-Assisted Semiconductor Manufacturing Puneet Gupta - University of California, Los Angeles 3D Integration Technologies: Process, Application, and InfrastructureFarhang Yazdani - BroadPak CorporationInterface Architectures for Low Power and High Performance Memory Brian Leibowitz - Rambus Inc.Challenges and Opportunities of 3-D IC System Architecture and DesignHsien-Hsin S. Lee - Georgia Institute of Technology3D IC Test Challenges and Emerging Solutions Stephen Pateras - Mentor Graphics
TUTORIALS/WORKSHOPS
VENDOR EXHIBITIONISQED2012 Exhibition floor will be open on Tuesday morning, March 20, and features vendors offering design tools, methodologies, and services in the areas of design for manufacturing, yield, reliability, and quality. Exhibition includes technical poster presentations. Exhibition floor attendance is free but needs advance on-line registra-tion (see registration information on the web)
Call for ParticipationISQED 2012, 13th International Symposium & Exhibits on
QUALITY ELECTRONIC DESIGNwww.isqed.orgMarch 19-21, 2012
Techmart Center, Santa Clara, CA, USA
ISQED2012 corporate sponsors are Cadence, Global Foundries, IBM, Intel, and Mentor Graphics.
ISQED AwardsISQED Quality Award (IQ-Award), ISQED Education Leadership Award ceremony will be held during Tuesday March 20 luncheon. Best papers will be also announced during the same session.
Interdisciplinary Engineering Design Education Conference - IEDEC2012
March 19, 2012. Santa Clara, CA, USA
Education Society
The Interdisciplinary Engineering Design Education Conference is a premier event committed to further the education in engineering design with the ultimate goal of improving the quality of engineering designers worldwide. The conference is intended for educators, mentors, engineers, managers, researchers, students, as well as industry companies and consortiums that desire excellence in interdisciplinary engineering education and have created or need to create interdisciplinary programs and products. IEDEC strives to promote the engineering design profession and to highlight the important role of engineering in all aspects of human life. The conference provides a forum for sharing ideas; learning about developments in engineering design education; and interacting with professionals, experts, and colleagues in the field.
Keynote SpeakersRobert Geer - CNSE VP Academic Affairs and Chief Academic Officer & Professor of Nanoscience
Masoud NikRavesh - Executive Director of CITRIS Program, UC Berkeley
Manju Hegde - Director of Fusion Experience, AMD
Technical PresentationsIEDEC program includes many technical presentations by experts worldwide. A List of topics of interest includes:
Latest Educational Hardware and Software Tools and Techniques Advanced and Innovative Design Automation Tools Promoting Innovation and Creativity in Engineering Design Management of Design Trends in Engineering Education International and Global Aspects of Engineering Education Student Projects and Internships Learning Environments, Tools, and eLearning Combining Teaching and Research E-learning and E-assessment, Continuing Education & Its Delivery Collaboration between Universities, Industry, and Government Engineering Education & Women Distance Learning and Distance Teaching Engineering Education Outreach
Conference Registration & InformationVisit conference website at www.IEDEC.org for information about the program, registration, and hotel reservation. Send all you inquiries to [email protected] is held in technical sponsorship of IEEE Education Society. All ac-cepted papers will be published in IEEE eXplore.
March 2012 Visit us at www.e-GRID.net Page 11
www.iedec.org
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 12
If you can only attend one event this year, then ESC Silicon Valley is the must-attend event for embedded systems engineers. ESC is the largest gathering of 250+ exhibitors showcasing the latest embedded technologies available today.
And now ESC is DESIGN West – with 7 exciting Summits under one roof:
The Embedded Systems Conference (Mar 26 – 29): The global electronics industry's leading event.
Android Summit (Mar 28): A focus on everything Android: from embedded design to Apps development.
Black Hat Summit (Mar 29): This one-day conference will focus on security and security risks in embedded systems.
DesignMed (Mar 28): A conference & exhibit covering medical electronics design and regulatory issues.
MultiCore DevCon (Mar 27-28): A conference and exhibit delivering practical solutions for designs involving embedded multicore and multimedia.
Designing with LEDs (Mar 27): Technology design of high-brightness LEDs, in lighting and illumination.
Sensors in Design (March 28-29): A conference & exhibit with how-to technical presentations on the application of sensor technology in real-world products.
A revolutionary new experience, with more learning options, and more value for your money and time spent.
Flexible Registration Packages • 1-day, 3-day, or the 4-day All-Access Pass value • Free Expo Pass (with Keynotes, sponsored sessions, more) • Choose exactly what suits your needs and schedule • Group rates – bring your team (save up to 25%)
Save, through February 19th. For more information:
www.ubmdesign.com/esc
The 28th Annual Semiconductor Thermal Measurement, Modeling & Management Symposium
March 18-22, 2012 DoubleTree Hotel San Jose, CA
Register Online at
www.semi-therm.org
Our Sponsors
3587 Kifer Road, Santa Clara, CA, USA Phone: +1 408-642-5170 Fax: +1 408-841-7597
EMBEDDED SYSTEMS CONFERENCE
IEEE SEMI-THERM is an international forum dedicated to the thermal design and characterization of electronic components and systems. The symposium fosters the exchange of knowledge between practitioners and leading experts from industry, as well as the exchange of information on the latest academic and industrial advances in electronics thermal management. New for 2012! The SEMI-THERM organizers are pleased to present a Data Center Track with 13 papers and 2 short courses targeted at thermal issues ranging from the component level through the system level all the way up to the complete center level. A panel discussion will be included, bringing together leading members of the data center industry to discuss key industry issues. Collectively, this comprehensive overview of thermal issues at the various levels is a must for participants in the data center industry and for those that wish to learn more about this fast growing industry.
● Pre-conference Short-Courses from world-class thermal experts. ● Over 55 peer-reviewed papers presented by the industry’s best. ● Tracks include 3D Packaging, Liquid and Air Cooling,
Multidisciplinary Thermal Management, Thermal Management in Multi-Core Architectures and more...
● New! Special Data Center Cooling track with short-course and paper presentations.
● SEMI-THERM Exhibition with over 40 vendors plus workshops.
MEPTEC will again join SEMI-THERM with their “Heat Is On”Symposium to be held on Monday, March 19th titled “Revolutionary and Evolutionary Innovations in Thermal Management”.
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 13
Connected Health Safety – Regulatory and Industry
Challenge
Speakers: Geetha Rao, Ph.D., VP Corp. Dev., Triple
Ring Technologies; Marta Zanchi, Ph.D., Principal Consultant, Medinnovo
Time: Optional dinner at 5:15 PM at Honba Sushi; Presentation at 7:00 PM at U.L.
Cost: none Place: Honba Sushi, 2587 North 1st St, San Jose;
then Underwriters Laboratories Inc., 455 E. Trimble Rd, San Jose
RSVP: not required Web: www.ewh.ieee.org/r6/scv/pses
Dr. Geetha Rao co-chairs the Connected Health Safety Initiative. She is Vice President of Corporate Development at Triple Ring Technologies, an innovator in medical, aerospace, and security technologies and CEO of Springborne Life Sciences providing advisory services to start-ups and entrepreneur support organizations. Previously, she was Chief Corporate Development Officer at Molecular Image, Inc., a personalized medicine diagnostic company and President and CEO of Norgren Systems, a biotechnology/drug discovery automation company. Dr. Rao is a graduate of the Indian Institute of Technology, Madras, holds a doctorate from Massachusetts Institute of Technology, and a master’s degree from Stanford University’s Graduate School of Business, where she was a Sloan Fellow.
Dr. Marta Zanchi co-chairs the Connected Health
Safety Initiative. She is Principal Consultant and owner at Medinnovo, a medical innovation consulting company with focus on developing regulatory, marketing, and business strategies for early-stage companies and medical technology innovators, especially in Mobile Health. Previously she worked with the business development team at LitePoint, a privately-held wireless technology company located in Silicon Valley. (continued …)
Professional healthcare delivery is increasingly
reliant on IT-networks that incorporate wired, wireless, or otherwise connected medical devices. Separate from that, consumer technologies such as home-use diagnostics connected to cell phones are increasingly being used in healthcare application. As these two trends converge, assuring patient safety and effectiveness is a significant challenge in the resulting wide-ranging, networked systems with complex inter-dependencies and multiple subsystem owners. While the FDA regulates devices, the IT networks themselves are largely unregulated. As these networks have added capabilities for real-time data exchange and remote monitoring, they have increasing impact on patient safety, clinical effectiveness, continuous availability of care, and security of both the networks and the medical devices. Drs. Geetha Rao and Marta Zanchi will discuss FDA activity in this area and the complementary efforts of the Connected Health Safety Initiative (CHSI), a non-profit industry coalition which aims to develop a framework for collaborative management of safety, clinical effectiveness, and data security risks in connected healthcare systems.
At Stanford University, where she graduated with a PhD in electrical engineering, Marta was a research assistant with the Magnetic Resonance Systems Research Laboratory, where she developed radiofrequency devices and systems for medical imaging. She was also a Medical Device Fellow at the Food and Drug Administration and Sr. Researcher with Northwestern and Stanford University on a comprehensive analysis and industry survey of the 510(k) regulatory process.
TUESDAY February 28, 2012
SCV Product Safety Engineering
MET Laboratories
EMC – Product Safety
US & Canada
• Electromagnetic Compatibility • Product Safety Cert. • Environmental Simulation • Full TCB Services • Design Consultations • MIL-STD testing • NEBS (Verizon ITL & FOC) • Telecom • Wireless, RFID (DASH7 & EPCglobal Test Lab)
Facilities in Union City and Santa Clara
www.metlabs.com [email protected] 510-489-6300
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 14
Building Innovation Platforms for Consumer Electronic
Product Development Speaker: Gopi Kumar Bulusu, Sankhya Technologies Time: Networking, Pizza + Drinks at 6:30 PM;
Presentation at 7:00 PM Cost: none Place: NVIDIA, 2800 Scott Blvd., Building E,
Santa Clara RSVP: from website Web: www.eventbrite.com/event/2655511707
Gopi Kumar Bulusu is the CEO at Sankhya Technologies Private Limited. He is an acknowledged expert in the areas of distributed computing and embedded systems. His team received the Lockheed Martin India Innovation award in the year 2008 and the DST-Lockheed Martin Innovation award during 2009. He holds 4 granted US patents in addition to several pending patent applications.
Gopi is a regular speaker at industry and academic events on a wide range of topics. He is an active member of IEEE and presently serves as the SubSection chair for the IEEE Vizag-Bay SubSection. He is a member on the editorial advisory board, EETimes India. His key interests are in the area of creating innovative platforms that bring the power and efficiency of architectural model driven solutions to IT system designers and business users. On a higher plane, Gopi Bulusu believes in applying the benefits of innovation and technology to promote national prosperity and actively contributes ideas to the Planning Commission through Facebook.
Gopi is a founder member of Sankhya Technologies as a garage startup in the year 1996. Prior to 1996, he was a senior software engineer in the embedded software division of Mentor Graphics Corporation, where he was a member of a core team that created one of the industry's first C++ compilers for Motorola 68k processors. Gopi's work at Mentor resulted in 2 US patents.
He holds a Masters in Computer Science from Arizona State Univesity (1992-93) and a Bachelors in Computer Science and Engineering from College of Engineering,Guindy (1990).
Consumer electronic devices such as smart
phones, mobile internet devices, smart television sets, home devices are driving convergence of computing, networking, storage, media and communications to deliver emerging requirements of the consumer in the areas of education, work, food and healthcare for hundreds of millions of consumers around the globe. Building new successful consumer electronic devices is complex, amongst the most challenging and rewarding of the industrial activities today.
How can an organization or development team transform their understanding of consumer behavior and consumer needs into cutting-edge solutions delivered to the market profitably and ahead of competition ? How can an organization attain leadership in the market ? This talk will focus on discussing the principles of system level design, application of system level design to consumer electronics and the use of system level design platforms like Teraptor for building design innovation platforms.
TUESDAY February 28, 2012
SCV Consumer Electronics
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Career Networking Dinner
Organizers: Kiran Gunnam, Neeta Srivastav, Manuel Ilagan, Sanjeev Murthy
Time: Dinner and networking at 6:00 PM Cost: $15 Place: Sneha Restaurant, 1214 Apollo Way,
SUITE 404 B, Sunnyvale RSVP: from website Web: pacefeb2012.eventbrite.com
Come join us for a casual buffet dinner and meet with other engineers, managers and technologists in the Bay Area. If you are looking to expand your network, meet people in similar fields or backgrounds, this is a great event to do that. We hope to provide an opportunity to network, discuss your work with like-minded folks, exchange career opportunities with participants, and more!
To facilitate active conversation in making this short time most beneficial, please provide a description of your current/most recent job title during registration. We will try to set up groups of same-field folks.
Registration cost covers dinner. Indian buffet with Veg as well as non-Veg options will be served.
WEDNESDAY February 29, 2012 SCV PACE (Professional Activities Committee for Engineers)
• Patent application preparation, prosecution, IP Strategy • Enforcing, Licensing and Monetizing Patents • Broad Experience in many Electrical and Software arts • Our Experts: IEEE Fellow, SPIE Fellow, Technical and Legal Experts
Ph: 408-288-7588 www.StevensLawGroup.com
Email: [email protected]
1754 Technology Dr, #226 San Jose
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 16
Problems, Big Problems, and Damn Problems
Speaker: Jerry Talley, JLTalley & Associates Time: Networking at 6:00 PM; Forum at 6:30 PM;
Dinner at 7:15 PM; Presentation at 7:45 PM Cost: $10 for IEEE members; $13 for others ($3
more after 2/28) Place: RAMADA Silicon Valley, 1217 Wildwood
Ave, Sunnyvale RSVP: from website Web: www.ieee-scv-tmc.org
Jerry Talley has been helping people solve problems since he received his PhD in Sociology from Stanford in 1971. After 18 years on the faculty there, he moved onto organizational development. He has had 350+ engagements with clients in high tech, pharmaceuticals, hospitals and health care, banking and finance, consulting firms, the military, manufacturing, public utilities, public sector, not-for-profits, publishing, hospitality, entertainment, and biotech. His current focus is advanced problem solving, process design, and non-profit governance.
The challenges we give to engineers are often
quite formidable. But the domain of engineering is ultimately rational, bounded, and scientific. And then there's management. Suddenly we're faced with human vagaries, unbounded networks of association, political dynamics, interpersonal subtleties, and individual personality. And it's not enough to understand the company we work for; now there's supply chains, strategic alliances, outsourced functions, and industry associations. The world is much messier.
In fact, we face problems of greater complexity, greater interdependence, and often greater conflict than ever before. And yet we still live mostly within the same problem solving strategy we developed in the 1950's.
After 30+ years of consulting to organizations large and small, for non-profits and for-profits, for private sector and public sector, I now believe there are only 6 types of problems in the world. Each type requires a unique strategy for successful resolution. Each type requires different solution elements. The key to effective problem solving is not your ability to generate solutions; it's your ability to discern the essential nature of the problem at the beginning.
THURSDAY March 1, 2012
SCV Technology Management
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Overview of Radiation Sources for Extreme Ultraviolet Lithography
Speaker: Dr. Oleg Khodykin, KLA-Tencor Time: Networking/Light Dinner at 6:00 PM;
Presentation at 7:00 PM Cost: none Place: Keypoint Credit Union, 2805 Bowers Ave,
Santa Clara RSVP: from website Web: ewh.ieee.org/r6/scv/leos
Dr. Oleg Khodykin holds a doctorate and master degree, both in physics, from Moscow Physical-Technical Institute, Russia. Currently, he is employed at KLA-Tencor , as manager of EUV source development for next generation mask inspection tools. Prior joining KLA-Tencor, he spent 10 years at CYMER , working on experimental development and engineering of EUV source for lithography applications. He currently holds 25 patents related to EUV source development.
Next-generation lithography has become more
difficult with each succeeding dimensional shrink, and a transition to a shorter excitation wavelength, using an extreme ultraviolet (EUV) source is overdue. Unfortunately, the source remains the primary bottleneck; a minimum of 100W will be needed, with 250W for high volume production, to obtain the customary tool throughput. To date, only 30W of source power has been reported. Our speaker will discuss the two main types of EUV sources: one using laser excitation of a metal droplet to form a plasma (LPP), the other using an arc that vaporizes a plasma by a high energy electrical discharge (DPP) or related approaches. He will discuss the shortcomings of each approach. Then he will discuss the laser excitation source in more detail, and go into the engineering problems that need solved to increase the power, increase the system uptime, and bring the source into production.
TUESDAY March 6, 2012
SCV Photonics
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Improvements in Amplifier Design Using Lossless Feedback
Speaker: Dr. George Vendelin Time: Networking and snacks at 6:00 PM;
Presentation at 6:30 PM Cost: none Place: Agilent Technologies, 5301 Stevens Creek
Boulevard, Santa Clara RSVP: not required Web: http://www.ieee.org/go/mtt-scv
Dr. George Vendelin received his 3 degrees in EE from Stanford University: BSEE '59, MSEE '61, and EngEE '63, majoring in semiconductors. He worked at Texas Instruments 63-68, Signetics 68-72, Fairchild 72-74, Varian 74-75, Dexcel 77-79, Eaton 79-85, Avantek 85-89, and has consulted at numerous companies. He has taught at Stanford, Santa Clara University, San Jose State University, Univ CA Ext, National Taiwan Univ, National Central Univ, and elsewhere at the graduate EE level. He has written 3 books on Microwave/RF Design and has published about 150 technical papers.
There are three different microwave amplifiers
which benefit from lossless feedback:
(1) High Gain - Mason 1954 - where we achieve |S12| = 0 and the two-port gain is:
U = 1/2 |S21/S12 - 1 |^2 / k(S21/S12 - Re(S21/S12)
(2) Low Noise - Vendelin 1975 - where we achieve NFmin and |S11'| = 0 simultaneously, usually using an inductor in the emitter/source
(3) High Power - Zuo-Min Tsai et.al. April 2006 - where we achieve P1dBcmax and |S22'| = 0 simultaneously, usually using a capacitor in the emitter/source
Notice that (2) and (3) are duals of each other. All of these designs are fairly narrow band (>5%)
which is sufficient for many applications. Only linear S-parameters are needed. Nonlinear models should predict the same performance.
THURSDAY March 8, 2012SCV Microwave Theory and Techniques
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New Architecture for Next-Generation User-Centric
Mobile Device Speaker: Willie W. Lu, Technaut Intellectual Venture Time: Networking and Light Dinner at 6:30 PM;
Presentation at 7:00 PM Cost: $2 donation accepted for food Place: QualComm Santa Clara, Building B, 3165
Kifer Road, Santa Clara RSVP: not required Web: ewh.ieee.org/r6/scv/cas
Dr. Willie Lu was former consulting professor of Stanford University, member of FCC TAC, visiting professor of Chinese University of Hong Kong, chief architect of Infineon Technologies and is now adjunct professor of Zhejiang University of China with expertise in advanced wireless and mobile communications. He is worldwide well-known for his invented Open Wireless Architecture (OWA)® core technology which is being widely used in mobile handheld devices and portable devices by many Fortune 500 companies both in the Silicon Valley and global. He founded many world-class technology events including World Wireless Congress, Mobile World Congress, Global Mobile Congress, Open Mobile Summit and 4G Summit with over 100,000 global wireless professionals involved in his events. Dr. Lu started Intellectual Property Law in 2004 and has been practicing actively in US Patent Laws and Trademark Laws, and specialized in reviving the finally-rejected cases and evaluating the patent cases for both leading industries and start-ups. Prof. Lu is now also Chairman of Technaut Intellectual Venture and Principal Partner of Delson IPR Group with business in US, EU and China.
Prof. Lu has near 20 years’ experiences in mobile wireless technology, about 8 year’s in IPR laws and 15 years in international policies, government relations and regulatory affairs. He is senior advisor for many government authorities across the global and technical advisor for several IPR courts in US and EU.
The wireless transmission theory tells us that no
single wireless transmission technology can provide both broadband high-speed radio transmission and seamless fast mobility capability in a mobile fast-fading propagation model environment unless we reduce the mobile network capacity tremendously. Open Wireless Architecture (OWA) was proposed to balance the above requirements in commercial mobile communications with converged multiple air interfaces in a cost-effective and spectrum-efficient way.
Our research discovers that when the wireless transmission bandwidth is enough, the information processing consumes much more resources and energy than the transmission processing in the mobile device. If we can reduce the processing burdens in the mobile device including baseband signal processing, application processing and networking processing, the overall power consumption can be tremendously minimized and the terminal system can be simplified.
The OWA technology platform has secured enough transmission bandwidth by converging multiple wireless standards in one common platform so that the mobile device can be optimized for best-of-effort high-speed transmission. By employing a computer server with an IP address as the Virtual Mobile Server, we can configure this server as the mobile cloud serve to handle the processing tasks for the mobile device which becomes the mobile cloud client accordingly.
The OWA mobile cloud architecture tremendously reduces the processing tasks in the mobile device by pushing much processing tasks remotely and synchronously to the virtual mobile server through IP connection based on OWA network access control. The OWA mobile device is open to various carriers selected and optimized by mobile user. The OWA architecture also facilitates the next generation SIM system supporting multiple air interfaces and open OS virtual machine interface supporting multiple operating systems for the future mobile device.
This seminar relates to the next generation iPhone and Android smartphone evolutions, both in device systems and in wireless transmissions.
MONDAY March 12, 2012
SCV Circuits and Systems
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Topological Insulators for Electronics Device Applications
Speaker: Prof. Shoucheng Zhang, Physics Dept.,
Stanford University Time: Networking and pizza at 7:00 PM;
Presentation at 7:30 PM Cost: none Place: Western Digital, 1710 Automation Parkway,
San Jose RSVP: not required Web: www.ewh.ieee.org/r6/scv/mag
Prof. Shoucheng Zhang is the JG Jackson and CJ Wood professor of physics at Stanford University. He received his BS degree from the Free University of Berlin and in 1983, and his PhD from the State University of New York at Stony Brook in 1987. He was a postdoc fellow at the Institute for Theoretical Physics in Santa Barbara from 1987 to 1989 and a Research Staff Member at the IBM Almaden Research Center from 1989 to 1993. He joined the faculty at Stanford in 1993. He is a condensed matter theorist known for his work on topological insulators, spintronics and high temperature superconductivity. He is a fellow of the American Physical Society and a fellow of the American Academy of Arts and Sciences. He received the Guggenheim fellowship in 2007, the Alexander von Humboldt research prize in 2009, the Europhysics prize in 2010 and the Oliver Buckley prize in 2012 for his theoretical prediction of the quantum spin Hall effect and topological insulators.
Two dimensional (2D) topological insulators (TI) has been discovered in HgTe and InAs/GaSb systems. The edge states of the 2D are protected from back-scattering and can transport charge current without dissipation. In this talk, I discuss several possible device applications of this remarkable property.
TUESDAY March 13, 2012
SCV Magnetics
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So - What About Nuclear Energy?
Speaker: Dr. William (Bill) Halsey, Associate Program Leader for Advanced Nuclear Energy, Lawrence Livermore National Laboratory
Time: 6:30 PM Cost: $15 per person, includes buffet dinner Place: Willow Tree Restaurant, 6513 Regional St,
Dublin RSVP: By Monday, March 12, from the website Web: www.ieee4life.org
Dr. William (Bill) Halsey serves as Associate Program Leader for Advanced Nuclear Energy at Lawrence Livermore National Lab, and has been an engineer at the lab for over 30 years. He currently focuses on development of advanced nuclear energy technologies, and leads efforts in the Nuclear Fuel Cycle R&D at LLNL. This includes fuel cycles, spent fuel management, small modular fast reactors and fusion-fission hybrid systems. Through this work he seeks to enable the safe, secure and sustainable use of nuclear energy throughout the 21st century. Bill received his Ph.D. in Nuclear Engineering from the University of Michigan in 1980 and has Masters degrees in both Nuclear Engineering and Material Science. He has worked on the Yucca Mountain Project, the Laser Fusion Program, national defense programs and numerous international collaborations.
Nuclear fission currently provides a significant 'carbon free' contribution to both US and global energy needs. Despite the initial promise of nuclear energy, growth has been slow in recent decades (particularly in the US), and many dismiss its potential for the future. However, we are now seeing the first new orders for reactors in the US in 30 years, and dozens of new power reactors are being built around the world. This talk will address the current status and future potential of nuclear energy, including current constraints on growth and the potential technology developments that might enable nuclear to provide large-scale and long-term energy for society. Discussion topics include:
Safety of nuclear power plants (including insights
from Fukushima) Economics of nuclear energy Waste management options Scale and Sustainability vs alternatives Proliferation issues How about Fusion?
TUESDAY March 13, 2012OEB Life Members
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 22
Creating System-On-Chips: Mixing HW & SW Successfully
Speaker: Stuart Swan, Senior Architect Systems
Solutions Group, Cadence Time: Networking and refreshments at 6:30 PM;
Presentation at 7:00 PM Cost: none Place: Cadence, Bldg 10, 2655 Seely Ave, San
Jose RSVP: from website Web: sites.ieee.org/scv-cs
Stuart Swan is a Senior Architect in the Systems
Solutions Group at Cadence Design Systems, and has over twenty years of experience in the EDA industry. Mr. Swan helped create a number of new EDA tools at Cadence and has worked directly with SoC designers at large customers around the world to help them adopt new tools and methodologies. In the area of SoC modeling standards, he helped lead development of System-C and authored a book, served in the OSCI/Accellera board of directors, and was technical working group chairman for the IEEE SystemC LRM development. He has also been active in the development and standardization of the SystemVerilog OVM and UVM verification methodologies. Stuart graduated from Stanford University with a BSEE with honors.
The scale and complexity of chip design has
exploded in the last twenty years. Starting with a brief review of the hardware design
and verification techniques used over the last two decades, this presentation will explore how chips have evolved into System on Chips (SoCs), and will explore the emergence of new design and verification techniques to tackle the complexity of today’s SoCs, which frequently include multiple processors, embedded software, and complex communication protocols. We will then explore some new design and verification techniques for SoCs that are likely to become prevalent in the near future.
TUESDAY March 13, 2012
SCV Computer
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3D Chip Stacks: New Nano Thermal Interface Materials
Speaker: Srilakshmi Lingamneni, Mechanical
Engineering Department, Stanford University
Time: Buffet dinner at 6:00 PM; Presentation (no cost) at 6:45 PM
Cost: $20; $10 for fulltime students and currently unemployed engineers; $5 more at the door
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: from website Web: www.cpmt.org/scv
Srilakshmi Lingamneni received her B.Tech in Mechanical Engineering from Indian Institute of Technology, Madras in 2008 and M.S. in Mechanical Engineering from Stanford University in 2010. She is currently pursuing a Ph.D. in Mechanical Engineering at Stanford. She was a Stanford Mechanical Engineering department teaching assistant for the academic years 2008-2010. Her research interests include development of various thermal interface materials for thermal management in electronic chips, with a particular focus on materials for 3D integrated chips.
I will briefly present the broad spectrum of
research work being carried out at Stanford Microscale Heat Transfer Laboratory and discuss in detail the past work and future directions of research in nanostructured interface materials.
I will discuss the thermal challenges of 3D IC integration and new material requirements for thermal management in 3D packaging, and share the thermal conductivity data of aligned Carbon NanoTube (CNT)-polymer composites with high packing density (up to 20 Vol%) and also the technique used for these measurements. I will present a new technique that has been developed in our lab which can be used to measure the in-plane mechanical modulus of CNT films. I will also share with you the in-plane mechanical modulus data of various CNT films, single walled and multi walled, with film thicknesses ranging from 0.5 to 100 microns and the analytical model developed to explain the variation of the mechanical modulus with film thickness.
I will elaborate on the findings from the literature on various nanocomposites, carbon-based or otherwise. I will present the thermal conductivity data of nanofluids with CNTs, Graphene nanoplatelets and Aluminum Nitride particles in silicone oil and also the thermal conductivity data of the same in cured epoxy. I will contrast this data with predictions from effective medium theories.
WEDNESDAY March 14, 2012
SCV Components, Packaging and Manufacturing Technology
Channel Partner
Multiphysics, Multidisciplinary Engng CFD, Stress, Heat Transfer, Fracture Fatigue, Creep, Electromagnetics Linear/Nonlinear Finite Element Analyses Multi-objective Design Optimization BGA Reliability
Ozen Engineering (408) 732-4665
[email protected] www.ozeninc.com
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 24
Evolution and Future of Optical Transport Networks; Photonic Integrated Circuits
Speakers: Radhakrishna (Radha) Valiveti, Architect,
System Architecture Group; Abhijeet Deore, Sr. Manager, Product Marketing; Matthew Mitchell, Sr. Director, Optical Architecture - Infinera Corp
Time: Networking and refreshments at 6:00 PM; Presentations at 6:30 PM
Cost: none Place: Texas Instruments, Building E, 2900
Semiconductor Dr., Santa Clara RSVP: from website Web: www.ewh.ieee.org/r6/scv/comsoc/
Radhakrishna (Radha) Valiveti received his B. Tech degree in Electronics and Communication Engineering from the Indian Institute of Technology, Kharagpur, India. Subsequently, he earned his M.S. (Comp. Sc) from McGill University (Montreal, Canada), and a Ph.D. (EE) degree from Carleton University (Ottawa, Canada). Radha started his career by developing communication protocol software (e.g. X.25) at Philips (Montreal, Canada). Subsequently, at Nortel (Ottawa, Canada) he has architected and developed OSI protocols software for OSI Layers 2 through 5 (LAPD , CLNP, IS-IS, ES-IS, TP4, Session Layer) for Nortel’s line of optical network elements used to build SONET/SDH transport networks. In a later assignment at Nortel, Radha worked on defining the access network architecture in the Residential Broadband Access Group. Radha joined Fujitsu Network Communications (Richardson, Texas) in 1998, and has worked on the architecture and requirements for the Flashwave family of SONET/ATM hybrid ADMs, and the architecture of MPLS Pseudo-Wire (PW) based packet services for the Flashwave 9500 packet optical transport network element. Radha joined Infinera’s system architecture group in 2006. He is responsible for OTN support in Infinera’s DTN-X product. He also tracks and contributes to work in ITU-T SG15/WP3 questions Q9 (OTN Equipment) and Q11 (OTN signals and formats).
Abhijeet Deore is a Senior Manager, Solutions
Marketing at Infinera. His team is responsible for worldwide marketing of solutions built using Infinera’s broad range of products with a focus on data center and wholesale services market segments. His career spans over 13 years in the telecommunications industry having held several leadership positions in research and development prior to transitioning to a marketing focused function. Having
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Representatives from Infinera Corp will describe the
evolution of the ITU-T standardized Optical Transport Network (OTN), Super-Channels and future directions for DWDM based optical networks, and an overview of Photonic Integrated Circuits (PICs). The three presentations will be followed by a lively panel session, with audience participation via pre-submitted questions and live Q and A.
Topic: Overview of Optical Transport Network (OTN) Radhakrishna (Radha) Valiveti, Architect, System
Architecture Group The first generation of OTN standards were defined by
ITU-T Recommendation G.709 around the 1999-2001 timeframe. This generation of OTN standards supported SONET/SDH clients as their primary client signals. OTN standards have since undergone significant changes to support dominant Ethernet Client signals such as 1/10/40/100GE. The latest version of OTN standards are defined in G.709 [12/2009] and the key extensions include the support for the Ethernet client signals identified above, and a flexible rate ODU which can support client signals with arbitrary rates. At ITU-T, work has recently begun on the definition of the next generation of standard OTN containers. Infinera is actively tracking and contributing to the emerging optical network standards. The talk will provide a status of the OTN standardization effort in ITU-T and discuss the evolution of OTN networks – from pure TDM networks to ones that efficiently carry a mix of TDM/packet flows.
Topic: Super-channels and the Future of Optical
Networks Abhijeet Deore, Sr. Manager, Product Marketing Super-channels represent the future of the industry and
bandwidth evolution to beyond what 100G can deliver. We will discuss what super-channels are, if and why they might be needed, and their benefits. The presentation will also cover a realistic timeline for super-channels, key building blocks that could enable super-channels in a practical real-world implementation and technological challenges of increasing fiber capacity in absence of super-channels. We'll investigate whether the 100G coherent networks of now (and the near future) are well suited to evolving into super-channel optical networks. Super-channels are currently being discussed by the ITU-T SG15/WP2/Q6 standards group.
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WEDNESDAY March 14, 2012
SCV Communications
Patent Agent Jay Chesavage, PE
MSEE Stanford 3833 Middlefield Road, Palo Alto 94303
www.File-EE-Patents.com
TEL: 650-619-5270 FAX: 650-494-3835
March 2012 V is i t us a t w w w . e - G R I D . n e t Page 25
Speaker Biographies (continued)
joined Infinera in 2004, Mr. Deore led WDM embedded software development for 5 years. Over the past 2 years, he has led product marketing for Infinera’s Line System and DTN products lines. Prior to Infinera, Mr. Deore held systems development and product architecture positions at Ciena (2000 – 2004) and Alcatel-Lucent (1998 – 2000). He has contributed to the design and development of several successful switching and transmission products including Ciena’s CoreDirector and the Infinera DTN. Mr. Deore holds a Bachelor degree in Electronics and Telecommunications from the College of Engineering Technology, India. He also earned a Masters in Electrical and Computer Engineering from Duke University, Durham, N.C. In 2009, he completed his M.B.A from the Haas School of Business, University of California at Berkeley. He is a member of the IEEE and has contributed to several patents that have helped forward the evolution of telecommunication systems.
Matt Mitchell received his M.S and Ph.D degrees in
Electrical Engineering from Princeton University in 1995 and 1998 respectively. Upon finishing his Ph.D. he became a member of technical staff within the Advanced Development Department at Lucent Bell Laboratories working on high channel count DWDM transmission. In 2000, he become a member of technical staff at Corvis Communications serving as a technical lead in developing a next generation 10Gb/s DWDM long haul transport product. He has been with Infinera since mid 2001 and has contributed to numerous programs including optical architecture, hardware research and development, and the creation of optical system planning tools. He recently managed the hardware development team responsible for the next generation Infinera Line System (ILS2) product platform. He is currently a Senior Director managing the Optical Systems Architecture group. Dr. Mitchell is a member of the Optical Society of America, has co-authored more over 30 peer-reviewed publications and holds 16 patents in the area of optical transmission and nonlinear optics.
Program Description (continued)
Topic: Photonic Integrated Circuits (PICs) – Scaling
Next Generation Optical Networks Matthew Mitchell, Sr. Director, Optical Architecture
Commercially produced photonic integrated circuits (PICs) used in optical networking equipment was brought to the market in 2004. This important technological breakthrough drastically simplified the design of an optical networking solution, increasing the density of the platform so more bandwidth can be carried by a smaller, more efficient platform. Infinera’s first generation PICs integrate 62 optical components onto a pair of monolithic chips and deliver 100 Gigabits per second of bandwidth capacity. This was the first time the technique of large-scale monolithic integration was applied to commercial photonic chips. Today, Infinera has produced PICs delivering five times the capacity onto a single pair of chips, integrating more than 600 optical functions. This presentation will describe how InP PICs are used in optical networking solutions and the advantages of PIC-based optical networking platforms. InP based integrated circuits provide high optical performance relative to a silicon or hybrid silicon optical approaches.
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PV Panel Rollout: Reliability, Testing, Certification
Speakers: panel of speakers Time: Networking at 6:30 PM; Presentations at
7:00 PM Cost: none Place: Palo Alto Research Center, G.E. Pake
Auditorium, 3333 Coyote Hill Road, Palo Alto
RSVP: not required Web: www.ewh.ieee.org/r6/scv/pv
For current details on speakers for this meeting,
please visit the PV Chapter’s website.
WEDNESDAY March 14, 2012
SCV Photovoltaics
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Tour of Finelite High-Performance LED Facility
Speaker: Finelite Staff Time: 6:00 PM Cost: none (includes light dinner) Place: Finelite, Inc, 30500 Whipple Road, Union
City RSVP: from website Web:
meetings.vtools.ieee.org/meeting_view/list_meeting/10933
Presentation highlights: • Present "High Performance LED" • Quick review of Finelite's "Toward Net Zero Site"
to emphasize the Task Low Ambient story with templates using the luminaires
• Project examples using Task Low Ambient, presented by Finelite
• Time pending: tour of office and warehouse
THURSDAY March 15, 2012OEB Power & Energy
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Developing Mobile Apps for Fun and Profit
Speaker: Dave Wilson, independent consultant Time: 7:00 PM Cost: none Place: KeyPoint Credit Union, 2805 Bowers Ave.,
Santa Clara RSVP: not required Web: www.CaliforniaConsultants.org
Dave Wilson is an independent consultant in the areas of training and software development. He has created a number of native iPhone apps that are available though Apple's App Store. In addition to expertise in Objective-C and the iPhone SDK, he has development experience with many other object-oriented languages including Java, C++, Object Pascal, Smalltalk-80 and Prograph.
Dave has provided advanced programming training classes for Apple, Sun Microsystems, IBM, Xerox, Boeing and other major firms. He has developed or co-developed various software products, including a dataflow-based visual programming language for performing complex numeric and financial calculations, two C++ application frameworks, various Java tools for managing billing systems, and a Java-based prototype of an automated teller machine.
Dave's other software expertise includes distributed computing (including CORBA and Java RMI), GUIs, software development practices, framework design, Artificial Life technologies, Genetic Algorithms and Visual Programming Languages. He also has extensive experience as an Expert Witness, particularly with patents. Dave has a Ph.D. in Applied Physics from Stanford.
The mainframe of the '60s was overtaken by the
minicomputer of the '70s, which was then overrun by PCs in the '80's. The PC pretty much owned the rest of the 20th century.
But the future is here, and it ain't big iron or even a laptop PC. Smart phones and tablets are science fiction come alive, with multi-core processing, real-time photorealistic 3D rendering, a wealth of sensors, and even AI-based natural language speech recognition. Thousands of massive PC "application" dinosaurs are rapidly being replaced by hundreds of thousands of small, agile mammals known as "apps."
Dave Wilson started developing apps for the iPhone in 2008, and has been having great fun - and making a few bucks - ever since. He will talk about his experiences in developing and selling mobile
apps, and discuss what you need to know, and do, to jump into the business yourself.
Bring your questions and own experiences to a very interactive - and possibly heated - discussion about apps.
TUESDAY March 20, 2012
SCV Consultants' Network of Silicon Valley
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Novel Flexible Acoustic Devices Speaker: Prof. Tian-Ling Ren, Tsinghua University Time: Registration & light lunch 11:30 AM;
Presentation 12:00 Noon Cost: IEEE Members and Students $5. Non-
Members $10 Place: Texas Instruments Bldg E-1 CMA Room,
2900 Semiconductor Drive, Santa Clara RSVP: from website Web: www.ieee.org/nano
Tian-Ling Ren is professor at the Institute of Microelectronics, Tsinghua University, China. He is also a visiting professor at the Department of Electrical Engineering, Stanford University. He received his Ph.D. degree from Department of Modern Applied Physics, Tsinghua University in 1997. He has served as an Administrative Committee Member of IEEE Electron Devices Society, IEEE Distinguished Lecturer (DL), Chair of IEEE Electron Devices Society Beijing Chapter, and Council Member of Chinese Society of Micro-Nano Technology. His research area is new material based micro/nano devices, including MEMS/NEMS, memories, and flexible electronics. He has published more than 200 journal and conference papers and 40 has patents.
Nowadays, flexible electronic devices are getting
more and more attention for many potential applications. This talk is devoted to the fabrication and characterization of highly flexible acoustic devices. Based on nanostructured materials including graphene, silver nanowires, etc., novel flexible acoustic devices are proposed and developed. Unlike conventional acoustic devices, the novel devices emit sound without mechanical vibration. Moreover, they can be transparent with high reliability and flexibility and high performance characteristics. They show the great potential to be important components in flexible electronic systems.
TUESDAY March 20, 2012
SCV Nanotechnology
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Decentralization of Care: The Circle of
Enabling Technologies
Speaker: Gregory T. A. Kovacs, M.D., Ph.D.,
Stanford University Time: optional dinner at 6:15 PM; Talk at 7:00 PM Cost: none Place: Optional dinner is at Stanford Hospital
Cafeteria, 6:15 PM (no host, no reservations); presentation in Room M-114, Stanford University Medical School, Stanford
RSVP: not required Web: www.ewh.ieee.org/r6/scv/embs
Gregory T. A. Kovacs was born and raised in Vancouver, BC. He received a BASc degree in electrical engineering from the University of British Columbia, an MS degree in bioengineering from the University of California, Berkeley, a PhD in electrical engineering and an MD degree from Stanford University.
Since 1991 he has been a member of the Electrical Engineering faculty at Stanford University. His research areas include biomedical instruments and sensors, cardiac physiology, in vitro models for stem cell tissue repair, and medical diagnostics. He has co-founded several companies, including Cepheid in Sunnyvale, CA, a public company that develops and manufactures automated clinical nucleic acid diagnostics.
In 2003, he served as the Investigation Scientist for the debris team of the Columbia Accident Investigation Board, helping reconstruct the space vehicle to determine the cause of the mishap. From 2008 through 2010 he was Director of the Microelectronics Technology Office at the Defense Advanced Research Projects Agency (DARPA), leading his office’s investment of approximately $600M/year in high-risk/high-payoff projects in electronics, sensors, photonics and medical devices.
Kovacs is a Fellow of the IEEE and of the American Institute for Medical and Biological Engineering. He received the Office of the Secretary of Defense Medal for Exceptional Public Service in 2010. He is a pilot, scuba diver, mountain climber, and a Fellow National of the Explorers Club.
We are witnessing the ongoing decentralization of
medical care, and three intertwined technologies are enabling this. First, information technologies – storage, analysis and communication of medical data – have grown ever more powerful and cost-effective. Computational advances in healthcare are manifold and potent, appearing across the continuum of handheld devices through cloud resources. Second, smart medical devices enabled by embedded computation are poised to become ubiquitous in the clinic and home, allowing for both contextual monitoring and titration of care. Lastly, molecular diagnostics have rapidly progressed from slow and manual tasks for humans to automated, fast and data-rich instruments delivering effective, quantitative clinical insights. Such advanced medical devices and diagnostic systems are poised to create a tsunami of data, which will be managed, interpreted and mined via application and advancement of computers. This will in turn enable the next generation of devices and diagnostics. That self-perpetuating circle of enabling technologies is opening the door for huge benefits for both ill and healthy populations and is the inevitable outcome of applying modern electronics to the problems of medicine.
WEDNESDAY March 21, 2012
SCV Engineering in Medicine and Biology
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Electrical System SCADA in an Industrial Setting
Speaker: Nathan Bingham, P.E., Power Engineers,
Inc. Time: No-host social at 5:30 PM; Presentation at
6:15 PM; Dinner at 7:15 PM; Presentation continues at 8:00 PM
Cost: $25 for IEEE members, $15 for student and retired members; $30 for non-members
Place: Zio Fraedos, 611 Gregory Lane, Pleasant Hill
RSVP: by March 19 by contacting Michael Nakamura, [email protected] or telephone (510) 287-2066
Web: www.e-grid.net/docs/1203-oeb-ias.pdf
Nathan Bingham is a Senior Project Engineer at POWER Engineers, Inc with over 16 years of experience. He is a licensed professional engineer in the states of Idaho and Ohio. Mr. Bingham’s specialty is in design and implementation of substation SCADA and distribution automation systems. He is proficient with all aspects of design, system start-up, and project management. Recent assignments include –
• Working as SCADA Lead on two Tesoro Corporation projects: Kapolei Refinery Reliability Improvement and Golden Eagle Refinery Repower. Each project included adding a new master station, SCADA, and protection panels to create state-of-the-art refinery power supply SCADA systems.
• Working as an owner’s engineer and SCADA Lead for various independent power producers, overseeing the interconnection SCADA, substation SCADA, and CAISO interface when needed.
He has been an IEEE member for over 20 years. Publications include "Keys to Successful Substation Automation System Design," Utility Automation and Engineering/T&D, November/December 2004, p. 34 – 42, and “Distribution Automation Utilizes Unused Capacity and Eliminates Capital Expenditure,” presented at DistribuTECH Conference, 1999.
The electrical system is a critical piece of any industrial facility. Obviously, without electrical power, the facility cannot operate and produce its products. Monitoring the health of that electrical system is therefore critical as well. It is important to know as soon as possible about a fault or other shutdown. It is also critical to understand what caused that shutdown quickly and fully so that restoration can begin as soon as possible. Also, during the restoration, it is critical that a view of as much of the system as possible is available to maintenance personnel. This view gives them the information they need to quickly and safely bring the system back online. Finally, being able to control the electrical system from remote terminals can help restore the system quickly and improve personal safety.
The main components of a SCADA system include the IEDs that collect data from the electrical system. A communications processor or data concentrator is used to collect data from the IEDs and make it available to various data consumers. Finally, the HMI collects data from the communications processor and makes that data visible to operators giving them the information they need to safety and efficiently operate and maintain the electrical system.
This presentation will describe the components of a SCADA system and provide some examples of how this equipment has been deployed. It will also describe situations where the SCADA system has assisted operators in restoring service quickly and safely.
THURSDAY March 22, 2012
OEB Industry Applications
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1-day Seminar: Electrical Distribution Equipment
Spec Writing; and Short Circuit, Coordination and
Arc Flash Analysis
Instructors: Chris Lovin, Eaton Cutler Hammer; Gary Fox, General Electric; Jim Avery, IEM; Finn Schenck, Schneider Electric; Glyn Lewis, P.E., Applied Power
Time: Registration at 8:00 PM; class from 8:30 AM - 4:40 PM
Cost: $250 Place: Hilton Hotel, 7050 Johnson Dr., Pleasanton RSVP: Through EventBrite, at
sfias2012seminar.eventbrite.com Web: www.e-grid.net/docs/1203-sf-ias.pdf
Chris Lovin, Eaton, holds a BSEE from the University of Illinois and is a registered PE in the state of Illinois. With over 23 years at Eaton, Cutler Hammer/(Westinghouse) he has held positions in sales, marketing, operations as well as engineering.
Gary Fox, General Electric, received his BSEE from California Polytechnic State University, San Luis Obispo in 1978. A 32 year veteran of GE, he is currently a Senior Specification Engineer, providing application and technical support for power distribution and control equipment..
Jim Avery, IEM, received his BSME from University of Michigan. A sales engineer for 30 years, he has held a variety of positions with Westinghouse/Eaton, and currently is a Sales Engineer with IEM.
Finn Schenck, Schneider Electric (Square D Company), received his BSME from SJSU, Finn has 23 years experience supporting Square D Distribution and Control equipment customers. Finn is currently the West Coast National Account Manager for the Schneider Electric Data Center Solutions Team.
Glyn J. Lewis, P.E, graduated from the U of Wales Inst of Science and Technology. He joined GE in 1968 and worked in several positions until forming Applied Power in 1981. Glyn is a Member of IEEE, NFPA, NETA AND IAEI. Registered in California, Mr. Lewis has performed over 500 analytical studies on electrical distribution systems in the areas of short circuit analysis, coordination, load flow and motor starting. Mr. Lewis has been a principle instructor for many training seminars presented by General Electric Company in the fields of electrical safety, switchgear and protective relaying. He is a past IEEE San Francisco short course instructor on high voltage substation design, and has served various IEEE societies as an instructor for a variety of short courses and seminars since 1984.
Morning session (with Lovin, Fox, Avery, Schenck): We design electrical distribution equipment to perform
increasingly complex tasks. While the fundamental purpose of electrical distribution equipment is to safely distribute electrical power, customers require all levels of distribution equipment to perform increasingly complex switching, data acquisition, and automation tasks. As a result, we combine specifications in order to meet project needs. Unfortunately, doing so often provides conflicts in the specifications – leading to exceptions and clarifications that may not meet the engineer’s design intent. The presentation will focus on how to specify equipment that manufacturers can build, while adding the features that customers need.
We will review specifications for Medium Voltage switchgear and transformers, as well as low voltage switchgear & switchboards, LV transformers, and Panels. The purpose of this presentation is to provide the designer and engineer with an overview of how equipment interacts, how to specify features that the manufactures can actually provide, and understand how specifications can influence project cost and lead time. Suppliers are responsible for building safe, reliable equipment that applies to industry standards, while meeting the project requirements. Specifications should define required features, ratings, and performance needs, but since the equipment is manufactured per various Labels and Standards, many features are not available for modification. Specifications often attempt to define “how to build” a product, or add features that are in conflict with the standards under which the equipment is designed, manufactured, and tested. Additionally, specifications often combine proprietary features from multiple manufacturers. Finally specifications should not conflict with the drawings. Proposals often arrive with pages of clarifications that can cause significant issues for the project. Following this presentation, the attendee will understand how to write a clear, concise specification that will communicate project design needs, without adding requirements that lead to unnecessary clarifications, exceptions, added cost, and delays.
Afternoon Session (with Glyn Lewis):
The production of short circuit and coordination studies is now more of a science than an art, as in years gone by. The new science is the plethora of computer programs now available at comparatively low cost. These programs are produced by people who have rigorously studied the multitude of standards and incorporated their methodology into their programs. However, the longstanding problem of interpretation still exists and requires further knowledge of the hardware devices and their application standards. This afternoon presentation provides some guidelines in the analysis of the computed and graphical results of the study’s results. Emphasis will be placed upon selective tripping and implementation of arc flash safety programs.
FRIDAY March 23, 2012
SF Industry Applications
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Emerging Non-Volatile Memory Technologies: Full Day Symposium
Speakers: from UCB, Sandia, Stanford, UC-Merced,
Ariz State, more Time: Registration and talks 8: AM – 5:00 PM,
Light breakfast / lunch included Cost: IEEE Members $60, Non-Members $75,
Students $45. Add $15 at the door. Place: Texas Instruments Bldg E-1 CMA Room,
2900 Semiconductor Drive, Santa Clara RSVP: from website Web: www.ieee.org/nano
Confirmed Speaker List: Keynote: Dr. Stan Williams, HP Fellow
(Memristors) Dr. Stuart Parkin, IBM Fellow (Racetrack Memory) Prof. Matthias Wuttig, Head of the I.Institute of
Physics, RWTH Aachen (PCRAM), Prof. Tsu-Jae King Liu, Associate Dean of COE, UC
Berkeley (Mechanical Memory) Prof. I-Wei Chen, Skirkanich Professor, University
of Pennsylvania (Electronic switching memory)
Dr. Matthew Marinella, Group Leader, Sandia National Lab (Integration, oxide switches)
Prof. Steve Kang, Distinguished Chair Prof., Chancellor Emeritus, UC Merced(Memristive systems)
Prof. Philips Wong, Professor of Electrical Engineering, Stanford (PCRAM)
Dr. Robinson Pino, Senior Researcher, Air Force Research Lab (Physical intelligence)
Prof. Yoshio Nishi, prof. in the Department of EE and MSE , Stanford (oxide RRAM)
Prof. Michael Kozicki, Chief Scientist of Adesto and Prof. of Arizona State University (CBRAM)
Dr. Yiming Huai, VP of Avalanche Tech., Co-founder and former CTO of Grandis Inc (STT-RAM)
FRIDAY April 6, 2012
SCV Nanotechnology
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Simulating a Gaussian Process from Coin Flips: Stationary
Codes, Entropy, and Approximation
Speaker: Robert M. Gray, Stanford University Time: Networking and food at 5:30 PM;
Presentation at 6:00 PM Cost: none Place: Room 202 in Packard Bldg, Stanford
University, Stanford RSVP: not required Web: ewh.ieee.org/r6/scv/its
It is not possible to generate a Gaussian sequence by coding coin flips with one output symbol being produced for every flip. How close an approximation is possible, and how can it be achieved? Unsurprisingly, the problem is a variation on Shannon's rate-distortion theory. The simulation problem provides a distinct viewpoint, however, and leads to several interesting relations among stationary or sliding-block codes, Shannon entropy rate, and the transportation (Monge-Kantorovitch-Wasserstein-Ornstein etc.) distance measure on random processes. This talk is a survey of several of these ideas.
WEDNESDAY April 25, 2012
SCV Information Theory