grid.pdf grid.pdf may 2010(or read the book winner take all by elkus), -- paul note: this pdf...
TRANSCRIPT
M a y 2 0 1 0 w w w . e - g r i d . n e t P a g e 1
GRID.pdf GRID.pdf
May 2010
CHAPTER MEETINGS SF-IAS - 4/27 | Tier 4a Interim Emissions Standards - 751HP+ standby engines, installation guide ... [more]
SCV-CE - 4/27 | Gigapan: Tool for Image Manipulation - project details, create, stitch, pan, zoom, interface ... [more]
SCV-PSES+Rel - 4/27 | How to Avoid Being the Next Toyota - panel discussion, vulnerability, what do to, fundamental issues ... [more]
SCV-Mag - 4/29 | Biomagnetics: An Interdisciplinary Field where Magnetics, Biology and Medicine Overlap - weak brain fields ... [more]
SCV-SSC - 4/29 | Power-Efficient Data Converters - optimal resolution, noise sources, trade-offs, design examples ... [more]
SCV-CS+ComSoc - 4/29 | Faultline Brewery Social - Networking with food and beverage ... [more]
OEB-Mag - 4/30 | Biomagnetics: An Interdisciplinary Field where Magnetics, Biology and Medicine Overlap - impedance MRI ... [more]
SCV-RAS - 5/6 | Next-Generation MEMS Inertial Sensors - vehicles, consumer electronics, etching, wafer bonding, packaging ... [more]
SCV-TMC - 5/6 | Secrets of Successful Networking: Professional Networking for Engineering Professionals - connections, plan ... [more]
UCSC+NOVA - 5/7 | Take Your Career To the Next Level - Career Forum, using social media, transitioning ... [more]
SCV-EDS - 5/11 | Directions for Silicon Technology Development as We Approach the End of CMOS Scaling - tunneling, 15nm node... [more]
SCV-CS - 5/11 | Supercomputing at NASA: Current Impact, Future Challenges - fully-integrated, modeling, analysis, application porting ... [more]
SCV-EMC - 5/11 | How to Apply Shielded Cables to Solve More Problems than You Create - signal integrity, crosstalk ... [more]
SCV-CPMT - 5/12 | Winner Take All: How Competitiveness Shapes the Fate of Nations - industrial base, exports, America losing ... [more]
SCV-ComSoc - 5/12 | The Last Mile Smart Grid WAN Challenge Few Understand - matching load to supply, security issues, bandwidth ... [more]
OEB-IAS - 5/13 | Approaches to Arc Flash Hazard Mitigation - let-through energy, bolted fault, energy reduction ... [more]
OEB-Mag - 5/17 | Novel Magnetic Materials and Magnetic Devices - ferrites, magnetic films, nanoparticles, RF devices ... [more]
SCV-Phot - 5/19 | Half a Century of Lasers: How it All Got Started - Bell Labs, ARPA, Columbia, IBM, Hughes Research ... [more]
SCV-EMBS - 5/19 | Applying Therapeutic Device Innovation To Clinical Medicine: The Evalve Story - physician's perspective ... [more]
IEEE-USA - 5/20 | Link Your Business Plan to Your Financing Needs - Webinar (part 1 of 5): best market, strategy, minimizing capital ... [more]
SCV-CE - 5/25 | Electronics Manufacturing by Inkjet Printing - digital nature, passives, actives, particle size, viscosity ... [more]
SCV-Mag - 5/25 | Overview of Recent Developments in HAMR Technology - areal density, bit-patterned media, magnetic recording ... [more]
SF-IAS - 5/25 | Arc Flash Management and Technology & Plant Tour - safety, new approaches, technologies, minimizing risk ... [more]
May 27 and beyond – Next Page ==
Conference Calendar
May 16-21: Conference on Lasers and Electro-Optics (CLEO/QELS) - San Jose Convention Center [more]
May 18-19: Social Media Strategies Conference - Hyatt Regency Hotel, Santa Clara [more]
May 23-28: IEEE-MTT International Microwave Symposium - Anaheim Convention Center [more]
May 24-25: Netbook Summit - Hyatt Regency Hotel, SF Airport [more]
June 7-9: IEEE Int’l Interconnect Technology Conference - Hyatt Regency Hotel, SF Airport [more]
June 13-18: 47th Design Automation Conference (DAC) - Anaheim Convention Center [more]
June 21-25: TechConnect World Conference and Expo - Anaheim Convention Center [more]
July 19-23: O'Reilly Open Source Convention (OSCON) - Oregon Convention Center, Portland [more]
CALL FOR PAPERS: Nov 7-10: 44th Annual Asilomar Conf on Signals, Systems, and Computers - Pacific Grove [more] - Submit abstracts by June 1
Support our advertisers
MARKETPLACE – Services page 3 ProtoCase Custom Electronic Enclosures page 8
Career Development Professional Skills Courses [more] - Managing for Managers - Collaborative Negotiating - Managing Time and Multiple Priorities - and more
Technical Classes at UC-SC Extension [more]Packet Capture and Analysis - Perl Programming - SW Test Automation - Computer Networking Essentials. . . and more
Chapter Seminars SCV-MTT - 5/1 | Short Course: RF and Microwave Design for Future Technologies - full day [more]
SCV-Nano - 5/18-19 | Nanotechnology – State of the Art and Applications - 2-day symposium [more]
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 2
Your Networking Partner ®
May 2010 • Volume 57 • Number 5
IEEE-SFBAC ©2010
IEEE GRID is the monthly newsmagazine of the San Francisco Bay Area Council of the Institute of Electrical and Electronics Engineers, Inc. As a medium for news for technologists, managers and professors, the editorial objectives of IEEE GRID are to inform readers of newsworthy IEEE activities sponsored by local IEEE units (Chapters, Affinity Groups) taking place in and around the Bay Area; to publicize locally sponsored conferences and seminars; to publish paid advertising for conferences, workshops, symposia and classes coming to the Bay Area; and advertise services provided by local firms and entrepreneurs.
IEEE GRID is published as the GRID Online Edition residing at www.e-GRID.net, in a handy printable GRID.pdf edition at the end of each month, and also as the e-GRID sent by email twice each month to more than 24,000 Bay Area members and other professionals.
Editor: Paul Wesling IEEE GRID PO Box 2110 Cupertino CA 95015-2110 Tel: 408 331-0114 / 510 500-0106 / 415 367-7323 Fax: 408 904-6997 Email: edi tor@e-gr id.net www.e-GRID.net
Do you st i l l belong to one or more of IEEE’s
Societ ies? The IEEE has not iced that only about hal f of i ts members are also members of a Society – a “ technical emphasis” part of IEEE – and the percentage is dropping.
Some professionals, because of the modest expense of jo in ing a Society (usual ly about $20 to $40/year) , decide to "coast" in their careers by stopping their IEEE memberships and not acquir ing new technical informat ion from the wider community (eg, IEEE's Society publ icat ions, conferences, technical committees, network ing interact ions), preferr ing to r ide out the next 10 or 15 years to ret i rement.
Now, this doesn' t apply to everyone (and probably not to you) -- engineers MAY keep learning through other means, such as by at tendance at local chapter technical meet ings, or having access to IEEE's Xplore and i ts 2.6 mi l l ion documents and search resul ts through their company/ inst i tut ion or local l ibrary, and so don' t need to associate wi th any of the technical special t ies (Societ ies) d irect ly. But I s t i l l th ink the inc l inat ion to "coast" is there, when i t comes to deciding where to spend discret ionary t ime and funds.
Want to hear more about "coast ing"? Come to CPMT's SCV Chapter meeting on May 12 (or read the book Winner Take All by Elkus),
- - Paul
NOTE: This PDF version of the IEEE GRID – the GRID.pdf – is a monthly publication and is issued a few days before the first of the month. It is not updated after that. Please refer to the Online edition and Interactive Calendar for the latest information: www.e-GRID.net
DIRECTORS
Santa Clara Valley
Ram Sivaraman
Allen Earman
(Alt: Fred Jones)
Oakland East Bay
Victor Stepanians
Bill DeHope
San Francisco
Michael Butler
Dan Sparks
OFFICERS Chair: Allen Earman
Secretary: Bill DeHope Treasurer: Dan Sparks
IEEE-SFBAC PO Box 2110
Cupertino, CA 95015-2110
IEEE GRIDContinued from previous page …
CHAPTER MEETINGS
SCV-CPMT - 5/27 | Thermal Management for the Design of Telecom and Server Systems - CFD, testing, wind tunnels, plus lab tour ... [more]
OEB-Mag - 5/28 | Multiscale Magnetic Models - From Electronic Structure to Device Design - nanoscale structure, phase transition... [more]
SCV-CS+SSC - 6/8 | 48-Core Cloud Computer Chip - DDR3 memory, 6×4 2D-mesh packet-switched network-on-chip, power ... [more]
SCV-CPMT - 6/9 | Novel Fine Pitch, Low Profile, Low Cost Connector Technology - lithography, PCB-based, signal integrity, characteristics ... [more]
SCV-Nano - 6/15 | Nanophosphors: Lighting to Life Sciences - quantum confinement, surface-to-volume ratio, efficiency, stability ... [more]
OEB-IAS - 6/17 | Cyber Security for Industrial Control Systems - vulnerabilities, process monitoring, backbone systems ... [more]
OEB-Mag - 6/21 | An Investigation of Magnetic Reversal at Almost the Nanoscale - field-induced reversal, vortex, propagation ... [more]
SCV-Mag - 6/22 | An Investigation of Magnetic Reversal at Almost the Nanoscale - magnetic force microscope, vortex, propagation ... [more]
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 3
Patent Agent Jay Chesavage, PE
MSEE Stanford 3833 Middlefield Road, Palo Alto 94303
www.File-EE-Patents.com
TEL: 650-619-5270 FAX: 650-494-3835
Do you provide a service? Would you like more inquiries?
Access 25,000 engineers and managers IEEE Members across the Bay Area Monthly and Annual Rates available
Visit our Marketplace (page 3)
Download Rates and Services information: www.e-grid.net/docs/marketplace-f lyer.pdf
GRID.pdf
e-GRID
Professional Services Marketplace – [email protected] for information
Say you found them in our GRID MARKETPLACE
MET Laboratories
EMC – Product Safety
US & Canada
• Electromagnetic Compatibility • Product Safety Cert. • Environmental Simulation • Full TCB Services • Design Consultations • MIL-STD testing • NEBS (Verizon ITL & FOC) • Telecom • Wireless, RFID (BQTF & EPCglobal Test Lab)
Facilities in Union City and Santa Clara
www.metlabs.com [email protected] 510-489-6300
• 20 Years of Experience • Fortune 500 Companies • Microsoft .Net, C#, C++, Java, … • Software, Firmware, Middleware, Web Applications • SCM, QA, and much more Experience/Expert ise
www.esw.com [email protected] (408) 328-9240
● Customized ADCs, PLLs, I/Os, SerDes ● Analog/Mixed-Signal IC design services
www.mobilitysemi.com Ph: 408-738-5509
2953 Bunker Hill Lane #400, Santa Clara
Channel Partner
Multiphysics, Multidisciplinary Engng CFD, Stress, Heat Transfer, Fracture Fatigue, Creep, Electromagnetics Linear/Nonlinear Finite Element Analyses Multi-objective Design Optimization BGA Reliability
Ozen Engineering (408) 732-4665
[email protected] www.ozeninc.com
IEEE-CNSV Consultants' Network
of Silicon Valley
• Become a member • Find a Consultant • Submit a Project
CaliforniaConsultants.org
• Patent application preparation, prosecution, IP Strategy • Enforcing, Licensing and Monetizing Patents • Broad Experience in many Electrical and Software arts • Our Experts: IEEE Fellow, SPIE Fellow, Technical and Legal Experts
Ph: 408-288-7588 www.StevensLawGroup.com
Email: [email protected]
1754 Technology Dr, #226 San Jose
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 4
IEEE Professional Skills Courses
Transitioning from Individual Contributor to Manager
– Date/Time: Thursday, May 6, 8:30 AM – 4:30 PM – Location: – Brocade, San Jose
Fee: $400 for IEEE Members; $500 non-members
“10 out of 10! This workshop is one of the most effective workshops I have ever been to.”
Engineer Project Lead, Cypress Semiconductor
Managing Managers – Date/Time: Tues-Wed, May 18-19, 9 AM – 5 PM – Location: – TIBCO Software, Palo Alto
Fee: $625 for IEEE Members; $700 non-members
Clear Business, Technical, and E-Mail Writing
– Date/Time: Tues, May 25, 8:30 AM – 4:30 PM – Location: – Informatica, Redwood City
Fee: $425 for IEEE Members; $500 non-members
“Very practical and can use all lessons immediately in real life.” -Cisco, Manager
Upgrade your skill set – prepare for future challenges
During Microwave Week, there are 32 Workshops, 3 Short Courses, 98 Oral Sessions, 6 Interactive Forums, 9 Panel Sessions, and 13 Focused and Special Sessions to attend, in addition to the Exhibits. Be here!
Technical Papers Original research, development, and application work on radio-frequency and microwave theory and techniques, in the various areas within this broad discipline.
Sessions - Power-Amplifiers at HF, VHF, UHF, and GHz Signal Processing - Microwave Photonics and Low Noise Receivers - Guiding and Radiating Structures - Metamaterial Structures, Phenomena and Applications - Advanced Millimeter-Wave Packaging - MEMS Switches - Novel Techniques for Planar Filter Design - RF and Microwave in Medicine - Power Amplifier System Concepts - Microwave Photonic Technologies - RFID and power harvesting technologies - High-speed Signal Processing Circuits - Power Amplifier Circuits - Terahertz Electronics - MMIC Packaging - Silicon-based Millimeter-Wave Integrated Circuits - Active Device Modeling - Impact of Nanoelectronics on RF Technology - Advancements in Passive Circuitry - Biological Effects and Medical Applications of RF and Microwave - Non-Planar Passive Filters and Multiplexers … and many more.
Special Sessions Focused, honorary, and panel/rump sessions, dedicated to specific topics to allow an in-depth discussion of those topics.
SCV Chapters, Technology Management & Components, Packaging and Manufacturing Technology Societies
Managing Time & Multiple Priorities – Date/Time: Friday, June 11, 9:00AM-1:00PM – Instructor: Peter Turla – Location: Synopsys, Sunnyvale – Fee: $300 for IEEE Members; $350 non-members
This is the best class I have ever taken. Brilliant! Thoroughly enjoyed it and will recommend to all my colleagues.
eBay, Inc. Attendee
Presentation Skills – Date/Time: Tues, June 15, 9 AM – 5 PM – Location: – Cypress Semiconductor, San Jose
Fee: $500 for IEEE Members; $550 non-members
"I enjoyed this class very much. I thought it was very informative and useful. It really made me more aware
of how I can organize my time."
For complete course information, schedule, and registration form, see our website:
www.EffectiveTraining.com
May 23-28, 2010 Anaheim Convention Center Exhibition dates: May 25-27
Workshops From expert-level seminars to tutorials and short courses, aimed at various levels of expertise and interest. Topics include: - Software Defined Radio - Ultra-Wideband (UWB) Technology - High Speed Signal Integrity - MOSFET Modeling for RFIC Design - Power Management for Integrated RF Circuits - RF Packaging Solutions - Microwave Filter Synthesis - Making Reliable Measurements - RF MEMS For Antennas and Front Ends - Low Phase Noise Oscillators - The Expanding Role of GaN - Wireless Power Transmission - Optical Modulator Technologies… and many more.
Applications Seminars MicroApps, presented by industry speakers who will introduce recent developments in products and processes employed in fabrication, instrumentation, computer-aided design, and field deployment of technologies at the cutting edge.
Earlybird Rates thru May 7 – Members save $200
For more information, and to register:
www.ims2010.org
INTERNATIONAL
MICROWAVE SYMPOSIUM
Sponsored by IEEE MTT
2010
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 5
UCSC Extension offers practical engineering courses in Silicon Valley and online to help hardware, software and IT professionals develop and advance their skills. We are the largest professional engineering educator in Silicon Valley.
Check out our brand new facility at 2505 Augustine Drive, Santa Clara, near the Great America Parkway/ Bowers Ave exit off Hwy 101. This move makes our career-oriented courses even more accessible to the Silicon Valley engineering community. “Real-time" courses, and "real-world" instructors
– Take one course or a whole certificate.
Find out more. Request our Program Brochure with year-round Course Tables:
www.ucsc-extension.edu*
Subscribe to our topic-specific email Newsletters.
– 100's of sessions -- Practical tutorials – Expo Hall: latest tools, projects, services, products
The whole spectrum of open source, including Linux, MySQL, the LAMP stack, Perl, Python, Ruby on Rails, middleware, applications, cloud computing, and more -- always great keynotes, tutorials, and evening Birds-of-a-Feather sessions. Migrate from expensive commercial installations; explore innovations; analyze new tools & software; learn essential techniques & advanced tips.
Tracks: - Business - Cloud Computing - Community - Databases - Education - Government - Hardware - Java -Javascript - Mobile - Operations - Perl - PHP - Python - Ruby - Tools & Techniques
40 Short Courses, including: - PHP Quality Assurance - Android for Java Developers - 3D Animation with Blender - Advanced Vim - Mastering Perl - Building Native Mobile Apps Using Open Source - Get Started with the Arduino - The Gearman Cookbook - The Productive Programmer - Django Deployment - PostgreSQL Reloaded - Faster Python Programs - Practical Erlang Programming - Google App Engine - Drizzle in Depth - Catalyst 5.80 - Practical Python Patterns - Hands-on Cassandra
UPCOMING CLASSES FOR ENGINEERS – IN SANTA CLARA
Mixed Signal IC Verification with Verilog-AMS (22183) Starting May 8
Packet Capture and Analysis (1990) Starting May 11
Perl Programming I (2856) Starting May 17
Software Test Automation (4882) Starting May 24
Computer Networking Essentials (2458) Starting June 18
Embedded System-on-Chip Design Using Verilog (21959) Starting June 19
Smart Grid, Intro (22867) Starting June 21
Discount for early registration. Free Open House Event for Embedded Systems and VLSI Engineering Programs (22403) on June 9 .
To view the full spring catalog, visit
www.ucsc-extension.edu*
"Ground zero for the open source alpha geek tribe." Jon Udell, Infoworld
Rapid change presents opportunity as well as challenges. Open source isn't just about being cost-effective – it's leading in innovation. OSCON is five days jam-packed with everything open source—and the people who are moving it forward. Learn from those who have already done it.
Diamond Sponsor Platinum Sponsor Gold Sponsor OSCON welcomes everyone passionate about open source, from developers, designers, trainers, and programmers to sys admins, IT managers, hackers, and entrepreneurs.
Save $250 – Register by June 2.
Save an additional 20% off – use discount code os10iee at check-out and save.
www.e-grid.net/conf/oscon.html
July 19-23, 2010 Oregon Convention Center Portland
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 6
Social Media is the new enabler for business. It is becoming the touch point connecting all components of a business -- our customers, partners, suppliers and employees. Businesses of all types and sizes are leveraging social media for strategic and tactical initiatives. Attend, Learn, Plan.
Top Presentations: - Leveraging Social Media for Business - Tapping into the Power of Employees - Social Media Marketing - True Drivers of a Successful Strategy Best and Worst of Social Media Practices - Overcoming Objections - Branding, Reputation Management & Legal Issues - Thinking Vertically Across Social Media - - Tools For Social Media Marketing ... and more.
Who Should Attend: • Chief Marketing Officers • Social Media Strategists • Social Media Marketers & Online Advertisers • Online Community Managers • Interactive Agency Professionals • Search Engine Optimization Specialists • Web Marketers • e-Commerce Managers • Web Analytics Professionals • Corporate Communications & PR • Recruiting Professionals IEEE Electron Devices Society
The thirteenth annual IITC is sponsored by the IEEE Electron Devices Society as a premier conference for interconnect technology. IITC provides a forum for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exciting new science and technology. Sessions: - System Scaling - Systems and Interconnects - Process Integration - Materials And Unit Process - Back-End Memory & MEMS - Packaging, 3D & TSV - Reliability and Characterization - Novel Materials and Concepts - Plus poster sessions New Focus: Interconnect to Interconnections and Interfaces (for "More Moore" and "More than Moore" technologies)
-- Workshops: - How to Market your Business on Facebook
How you market your Facebook Fan Page to increase revenue, drive website visitors and create
brand awareness through customer engagement - How to Market on Twitter and YouTube
What You Will Learn: • How to create an effective Social Media strategy • How to measure the effectiveness of your social media strategy • Best practices to track, analyze, and improve your social media
marketing campaigns Optimization techniques to increase usage and engagement of
social media tools and applications • Trends and future direction of social media and how you can
best position your business to benefit.
Use coupon code "ieee2010" for $100 discount
For information and to register, visit
www.e-grid.net/conf/sms.html Short Course (Sunday, June 6) Topics: - Future Interconnects: Options, Challenges and Advances - Advanced Patterning Techniques for Interconnect Scaling - Plasma Process Challenges for Porous SiOCH Patterning - The Impact of Interconnect on Processor Architecture - Storage-Class Memory - Modeling Variation
Register for the full conference, or only the Short Course:
www.his.com/~iitc IITC invites companies to exhibit products, materials and analytical tools related to interconnect technology. Suppliers are also invited to participate in Supplier Seminars which will be offered in the evenings on June 8 and 9. Contact [email protected]
IEEE 2010 International Interconnect Technology Conference June 7-9, 2010 Hyatt Regency SF Airport Hotel, Burlingame
Leveraging Social Media to achieve your business goals
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 7
The Netbook Summit provides attendees
with pract ical information on the role of netbooks, using netbooks effect ively, developing software for netbooks, netbooks in education, making netbooks perform better, and expanding netbooks. Netbooks are small , thin, l ightweight and energy eff ic ient portable computers that have experienced explosive growth among consumers, students, and even business users looking for an easy to use, mobi le, and cost effect ive alternative to a ful l s ize notebook computer.. Netbooks/tablets are optimized to accommodate the user with a longer battery l i fe, and are l ightweight and less intrusive than a larger laptop. Convenience and cost are key factors for these products, making them ideal for students at any level as wel l as professionals in a variety of market segments that are continual ly on the go. Chal lenges facing netbooks: extending battery l i fe, improving graphics, simpl i fy ing loading of software, improving performance, providing software better-suited to the environment, and typical appl ications.
Join industry leaders from: Adobe, ARM, Asus, AT&T, Broadcom, CA, Dell, McAfee, Microsoft, Mozy, NVIDIA, Phoenix, Samsung, Skype, and Toshiba, as well as startups and new entries.
“The netbook has become one of the most popular
consumer devices in the market today, but its true potential has been limited by applications that are not optimized for its mobility and smaller screen size.” – Renee James, VP, Intel, September 2009
Sponsored by Dell, AMD, Toshiba and LAPTOP Magazine
Join the Revolution in Low-Cost Mobile Computing
Half-DayTutorials to bring you up to date on the latest developments - Nebooks in the Enterprise - Improving Netbook Performance - Networking Netbooks - Netbook Securi ty
Sessions - New Paradigms in Networks - Doing More with Netbooks - Netbooks in Education - Operating System Shootout (Windows, Linux, Android, Chrome, etc.) - Storage/Backup for Netbooks - Applications - Netbooks: The New Hub of Distr ibuted Computing - Processor Shootout (Atom, ARM, others) - Market Research
Panel: Netbook Report Card What Has Hap-pened in the Past Year; Where We Are Heading
Keynotes by NVIDIA, AMD, Dell , and Asus
Unique “Ask the Experts” session for one-on-one interaction
Shootouts on Processors, Operating Systems, Platforms
All Industry Reception (in Exhibi t Hal l)
Evening Open: - Beer, Pizza and Chat with the Experts - Kishore Jotwani, Atheros Communications; - Sasch Pallenberg, Netbook News; - Rob Halligan, Syncables; - Walker Blount, Web-Feet Research; - Don Ryan, CMB; - Mary Lasica and Linda Uhrenholt , AT&T; - Bob Morris , ARM; - Simon Hunt, McAfee
Free pass for Exhibits and Open Sessions
Discounts are available to qualified educators and government employees
Save $300 through May 19t h
www.netbooksummit.com
Special exhibitor packages st i l l available: contact Kat Pate, 505.238.3208, or
email [email protected]
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 8
CALL FOR PAPERS 44th Annual Asilomar Conference on Signals, Systems, and Computers
Asilomar Hotel and Conference Grounds Pacific Grove, California
November 7-10, 2010 www.asilomarssc.org
Authors are invited to submit papers before June 1st, 2010, in the following areas:
Submissions should include a 50 to 100 word abstract and an extended summary (500 to 1000 words, plus figures). Submissions must include the title of the paper, each author's name and affiliation, and the technical area(s) in which the paper falls with number(s) from the above list. Check the conference website (www.asilomarssc.org) for specific information on the electronic submission process. Submissions will be accepted starting February 1, 2010. No more than FOUR submissions are allowed per contributor, as author or co-author. All submissions must be received by June 1st, 2010. Notifications of acceptance will be mailed by mid August 2010, and author information will be available on the conference website by late August 2010. Full papers will be due shortly after the conference and published in early 2011. All technical questions should be directed to the Technical Program Chair, Dr. Miloš Doroslovački, e-mail [email protected], or the General Chair, Dr. Linda DeBrunner, e-mail [email protected].
CONFERENCE COMMITTEE
General Chair: Linda DeBrunner, Florida State University Technical Program Chair: Miloš Doroslovački, The George Washington University Conference Coordinator: Monique P. Fargues, Naval Postgraduate School Publication Chair: Michael Matthews, ATK Mission Research Publicity Chair: Murali Tummala, Naval Postgraduate School Finance Chair: Frank Kragh, Naval Postgraduate School
The site for the 2010 Conference is at the Asilomar Conference Grounds, in Pacific Grove, CA. The grounds border the Pacific Ocean and are close to Monterey, Carmel, and the scenic Seventeen Mile Drive in Pebble Beach.
The Conference is organized in cooperation with the Naval Postgraduate School, Monterey, CA, and ATK Mission Research, Monterey, CA. The IEEE Signal Processing Society is a technical co-sponsor of the conference.
9. Compressive Sensing, 10. Information Theoretic Signal Processing, 11. Spectral Analysis F. Biomedical Signal and Image Processing: 1. Medical Image Analysis, 2. Imaging Modalities, 3. Advances in Medical Imaging, 4. Biomedical Signal Processing, 5. Biomedical Applications, 6. Bioinformatics, 7. Image Registration and Multi-modal Imaging, 8. Image Reconstruction, 9. Computer Aided Diagnosis, 10. Functional Imaging, 11. Visualization G. Architecture and Implementation: 1. Programmable and Reconfigurable Architectures, 2. SOC Architectures, 3. Low-power Methods, 4. Compilers and Tools, 5. Integrated Algorithm and Architecture Implementation, 6. Computer Arithmetic, 7. Numerical Processing H. Speech, Image and Video Processing: 1. Speech Processing, 2. Speech Coding, 3. Speech Recognition, 4. Narrowband / Wideband Speech and Audio Coding, 5. Document Processing, 6. Models for Signal and Image Processing, 7. Image and Video Coding, 8. Image and Video Segmentation, 9. Image and Video Analysis, 10. Image / Video Security, Retrieval and Watermarking, 11. Image and Video Enhancement / Filtering, 12. Biometrics and Security, 13. Wavelets
A. Communications Systems: 1. Error Control Coding, 2. CDMA, 3. Modulation and Detection, 4. Performance Bounds, 5. Synchronization, 6. Ultra Wideband, 7. OFDM / Multicarrier, 8. Wireless Communications, 9. Optical Communications, 10. Cognitive SDR, 11. Adaptive Waveform Design B. MIMO Communications and Signal Processing: 1. Space-Time Coding and Decoding, 2. Channel Estimation and Equalization, 3. Multi-User and Multi-Access Methods, 4. Cooperative Diversity. C. Networks: 1. Transmission Techniques for Ad Hoc Networks, 2. Wireless Sensor Networks, 3. Network Information Theory, 4. Optical Networks D. Adaptive Systems and Processing: 1. Adaptive Filtering, 2. Fast Algorithms for Adaptive Filtering, 3. Frequency-Domain and Subband Adaptive Filtering, 4. Adaptive Blind Processing E. Array Processing and Statistical Signal Processing: 1. Array Processing and Beamforming, 2. Sonar and Acoustical Array Processing, 3. Radar Array Processing, 4. Remote Sensing, 5. Signal Separation, 6. Estimation and Detection, 7. Non-Gaussian and Nonlinear Methods, 8. Identification,
May 2010 Visit us at www.e-GRID.net Page 9
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 10
Over 150 sessions 16 Short Courses (June 21)
TechConnect World brings together over 5,000 business and technical professionals including leading researchers, entrepreneurs, corporate business developers, investors, service providers, commercialization/tech transfer officers, industry analysts and members of the media. Five world-class events combine to create an extraordinary week where innovative technology solutions are matched to real world business challenges.
FOCUS AREAS: CleanTech: Power Electronics, Photovoltaics, Energy Storage, Renewable Energy, Infrastructure.
NanoTech: Fabrication, Characterization, Tools, Materials, Electronics & Microsystems, Medical & Biotech.
MicroTech: MEMS, NEMS & Sensors, Micro Fluidics, Life Sciences, Fabrication, Packaging.
Business Program: selected cleantech business, policy & strategy panels
Power & Storage: solar, bio, wind, geo, marine, oil, gas, coal, nuclear, storage
Smart Grid & Infrastructure: smart grid, water, sustainable cities & communities
Sustainable Industries: chemistry, buildings, transportation, electronics, waste, emissions
Ventures, Investment & Partnering: early stage venture forum, IP showcase, corporate partnering
... and more.
EXHIBITION: Over 400 leading companies, organizations, universities and international pavilions will be exhibiting at the TechConnect World Expo. Exhibitors will include equipment manufacturers and suppliers, systems providers, finance and investment firms, R&D companies, project developers, trade associations, and government agencies focusing on nanotechnology, clean technology and biotechnology solutions.
TechConnect Innovation Showcase
“Transforming The World One Technology At A Time”
The largest innovation showcase dedicated to technologies still in development! Find partners to help make your organization’s technology breakthrough a commercial reality. Modeled on the incredible success of the ARPA-E Energy Innovation Showcase in Washington, DC, this past March, TechConnect World is extending this opportunity to the West Coast and to a broader range of technology solutions. SESSIONS: - Decarbonizing Traditional Energy - Smart Grid - Clean Alternative Fuels - Solar: Nanostructured Materials for PV - Creating the Smart Building - Utility Technology Challenge - Bio Energy - Carbon Capture and Power Generation - Supercapacitors - Green Building & Grid - Government Commercialization Funding - Energy Storage: Hydrogen Technologies - Energy Storage & Conversion - Novel Solar Technologies - Managing Peak Power - Creating Infrastructure for EV ... and many more
SHORT COURSES: - Renewable Energy - Energy Storage & Conversion - Water Cleantech - Carbon Markets & Offset Project Development - Photovoltaics - Green Building: Technologies & Opportunities - Carbon Nanotubes: Technology & Applications - Functional Nanoparticles & Films: Technology & Applications - Microfluidics for Biotechnology - Polymer Nanoparticles: Synthesis & Applications - Nanotechnology for Medical Diagnostics and Treatment - Soft Nanotechnology: Industrial Applications - Nanoscale Characterization Techniques and Applications - Nanocomposites: Processing & Applications - Technology Commercialization - Bio Nano Materials & Tissues: Technology & Applications
Earlybird Rates – save, through May 1st
Full program and registration:
www.TechConnectWorld.com
Matching Innovative Solutions to Real-World Challenges June 21-24, 2010, Anaheim, CA
Anaheim Convention Center
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 11
36 Short Courses, over 200 Sessions Research, Development, Applications
CLEO/QELS is the leading event for early-stage lasers and electro-optics, with a peer-reviewed program second to none, and the most important technical developments -- basic research in electro-optics, innovative developments in laser science, and commercial applications in photonics. The revamped Applications Program focuses on the demonstration of components, systems, and emerging applications of lasers and electro-optical technology.
Hot Topics: - Laser Beam Analysis - Optical Interactions with Cold Atoms - Biophotonics and Optofluidics - Cavity QED and Optomechanics - LEDs, Photovolatics and Energy-Efficient ("Green") Photonics - Ultrafast Optics, Optoelectronics and Applications - Semiconductor Lasers
Short Courses: - Micro- and Nano-Photonics Devices - Solid-State, Liquid and Gas Lasers - Terahertz Technologies - Ultrafast Optics - Biophotonics & Optofluidics - Lightwave Communications... & many more.
Register online for the full technical conference and short courses.
If you can only attend one event this year, the ESC Silicon Valley is the must-attend event for embedded systems engineers. ESC is the largest gathering of 250+ exhibitors showcasing the latest embedded technologies available today.
Embeddy Awards Access to Live Product Teardowns Exhibits (Tuesday, Wednesday, Thursday)
Customize your educational experiences by selecting from over 250 sessions in 22 tracks specific to your interests.
Tracks: ● Build Your Own Embedded System ● Green Engineering ● Aerospace and Military ● Real-Time Development ● Designing with Open-Source Software ● Developing for Windows Embedded ● SW Debugging Techniques ● Internet/Telecom ● Medical (and more)
The 5th annual Multicore Expo will be co-located with ESC Silicon Valley and will provide 3 days of dedicated multicore technology training options and multicore-related exhibits.
Technical Tracks Headliners Multicore Expo Pavilion Tracks: ● Multicore Architectures and Processors ● Multicore Development and Design Tools ● System-Level Multicore Implementations ● Hypervisors and Operating Environments
Free Exhibit Pass Plus! Access to:
Over 300 exhibitors (Tues – Thurs)
Technical Business Program: Market Focus, Technology Transfer events (Tues – Thurs) Market Focus promotes dialogue among researchers, developers and users on emerging market trends and business development. [more] The Technology Transfer Program offers a “one-stop” opportunity to learn about the latest optic and photonic technologies coming from Universities & Government Labs.
Job Fair (Tues, Wed)
CLEO/QELS Plenary Sessions (Mon, Wed)
LaserFest Events celebrating the 50th anniversary of the laser (Sun – Thurs)
CLEO/QELS Poster Sessions (Tues, Wed)
Register today for your free Exhibit Pass Plus!
www.cleoconference.org
San Jose McEnery Convention Center
Keynote Speakers Dr. Michio Kaku, Theoretical Physicist & Science
Popularizer Richard Templeton, Chairman, President, CTO,
Texas Instruments Jason Wolf, Vice President, Better Place
Flexible Registration Packages • 1-day, 3-day, or the 4-day All-Access Pass value • Free Exhibits Pass (with Keynote and sponsored sessions) • Choose exactly what suits your needs and schedule • Group rates – bring your team (save up to 25%)
For more information:
www.embedded.com/esc/sv
EMBEDDED SYSTEMS CONFERENCE
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 12
DAC is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. The DAC technical program is made up of tutorials, workshops, Pavilion panels and dozens of technical sessions divided into 12 Topical Areas, plus keynotes, panels, and over 200 exhibits.
See the listing of Keynote Speakers, Workshops, highlights ofTracks and
Sessions , etc, in the next GRID.
Workshops and Colocated Events:
• International Workshop on Diagnostic Services in Network-on-Chips
• NASA/ESA Conference on Adaptive Hardware and Systems
• Workshop on Mobile and Cloud Computing
• Workshop on Synergies between Design Automation and Smart Grid
• Workshop on Bio-Design Automation
• Workshop on System-Level Interconnect Prediction
• 4th IEEE International Workshop on DFM&Y
• High-Level Design, Validation and Test Workshop
• Symposium on Hardware-Oriented Security and Trust
• Workshop on Logic and Synthesis
• Symposium on Application-Specific Processors
• Symposium on Nanoscale Architectures
Sponsors
Over 50 research paper sessions arranged
in six parallel tracks User Track, with papers and posters on
tool use and methodologies Pavilion panels DAC User Track: With its focus on significant contributions from the EDA tool user community, this track shares challenges and benefits of tool usage and provides educational and networking benefits for end users as well as tool developers. The User Track differs from vendor-specific user forums in that it is not tied to a specific EDA vendor. Presentations highlight the challenges and benefits of EDA tool usage, including tools from EDA vendors, tools developed in-house, and combinations.
Exhibits: Exhibitors, you should know that DAC is a great showcase for your products. It's the one place you have to be. Attendees comprise thousands of highly qualified decision-makers from leading semiconductor, telecom, and consumer electronics companies and related organizations, including: * Design Engineers * Corporate and Engineering Management * Developers and Researchers * Financial and Industry analysts * Media Professionals
Substantial discount for IEEE and ACM members, students
Access the Advance Program on the website:
www.DAC.com
47th Design Automation ConferenceAnaheim Convention Center June 13-18, 2010
Where The Electronic Design Community Meets…
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 13
Tier 4a Interim Emissions Standards
Speaker: Armen Kludjian, Peterson Power Systems Time: Social at 5:30 PM; Presentation at 6:00
PM; Dinner at 7:00 PM Cost: $30; student members $10 (pay at the
door) Place: Sinbad’s Restaurant, Pier 2 The
Embarcadero, San Francisco RSVP: Please email Frank Sylvester,
[email protected] for reservations and to qualify for the drawing
Web: www.e-grid.net/docs/1004-sf-ias.pdf
For more than 20 years Armen Kludjian of Peterson Power Systems has been designing, selling and applying Generator Systems, Paralleling Switchgear and Flywheel UPS for Hospitals, Data Centers, and Water Treatment Plants from 80kW to 3MW, with voltage ranges of 208V, 480, 4160 and 12kV.
1) Beginning January 1, 2011 the EPA kicks off
new tighter emission standards. 2) Our presentation will focus on the 751HP and
above Standby Engines. 3) Action is currently pending at the state level and
the information presented is extremely timely. This presentation will be generic in nature and
questions from participants are encouraged. Copies of Caterpillar’s “Application and Installation Guide" will be handed out to all attendees.
TUESDAY April 27, 2010
SF Industry Applications
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 14
How to Avoid Being the Next Toyota
Speakers: Ken Kapur, KLA-Tencor); Eugene Heil,
Lewis Bass Intl.; Mike Silverman, Ops A la Carte LLC; Fred Schenkelberg, Ops A La Carte LLC
Time: Networking and pizza/drinks at 6:00 PM; Presentation at 6:30 PM
Cost: none Place: Applied Materials, Bowers Café, 3090
Bowers Ave., Santa Clara RSVP: From the website (so we have a pizza
count) Web: www.ewh.ieee.org/r6/scv/pses
An exploratory discussion on what companies can do to avoid being the next Toyota (NOT a root cause analysis). Will discuss the vulnerability of any high profile company having a major issue such as this. Even when Toyota fixes this particular issue, there is still something more fundamental they need to address to see that this type of thing doesn't happen again.
This will be a panel discussion with 3 speakers; Ken Kapur will moderate the panel.
TUESDAY April 27, 2010
SCV Product Safety Engineering, with Reliability
MET Laboratories
EMC – Product Safety
US & Canada
• Electromagnetic Compatibility • Product Safety Cert. • Environmental Simulation • Full TCB Services • Design Consultations • MIL-STD testing • NEBS (Verizon ITL & FOC) • Telecom • Wireless, RFID (BQTF & EPCglobal Test Lab)
Facilities in Union City and Santa Clara
www.metlabs.com [email protected] 510-489-6300
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 15
Gigapan: Tool for Image Manipulation
Speaker: Rich Gibson, NASA Ames Time: Networking and pizza at 6:30 PM;
Presentation at 7:00 PM Cost: $5 for IEEE members; $10 for non-
members (pay at the door) Place: nVIDIA, Building E, 2800 Scott Blvd., Santa
Clara RSVP: From the website Web: www.ewh.ieee.org/r6/scv/ce
Rich Gibson is a hacker, programmer, artist, writer, and photographer who has been working with computers for fun and profit since 1976. He coauthored Mapping Hacks and Google Maps Hacks for O'Reilly, and has long been fixated on the power of words and images to create compelling narratives. He now works for the GigaPan project helping to create new ways of extending the power of high resolution pan and zoom images for scientific, educational, artistic, and storytelling.
The GigaPan project provides multiple tools to create and stitch multiple images (or mosaics of images) to create Gigapixel and larger images which can be explored with a pan and zoom interface at gigapan.org. The experience of looking at a Gigapan image is more like exploring a new space than of looking at a conventional photo or video. You look at a picture, you watch a movie, but you actively explore a GigaPan. The talk will describe the history of the project, and then show examples of work which has been done with the tools both on and off our world, and looking at things from human scales to the near nanometer scale.
Rich will bring an Epic Pro and the last model of the Epic and/or Epic 100.
TUESDAY April 27, 2010
SCV Consumer Electronics
Patent Agent Jay Chesavage, PE
MSEE Stanford 3833 Middlefield Road, Palo Alto 94303
www.File-EE-Patents.com
TEL: 650-619-5270 FAX: 650-494-3835
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 16
Biomagnetics: An Interdisciplinary Field where Magnetics, Biology
and Medicine Overlap
Speaker: Prof. Shoogo Ueno, University of Tokyo, and 2010 IEEE Magnetics Society Distinguished Lecturer
Time: Networking and pizza at 7:00 PM, Presentation at 7:30 PM
Cost: none Place: Western Digital, 1710 Automation Parkway,
San Jose RSVP: Not required Web: ewh.ieee.org/r6/scv/mag
Ueno Shoogo Ueno received the B.S., M.S. and Ph.D. degrees in electronic engineering from Kyushu University, Fukuoka, in 1966, 1968, and 1972, respectively. Dr. Ueno was an associate professor with the Department of Electronics, Kyushu University, from 1976 to 1986. From 1979 to 1981, he spent his sabbatical with the Department of Biomedical Engineering, Linkoping University, Sweden, as a guest scientist. He subsequently served as a professor in the Department of Electronics, Kyushu University (1986-1994) and in the Department of Biomedical Engineering, Graduate School of Medicine, University of Tokyo (1994-2006). In 2006 he retired from the University of Tokyo as professor emeritus. Since 2006 he has been a professor with the Department of Applied Quantum Physics, Graduate School of Engineering, Kyushu University, and is also dean of the Faculty of Medical Technology, Teikyo University, Fukuoka.
Dr. Ueno is a Fellow of the IEEE and of the American Institute for Medical and Biological Engineering. He is a Fellow and Member-at-Large of the Governing Council of the International Academy for Medical and Biological Engineering. He was an elected member of the IEEE Magnetics Society Administrative Committee (2004-2009), President of the Bioelectromagnetics Society (2003-2004), Chairman of the International Union of Radio Science’s Commission K on Electromagnetics in Biology and Medicine (2000-2003), President of the Japan Biomagnetism and Bioelectromagnetics Society (1999-2001), and President of the Japanese Society for Medical and Biological Engineering (2002-2004). He received the Doctor Honoris Causa from Linkoping University (1998). He was a 150th Anniversary Jubilee Visiting Professor at Chalmers University of Technology, Sweden (2006), and a visiting professor at Simon Frasier University, Burnaby, Canada (1994) and Swinburne University of Technology, Hawthorn, Australia (2008).
Biomagnetics is an interdisciplinary field where magnetics, biology and medicine overlap. It has a long history since 1600, when William Gilbert published his book De Magnete. Recent advances in biomagnetics have enabled us not only to detect extremely weak magnetic fields from the human brain, but also to control cell orientation and cell growth by extremely high magnetic fields. Pulsed magnetic fields are used for transcranial magnetic stimulation (TMS) of the human brain, and both high frequency magnetic fields and magnetic nanoparticles have promising therapeutic applications for treatments of cancers and brain diseases such as Alzheimer’s and Parkinson's. On the imaging front, magnetic resonance imaging (MRI) is now a powerful tool for basic and clinical medicine. New methods of MRI based on the imaging of impedance of the
human body, called impedance MRI, and the imaging of neuronal current activities in the human brain, called current MRI, are also being developed.
This lecture focuses on the advances in biomagnetics and bioimaging obtained mostly in our laboratory in recent years. The lecture describes: (1) a method of localized magnetic stimulation of the
human brain by TMS with a figure-eight coil; (2) magneto-encephalography (MEG) to measure extremely weak magnetic fields produced from brain electrical activity using superconducting quantum interference device (SQUID) systems; (3) impedance MRI and current MRI; (4) cancer therapy and control of iron-ion release from, and uptake into, ferritin, an iron-storage protein, by using both high frequency and pulsed magnetic fields and magnetic nanoparticles; and (5) magnetic control of biological cell orientation and cell growth by strong static magnetic fields. These new biomagnetic approaches will open new horizons in brain research, brain treatment, and regenerative medicine.
THURSDAY April 29, 2010SCV Magnetics
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 17
Power-Efficient Data Converters Speaker: Prof. Franco Maloberti (Distinguished
Lecturer of the Solid State Circuit Society and Fellow of IEEE)
Time: Networking and pizza at 6:00 PM, Presentation at 6:30 PM
Cost: Small donation to cover food Place: National Semiconductor Building E
Auditorium, 2900 Semiconductor Dr., Santa Clara
RSVP: Not required Web: www.ieee.org/scv/ssc
Prof. Franco Maloberti received the Laurea degree in physics (summa cum laude) from the University of Parma, Parma, Italy, in 1968, and the Doctorate Honoris Causa in electronics from the Instituto Nacional de Astrofisica, Optica y Electronica (Inaoe), Puebla, Mexico, in 1996. He was the TI/J.Kilby Chair Professor at the Texas A&M University, and the Distinguished Microelectronic Chair Professor at the University of Texas at Dallas. He was a Visiting Professor at The Swiss Federal Institute of Technology (ETH-PEL), Zurich, and at the EPFL, Lausanne. Presently he is Microelectronics Professor, Head of the Micro Integrated Systems Group, University of Pavia, Italy and Honorary Professor, University of Macau, China SAR. His professional expertise is in the design, analysis, and characterisation of integrated circuits and analog digital applications, mainly in the areas of switched-capacitor circuits, data converters, interfaces for telecommunication and sensor systems, and CAD for analog and mixed A/D design. He has written more then 400 published papers on journals or conference proceedings, four books, and holds 30 patents. Prof. Maloberti was the recipient of the XII Pedriali Prize for his technical and scientific contributions to national industrial production, in 1992. He was co-recipient of the 1996 Fleming Premium, IEE, the best Paper award, ESSCIRC-2007, and the best paper award, IEEJ Analog Workshop-2007. He received the 1999 IEEE CAS Society Meritorious Service Award, the 2000 IEEE CAS Society Golden Jubilee Medal, and the IEEE Millenium Medal. Dr. Maloberti was Vice-President, Region 8, of the IEEE Circuit and Systems Society (1995-1997), Associate Editor of IEEE-Transaction on Circuit and System-II 1998 and 2006-07, President of the IEEE Sensor Council (2002-2003), member of the BoG of the IEEE-CAS Society (2003-2005) and Vice-President, Publications, of the IEEE CAS Society (2007-2008). He is Distinguished Lecturer of the Solid State Circuit Society and Fellow of IEEE.
Portable and nomadic systems require developing
power effective and power aware design methodologies for either analog or digital circuits. For data converters, low power and optimal resolution imply a favorable allocation of the noise budget. The noise comes from different sources: quantisation, sampling, clock jitter, spur interference and board interference. The distribution of the available noise power, that becomes lower and lower as the supply diminishes, depends on the specification of the system and it may require one or more extra-bits in the data converter. The noise budget issue is new; it was rarely faced in the past when power was just a concern for limiting the chip temperature. The growing relevance of power efficiency is demonstrated by the great attention on the figure of merit (FoM) of data converters that, in the past few years, has been reduced by almost two orders of magnitude. The presentation will show that obtaining power effectiveness is a matter of trade-offs between architecture, design methodologies, and implementation of circuits. Advances in technology challenge data converter design. In addition to a reduced supply voltage, the worsening of transconductance and output resistance degrades the intrinsic gain and makes it difficult to design high-gain op-amps. Noise, both thermal and 1/f, also increases. Moreover, accuracy and linearity of passive and active components is problematic at minimum features. All those limits must be understood and accounted for to ensure effective data converters design. After discussing the above general issues this presentation will describe the design of significant achievements and illustrate their experimental verifications. The given design examples, pertaining data converters operating in different regions of conversion speed and resolution, are a band-pass sigma-delta, a power effective sigma-delta for DVB-H, some digital-assisted sigma-delta schemes and an ultra low-power SAR.
THURSDAY April 29, 2010
SCV Solid State Circuits
● Customized ADCs, PLLs, I/Os, SerDes ● Analog/Mixed-Signal IC design services
www.mobilitysemi.com Ph: 408-738-5509
2953 Bunker Hill Lane #400, Santa Clara
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 18
Faultline Brewery Social Time: 6:00 PM Networking with food and
beverage; 7:30 PM Dinner if you want to stick around (on your own)
Cost: All are welcome - IEEE members with current membership card receive a free $8 voucher at the door.
Place: Faultline Brewery, 1235 Oakmead Pkwy, Sunnyvale
RSVP: Limited seating; please reserve Web: ieeecscomsoc201004.eventbrite.com
Come and network with others in a relaxed
environment while enjoying one of the advantages of being an IEEE member with the free voucher. All are welcome. (Bring your IEEE membership card.)
THURSDAY April 29, 2010SCV Computer and Communications
Channel Partner
Multiphysics, Multidisciplinary Engng CFD, Stress, Heat Transfer, Fracture Fatigue, Creep, Electromagnetics Linear/Nonlinear Finite Element Analyses Multi-objective Design Optimization BGA Reliability
Ozen Engineering (408) 732-4665
[email protected] www.ozeninc.com
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 19
Biomagnetics: An Interdisciplinary Field where Magnetics, Biology
and Medicine Overlap
Speaker: Prof. Shoogo Ueno, Kyushu University, and 2010 IEEE Magnetics Society Distinguished Lecturer
Time: 11:00 AM Cost: none Place: Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley RSVP: Please respond by email with name,
company, to Peter Fischer, [email protected] by April 26
Web: ewh.ieee.org/r6/oeb/mag
Ueno Shoogo Ueno received the B.S., M.S. and Ph.D. degrees in electronic engineering from Kyushu University, Fukuoka, in 1966, 1968, and 1972, respectively. Dr. Ueno was an associate professor with the Department of Electronics, Kyushu University, from 1976 to 1986. From 1979 to 1981, he spent his sabbatical with the Department of Biomedical Engineering, Linkoping University, Sweden, as a guest scientist. He subsequently served as a professor in the Department of Electronics, Kyushu University (1986-1994) and in the Department of Biomedical Engineering, Graduate School of Medicine, University of Tokyo (1994-2006). In 2006 he retired from the University of Tokyo as professor emeritus. Since 2006 he has been a professor with the Department of Applied Quantum Physics, Graduate School of Engineering, Kyushu University, and is also dean of the Faculty of Medical Technology, Teikyo University, Fukuoka.
Dr. Ueno is a Fellow of the IEEE and of the American Institute for Medical and Biological Engineering. He is a Fellow and Member-at-Large of the Governing Council of the International Academy for Medical and Biological Engineering. He was an elected member of the IEEE Magnetics Society Administrative Committee (2004-2009), President of the Bioelectromagnetics Society (2003-2004), Chairman of the International Union of Radio Science’s Commission K on Electromagnetics in Biology and Medicine (2000-2003), President of the Japan Biomagnetism and Bioelectromagnetics Society (1999-2001), and President of the Japanese Society for Medical and Biological Engineering (2002-2004). He received the Doctor Honoris Causa from Linkoping University (1998). He was a 150th Anniversary Jubilee Visiting Professor at Chalmers University of Technology, Sweden (2006), and a visiting professor at Simon Frasier University, Burnaby, Canada (1994) and Swinburne University of Technology, Hawthorn, Australia (2008).
Biomagnetics is an interdisciplinary field where magnetics, biology and medicine overlap. It has a long history since 1600, when William Gilbert published his book De Magnete. Recent advances in biomagnetics have enabled us not only to detect extremely weak magnetic fields from the human brain, but also to control cell orientation and cell growth by extremely high magnetic fields. Pulsed magnetic fields are used for transcranial magnetic stimulation (TMS) of the human brain, and both high frequency magnetic fields and magnetic nanoparticles have promising therapeutic applications for treatments of cancers and brain diseases such as Alzheimer’s and Parkinson's. On the imaging front, magnetic resonance imaging (MRI) is now a powerful tool for basic and clinical medicine. New methods of MRI based on the imaging of impedance of the human body, called impedance MRI, and the imaging
of neuronal current activities in the human brain, called current MRI, are also being developed.
This lecture focuses on the advances in biomagnetics and bioimaging obtained mostly in our laboratory in recent years. The lecture describes: (1) a method of localized magnetic stimulation of the human brain by TMS with a figure-eight coil;
(2) magneto-encephalography (MEG) to measure extremely weak magnetic fields produced from brain electrical activity using superconducting quantum interference device (SQUID) systems; (3) impedance MRI and current MRI; (4) cancer therapy and control of iron-ion release from, and uptake into, ferritin, an iron-storage protein, by using both high frequency and pulsed magnetic fields and magnetic nanoparticles; and (5) magnetic control of biological cell orientation and cell growth by strong static magnetic fields. These new biomagnetic approaches will open new horizons in brain research, brain treatment, and regenerative medicine.
FRIDAY April 30, 2010OEB Magnetics
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 20
Short Course: RF and Microwave Design for Future Technologies
Speakers: Prof Ali Niknejad, UC-Berkeley; Dr R
Srinavasan, Intel Corp; Dr Rich Ruby, Avago; Prof Gabriel Rebeiz, UC-San Diego; Prof Pham, UC-Davis; Prof Tom Lee, Stanford
Time: Registration 7:30 - 8:00 AM; Presentations 8:00 AM - 3:00 PM
Cost: Advance Reg: $60 IEEE members, $70 non-members, $50 Students/Unemployed ($10 more on-site)
Place: Michaels at Shoreline, 2960 N Shoreline Blvd, Mountain View
RSVP: Register online Web: www.mtt-scv.org
In recent years the area of RF and microwave design has expanded into many new application areas, generated new technologies and adapted many new technologies into it’s products. This short course will give an overview of some key technologies and designs that will be used for these new applications. A description of the technology and designs will be given as well as the application(s) that are targeted. Registration/Breakfast Introduction - Jay Banwait, IEEE MTT-SCV Short
Course Chair Why RF Engineers Should Learn Digital (and Vice
Versa) - Prof Ali Niknejad, University of Caliifornia, Berkeley
The New Wimax Standard - Dr R Srinavasan, Intel Corporation
Filters - Dr Rich Ruby, Avago Tunable RF MEMS Filters for 3G and 4G Systems
- Prof Gabriel Rebeiz, University of California San Diego
Lunch High Freq Packaging - Prof Pham, University of
California Davis Historical Radio - Prof Tom Lee, Stanford University Wrap up, raffle and giveaways - Jay Banwait
SATURDAY May 1, 2010
SCV Microwave Theory and Techniques
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 21
Next-Generation MEMS Inertial Sensors
Speaker: Dr. Peter G. Hartwell, Hewlett-Packard
Laboratories Time: Networking at 6:15 PM; Presentation at
6:30 PM Cost: none Place: Carnegie Mellon Silicon Valley, NASA
Research Park, Bldg. 23, Moffett Field RSVP: not required Web: www.ewh.ieee.org/r6/scv/ras
Dr. Peter G. Hartwell is currently a senior researcher at Hewlett-Packard Laboratories in Palo Alto. As a member of the Information and Quantum Systems Lab, he is the lead of the Central Nervous System for the Earth (CeNSE) team developing a broad sensing system to bring environmental awareness to information technology infrastructure. CeNSE was selected one of 20 “World Changing Ideas” in the December 2009 issue of Scientific American. Peter has extensive experience in commercializing silicon MEMS products, working on advanced sensors and actuators, and specializes in MEMS testing techniques. He graduated from the University of Michigan in 1992 with a B.S.E in Materials Science and from Cornell University in 1999 with a Ph. D. in Electrical Engineering. He did brief post doctoral work at HP Labs before joining the staff in 2000. His work at HP has been documented in numerous technical papers, patents, and articles in publications such as The New York Times, Forbes, IEEE Spectrum, and EETimes.
MEMS inertial sensors have been around for more than 25 years, from the first prototypes developed in universities to initial product offerings. While the goal has always been enabling inertial navigation in mobile devices with high performance accelerometers and gyroscopes, MEMS inertial sensors saw their first commercial success as collision detectors in vehicle airbag systems.
Fast-forward 20 years. Airbags that started on high-end cars are now available on every vehicle. The use of inertial sensors in cars has expanded into all manner of vehicle dynamics. Improvements in the cost, size and power of current sensors, along with expansion of the vendor base, have allowed MEMS
sensors to spill over into consumer electronics such as game controllers and smartphones. Their performance, however, remains largely unchanged and MEMS gyroscopes have only recently come to market in volume.
I will examine why MEMS inertial sensors have failed to live up to their initial promise, and to propose a different approach that could jump-start advancements. MEMS
fabrication technologies, such as high-aspect-ratio etching, wafer bonding, and packaging, have all seen dramatic improvements from the first university prototypes. Hewlett-Packard has applied 25-plus years of nanofabrication experience creating MEMS inkjet printheads to create a new generation of MEMS inertial sensors. I will highlight performance goals now within reach and the application space the new sensors enable.
THURSDAY May 6, 2010
SCV Robotics and Automation
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 22
Secrets of Successful Networking: Professional
Networking for Engineering Professionals
Speaker: Jeff Richardson, CTO, Empowered Alliances
Time: Guided Networking at 6:30 PM; Dinner (sandwiches, salad, cookies and sodas) at 7:15 PM; Presentation at 7:45 PM
Cost: $10 (IEEE member), $13 (non-member) - Cash or check at the door; add $3 without reservation
Place: Ramada Inn, 1217 Wildwood Ave, Sunnyvale
RSVP: Register online Web: www.ieee-scv-tmc.org
Jeff Richardson has an unmatched passion for teamwork as demonstrated by his years of consulting/training experience with entrepreneurial startups, high tech companies and outdoor team building. He has been presenting Secrets of Successful Networking seminars for over 6 years for several thousand professionals while adapting the core message to meet the specific needs of the various organizations. As an educator, Jeff was one of the lead instructional designers for Stanford’s Advanced Project Management Program, in addition to designing and teaching courses at Boston University, and UC Santa Cruz – Extension as well as corporations like Cisco, Symantec, Intuit, Texas Instruments, Raytheon to name a few.
Mr. Richardson has a BS in Mechanical Engineering and an MS in OD & Change Management.
This interactive Secrets of Successful Networking workshop will demonstrate a more effective strategy for meeting key individuals that can add value to you and your project. This workshop will provide you with tools and techniques along with a customizable process that will generate immediate results. His fun and engaging workshop approach will rejuvenate your perspective on the value of the networking as a tool for solving difficult problems and allow you to create a more effective strategy for accelerated job search or improved project performance.
Workshop Objectives:
Evaluate the impact of new networking principles on your networking activities
Understand key components of an effective networking strategy
Workshop Content - Creating New Connections - Key Principles for Building an Influential Network - Developing Your Networking Strategic Plan What others have said about Jeff's
Presentations…“The networking events conducted by Jeff were very innovative, allowing all participants to interact with multiple groups of people. His high energy level and quick wit made it very interesting for all participants. We would definitely invite him back at our events and would highly recommend him to other organizations.” -Eashwar, Programs Director for PMI Association Silicon Valley
THURSDAY May 6, 2010SCV Technology Management
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 23
Take Your Career To the Next Level (Career Forum)
Speakers: William Uranga, Director of Staffing at
TiVo; Alex Plant, Senior Social Media Guy at NetApp
Breakout Sessions: Engineering and Technology, Business and Management, Bioscience, and Education (choose 2)
Time: 12:30 PM - 5:00 PM; see website for complete schedule of talks, sessions
Cost: none Place: UC-Santa Cruz Extension, 2505 Augustine
Drive, Santa Clara RSVP: Must register through the website Web: events-manager.ucsc.edu/content/take-
your-career-next-level
You’ll have the opportunity to learn about the best ways to use social media in your job or in the hiring process. Panels of experts in the fields of engineering and technology, business and management, bioscience, and teaching will show you ways to be more successful in your existing field or, if you’re in transition, where there are new opportunities to pursue.
Join us for this unique opportunity to interact and pose questions to senior level experts in HR and other fields, as well as recruiters. UCSC Extension program directors and coordinators will be on hand to outline what you can do to prepare for your next step.
You’ll wrap up the day with a guided power networking session and you’ll walk out the door with new tools and connections.
Career counselors will also be available for brief one-on-one strategy sessions. These sessions will be 5-10 minutes long and can include a quick resume review or discussion of a career-related question.
Several professional associations will have tables offering opportunities for professional growth and networking in your field.
12:30 - 1:00 PM Check in and visiting with
professional association representatives 1:00 - 1:50 PM Opening Session: Perspectives on
Using Social Media in your Career, featuring: William Uranga, Director Of Talent Acquisition at TiVo, and Alex Plant, Senior Social Media Guy at NetApp
2:00 - 2:45 PM Concurrent Sessions (4 areas) 3:00 - 3:45 PM Concurrent Sessions (repeated) 2:00 - 3:40 PM Mini-career advising sessions 4:00 - 5:00 PM Closing Session – Power
Networking for Career Success
FRIDAY May 7, 2010
SCV PACE Members in Transition, UCSC-Extension, NOVA, Chamber of Commerce
• 20 Years of Experience • Fortune 500 Companies • Microsoft .Net, C#, C++, Java, … • Software, Firmware, Middleware, Web Applications • SCM, QA, and much more Experience/Expert ise
www.esw.com [email protected] (408) 328-9240
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 24
Directions for Silicon Technology Development as We Approach
the End of CMOS Scaling Speaker: Tak H. Ning, IBM T.J. Watson Research
Center Time: Pizza and Salad at 6:00 PM; Presentation
at 6:15 PM Cost: none Place: National Semiconductor Building E
Auditorium, 2900 Semiconductor Drive, Santa Clara
RSVP: not required Web: www.ewh.ieee.org/r6/scv/eds
Tak H. Ning received his Ph.D. degree in physics
from the University of Illinois at Urbana-Champaign in 1971. Prior to joining IBM at Thomas J. Watson Research Center in 1973, he was a research assistant professor at the University of Illinois. At Illinois, he did research on the theory of impurity centers in silicon, the transport of electrons in MOS surface inversion layers, and developed a theory for the oxide-charge scattering of electrons in MOS inversion layers.
During the early part of his IBM career, Tak and his colleagues made significant contributions to the understanding of hot-electron effects and electron and hole trapping in MOSFET’s, including the discovery and modeling of substrate hot-electron effects. They demonstrated the shallow-emitter effect and its dependence on emitter-contact material. They invented and developed the polysilicon-emitter self-aligned bipolar transistor, which is the basis of all modern bipolar transistor technology. They also invented the substrate-plate trench-capacitor DRAM cell, which is widely used in stand-alone and embedded DRAM products.
As senior manager of the silicon device technology department between 1982 and 1991, he directed and contributed to the development of submicron bipolar and CMOS technologies in IBM Research as well as led his team in exploring SOI and EEPROM devices.
In 1991, Tak was appointed an IBM Fellow. Since then, he has focused much of his technical work on understanding the limits of CMOS and exploring the opportunities in silicon technology beyond CMOS. He also represents IBM at the Executive Advisory Board of the Semiconductor Research Corporation, a consortium of semiconductor companies funding university research in semiconductors. (continued, at right)
CMOS at the 45-nm node has been in production for
a couple of years now, and if everything goes according to plan, CMOS at the 15nm lithographic node should be in production in less than ten years. However, every technology has its limits and CMOS is no exception. While there will be billions of CMOS devices on a chip, and “mobility engineering” will continue to enable ever faster CMOS devices, band-to-band tunneling will push up the standby currents and severely cap the speed of any transistor requiring low standby power dissipation.
Nonetheless, the glass for continuing the rapid progress in silicon technology appears half full because system designers need a lot more than fast transistors. These needs include increasingly large memory capacity and increasingly large memory bandwidth, huge amounts of data storage, especially storage that can be accessed at much larger bandwidth than traditional magnetic disk storage, system-on-chip (SoC) integration and volumetrically dense system-level packaging. And, of course, the power dissipation must be consistent with the thermal and power dissipation requirements of the systems.
In this talk, the fundamentals that could limit the scaling of CMOS at or beyond the 15nm lithographic node will be discussed, and some thoughts on silicon opportunities for meeting the system needs of “besides faster CMOS transistors” will be offered. The emphases will be on opportunities in memory technologies and in exploiting SOI CMOS as a SoC platform.
Tak has participated in many IEEE and professional
society activities, including serving as a member of the Administrative Committee of the IEEE Electron Device Society, a program committee member of several technical conferences, and a member or chair of several IEEE award committees, including the IEEE Fellow Committee. He has been a member of the SEMATECH Committee that publishes the International Technology Roadmap for Semiconductors (ITRS) since 1992.
Tak has authored or co-authored more than 120 technical papers and 36 U.S. patents. He co-authored (with Yuan Taur) a book titled "Fundamentals of Modern VLSI Devices" (1998), which has been adopted as a graduate text by many universities worldwide and translated into Japanese.
He is a fellow of the American Physical Society and of the IEEE, and a member of the US National Academy of Engineering. He received several awards, including the 2007 ECS Gordon E. Moore Medal, the IEEE Electron Device Society 1989 J.J. Ebers Award, the IEEE 1991 Jack A. Morton Award, the 1998 Pan Wen-Yuan Foundation (Taiwan) Outstanding Research Award, and the IEEE 2000 Custom Integrated Circuits Conference Best Paper Award.
TUESDAY May 11, 2010
SCV Electron Devices
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 25
Supercomputing at NASA: Current Impact, Future Challenges Speakers: Dr. Rupak Biswas, Division Chief, NASA
Advanced Supercomputing Time: Pizza/sodas and networking at 6:30 PM;
Presentations at 7:00 PM Cost: none Place: Microsoft Research, 1288 Pear Ave.,
Mountain View RSVP: from website Web: ewh.ieee.org/r6/scv/computer
As acting chief of the NASA Advanced Supercomputing (NAS) Division, Dr. Rupak Biswas oversees the full range of high-performance computing services for NASA's primary supercomputing center. Dr. Biswas is a nationally recognized expert in the areas of parallel programming models and paradigms; benchmarking and performance characterization of emerging and innovative architectures for high-end computing systems; novel partitioning and load balancing techniques for large-scale computational science problems; and scheduling algorithms for distributed computing environments. Due to his broad knowledge in advanced computing technologies and federal agencies, Dr. Biswas was chosen to serve as a member of the inter-agency High End Computing Revitalization Task Force (HECRTF), as a mission partner representative on the DARPA High Productivity Computing Systems (HPCS) Project, and one of five expert panelists to assess all high-end computing R&D activities in Japan.
Biswas received his Ph.D. in Computer Science from Rensselaer Polytechnic Institute in 1991, and has been at NASA ever since. During this time, he has received several NASA awards, including the Outstanding Leadership Medal in 2009, and two Best Paper prizes given at the international "SC" conference on high-performance computing, network, and storage. He has published more than 140 technical papers on a variety of scientific computing topics in archival journals and at major peer-reviewed conferences, given numerous talks at home and abroad, and edited several journal special issues.
In this talk, Dr. Biswas will describe NASA's fully-
integrated supercomputing environment, its recent impact in several NASA mission areas, and discuss some pacing challenges to be overcome to make the next revolutionary advances in this field. High-fidelity modeling, simulation, and analysis, enabled by supercomputing, are becoming increasingly important to NASA’s mission to pioneer the future in space exploration, scientific discovery, and aeronautics research. High performance computing for computational modeling and simulation is now integral to the space agency’s work in all mission areas. The NASA Advanced Supercomputing (NAS) Division at Ames Research Center hosts the majority of the Agency’s supercomputing assets, which consists of over 900 teraflops of computational capability, more than 6 petabytes of filesystem. The NAS facility also provides full-service support to scientists and engineers in the areas of application porting, performance optimization, large-scale data analysis and rendering, and multi-terabyte data transfers.
TUESDAY May 11, 2010
SCV Computer
• Patent application preparation, prosecution, IP Strategy • Enforcing, Licensing and Monetizing Patents • Broad Experience in many Electrical and Software arts • Our Experts: IEEE Fellow, SPIE Fellow, Technical and Legal Experts
Ph: 408-288-7588 www.StevensLawGroup.com
Email: [email protected]
1754 Technology Dr, #226 San Jose
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 26
How to Apply Shielded Cables to Solve More Problems
than You Create Speakers: Dr. Tom Jerse, Associate Technical
Fellow, Boeing Company Time: Networking & light dinner (no-host) at
5:30 PM; Presentation at 6:30 PM Cost: Free coffee, tea, snacks Place: Applied Materials Bowers Cafeteria, 3090
Bowers Ave., Santa Clara RSVP: not required Web: ewh.ieee.org/r6/scv/emc
Tom Jerse has over 30 years experience with Hewlett-Packard and Boeing in solving EMI problems both at the circuit and systems level, and has earned a PhD in EMC from the University of Kentucky. He presently holds the dual positions of Professor of Electrical Engineering at The Citadel and Associate Technical Fellow of the Boeing Company. He served two years as a distinguished lecturer of the EMC Society, and has developed and taught original EMC courses at the professional and university level since 1981.
Shielded cables are widely used to enhance signal integrity and solve interference problems, but there are several mechanisms that if not understood in a system design can inadvertently cause interconnect cables to become the dominant player in crosstalk or radiated emissions. This talk explains the ways in which cables can both mitigate and exacerbate electromagnetic interference, and presents basic design principles and troubleshooting techniques for achieving the most electromagnetically compatible designs possible.
TUESDAY May 11, 2010SCV Electromagnetic Compatibility
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 27
Winner Take All: How Competitiveness
Shapes the Fate of Nations
Speaker: Richard J. Elkus, Jr., Vice Chairman of the
Board, Tencor Instruments Time: Dinner at 6:00 PM; Presentation at 6:45 PM Cost: $20 if reserved by May 10 ($10 for students,
unemployed); $25 after & at door; vegetarian available; no cost for presentation only
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: Through the website link Web: www.cpmt.org/scv
Richard J. Elkus, Jr., has been intimately
connected with the development and evolution of Silicon Valley. His business career as an executive and entrepreneur has been integrated with organizations and committees involved in national and international policy development pertaining to economic competitiveness.
Elkus spent the first decade of his career at Ampex Corporation serving in managerial positions of increasing responsibility. He wrote the original product plan for the home video recorder and headed the team that introduced what would become the VCR to the world in 1970. During his career, he served as chief executive and on the board of several high-tech companies, including Executive Vice President and General Manager of Geometrics, Inc., Director and Chairman of Pacific Measurements and Integrated Systems, Inc., Co-Founder, Chairman and CEO of Prometrix Corporation, Director and Vice Chairman of Tencor Instruments, Director of KLA-Tencor, Director of OnTrak Systems and Director of Lam Research. In addition, he served as a Director of Tomex Corporation, Virage Logic, SOPRA-SA, and Cameca-France.
His professional affiliations, past and present, include serving as Chairman of the Selection Committee for the National Medal of Technology, presented each year by the President of the United States; member of the Board of Directors and executive committee of the National Science and Technology Medals foundation, member of the Board of the American Electronics Association,
(continued, next page)
The strategic dilemmas now confronting America
are deep and daunting. Though we face no immediate threat of another world war or Great Depression, we find ourselves in what could become a zero sum game. And we are losing. At the core of our growing problems is an exorbitant level of public and private debt relative to savings and the nation's capacity to repay its creditors. And beyond America's insatiable demand for credit lies another problem, one potentially much worse. The United States is rapidly losing its ability to commercialize its innovative strengths in the form of advancements in technology, products, and markets that are potentially explosive and scalable and thus strategic to any great nation. As a result of these losses, our ability to innovate, produce, and employ continues to decline. In the end, the country becomes unable to regenerate itself.
This is not a danger that looms on the horizon. It is the condition that faces America today. We are on the verge of losing our ability to compete —- the only viable means to paying down the nation's horrendous financial obligations.
The United States is no longer a significant factor in the consumer electronics industry, including television, cameras, recorders, and cell phones. Without the resources of China and other Asian countries, neither computers, iPhones, HDTVs, nor myriad other consumer electronics would be on the shelves of American stores. Two of America's three automobile companies went bankrupt. We are no longer competitive in nuclear power. We face fierce competition in aircraft and ship building. We are no longer a significant supplier of machine tools. By 2007 nearly 80 percent of all semiconductor fabrication tools were being purchased for manufacturing facilities in Asia. The loss of these markets will ultimately hinder technological advances in the U.S. military establishment.
The high dependence of our industrial base on foreign design and manufacturing has ominous implications. Assuming China and India increase domestic consumption, substantially reducing their reliance on the U.S. consumer, America could become marginalized. Asia will be able to get along without us while we remain significantly dependant on them.
To resolve this situation will cost hundreds of billions in new investment over many years. As the nation tries to live within its means, our standard of living will fall. America will have to develop a totally different competitive strategy. We will have to
WEDNESDAY May 12, 2010SCV Components, Packaging and Manufacturing Technology
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 28
become an exporting nation, selling more than we buy. In many respects the United States will have to take lessons from the Asian book of competitiveness. Without that understanding we will be unable to meet our assumed obligations. The America to which we have become accustomed will cease to exist.
We Americans went to get money from woefully overdrawn bank accounts only to find the banking system could loan no more. We then called upon the government not only to assume those debts that individuals and corporations could not meet, but to loan considerably more, hoping to avoid another depression. Deep in the national memory is the civil unrest and global savagery brought on by the Great Depression, which ended only through the winning of a world war. With our competitors devastated by the war and our homeland unscathed, we became the greatest industrial power ever known. Until the early 1970s, America had a positive balance of trade, dominating virtually every technology, product, and market. We have been living off that once lofty position ever since.
But for the last 30 years competitiveness has not been about the nation's commercialization of innovative products in highly scalable markets, but about short-term returns on investment —- returns offered by other nations happy to do our manufacturing and design for a fraction of our cost in wages and investment. The result today is the gutting of our industrial base, a structural imbalance in trade, and a fundamental loss in our ability to innovate and commercialize —- two functions, inexorably tied together, without which America can never pay down its debt nor provide enough jobs.
Turning this situation around will demand great individual and collective sacrifice. It will also require that we grasp the principles of competitiveness: As end-use products, markets, and related technologies evolve, they become increasingly interrelated, interdependent, and integrated. They converge. As this infrastructure grows it becomes very difficult to define the difference between the functions of marketing, engineering, and manufacturing, let alone pick and choose what function you want to control. The development of the infrastructure is always evolutionary, never revolutionary. As it grows in scale, the amount of money invested in it grows exponentially. A semiconductor manufacturing plant that cost $50 million in 1984 could cost $6 billion today. Dropping out of the game often means you don’t get back in.
The United States has been exiting the game for nearly thirty years, a strategy rationalized through short term monetary gains and the dream that technology can be developed apart from the infrastructure that supports it. We assume a good idea will win no matter which nation builds the
infrastructure. While a good idea might be worth a few dollars, the cost of technological innovation and ability to commercialize it will often run in the billions. America is in serious danger. It is time to develop a national strategy for international competitiveness.
Speaker Biography (continued) member of the Board of Trustees for The Scripps Research Institute, member of the Board of Trustees of the Palo Alto Medical Foundation, member of the University of California (UC) President's Board on Science and Innovation, and the UC Merced Foundation, Chairman of the National Science Foundation Panel on High-Definition Products and Systems, Co-Chairman of the American Electronics Association Committee on High-Definition Television, Vice Chairman of Government Policies Committee of the Defense Science Board, member of the Council on Competitiveness and member of the Board of International Counselors of the Center for Strategic and International Studies. He has also provided testimony on U.S. Competitiveness before the Senate Banking Committee and House Subcommittee on Science and Technology.
Elkus is a strong advocate for the accessibility and affordability of higher education. He served as a member and mentor of the Stanford University's Future Professors Program. He is the author of WINNER TAKE ALL: How Competiveness Shapes the Fate of Nations (Basic Books, 2008). He earned his undergraduate degree from Stanford University and his MBA from Dartmouth College, Tuck School of Business Administration. Richard Elkus will be introduced by Stanley Myers, President and Chief Executive Officer of SEMI, in San Jose, since 1996.
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 29
The Last Mile Smart Grid WAN Challenge Few Understand
Speaker: Fred Fletcher, Smart Grid Chief Architect,
Open Access Technology International Time: Food/drink and networking at 6:00 PM;
Presentations at 6:30 PM Cost: Donation for food/drinks Place: National Semiconductor, Building E,
Conference Room, 2900 Semiconductor Dr, Santa Clara
RSVP: By May 10 to [email protected] Web: www.ewh.ieee.org/r6/scv/comsoc
Fred Fletcher has been an innovator in the electric power industry for over 35 years. He has just recently become a smart grid architect after developing a cross cutting smart grid solution built primarily for power supply applications for Burbank Water and Power. Fred was the Assistant General Manager at Burbank, leading the power supply division, he retired this year after 24 years to dedicate his focus on smart grid technology challenges. Neither he nor the company he works for has a commercial interest in the technologies discussed in this presentation, but it is important that the problem presented be addressed by the market in order to best deploy his applications and designs.
Smart grid development has been driven by revenue billing and some distribution application, but the greatest value of smart grid technologies appears to be in matching load to available power supply. Matching load to variable non-firm wholesale power requires fast two-way digital networks. This presentation illustrates the problem and discusses possible private network and public carrier solutions using 4G/LTE, Wi-Fi Mesh and WiMax technologies.
With such networking, security issues rise that could have great importance. Using such networking to take down New York, Washington DC, Los Angeles, or vast areas of the nation can be devastating, taking the power grid down on command using such networking in conjunction with terrorist or military action could be even more serious. Security is of paramount concern and must be built into the networking from the beginning and be capable of continual improvement. Many of the practices that are common over the Internet cannot be tolerated on such a smart grid network. Traffic over the smart grid network must be restricted to approved traffic only, by approved users, and some function might only be performed by specific devices.
Smart grid intelligent networks have the potential to make power grids stronger. In the past regional blackouts have occurred because an outage began to cascade into large blocks of power. The power grid is designed to withstand failure without cascading failures, but under certain conditions or under multiple failures the risk of cascading failure increases. Smart grid intelligent network can provide control intelligence sufficient to recognize and stop cascading system failures.
The bandwidth requirements of the smart grid are just beginning to become understood. As recently as last year speeds of 200kbps was generally thought to be sufficient for smart grid applications. As demand response has become better understood the bandwidth requirements have increased by orders of magnitude.
A unified communications plan is needed, but the reality is that it is the market place and the technology developers that will determine how this problem will be addressed in this country. This is an opportunity for new technological development.
WEDNESDAY May 12, 2010
SCV Communications
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 29
Approaches to Arc Flash Hazard Mitigation
Speaker: Gary H. Fox, Senior Specification Engineer,
GE Industrial Solutions Time: Demo trailer at 3:00 PM; No-host social at
5:30 PM; Presentation at 6:15 PM; Dinner at 7:15 PM; Presentation continues at 8:00 PM
Cost: Dinner is $20 for IEEE members; $25 for non-members
Place: Marie Callender's Restaurant - The Garden Room, 2090 Diamond Blvd, Concord
RSVP: Please respond by May 12 to Gregg Boltz, [email protected], 925-210-2571
Web: www.e-grid.net/docs/1005-oeb-ias.pdf
Gary H. Fox has been a Senior Member of IEEE since 2001. He received his BSEE from California Polytechnic State University, San Luis Obispo in 1978. He has been a licensed Professional Engineer since 1982. He has been employed by General Electric Company for over 31 years. His current assignment is as a Senior Specification Engineer for GE Industrial Solutions in Concord, providing application and technical support for power distribution and control equipment.
Mr. Fox is a member of the IEEE Industry Applications and IEEE Power Engineering Societies and has authored or co-authored several papers and articles covering a diverse range of topics such as arc flash, protective relay application, transient voltage surge protection, selective coordination, and application of electrical equipment in seismic hazard locations. He is an active member in several Industry Applications Society working groups concerning power distribution and protection.
This evening there will be two presentations related to Arc Flash Hazard Mitigation: 1. Advanced breaker trip unit technologies, including
zone selective interlock, maintenance mode, and enhanced time current curve adjustment options can limit let-through energy and reduce arc flash hazards without compromising system selectivity. This presentation will illustrate through a case study approach the amount of arc flash incident energy reduction that might be realized at typical low voltage unit substations.
2. The predominant technologies for reducing arc flash incident energy today rely on the speed of protective devices, remote operation, arc-resistant enclosures that channel energy where it is less dangerous, and crowbars to divert the arc energy into a bolted fault. None of these methods has provided a solution for all situations, particularly in existing installations. The second presentation will describe a method for diverting an arcing fault’s energy into a specific environment within a half-cycle after initiation of the arc, without the need to introduce bolted fault current like a crowbar or for fast current interruption, such as a current-limiting fuse. The system protection provided is similar to that of arc-resistant switchgear without reliance on the strengthening or integrity of the equipment enclosure.
Please note that a GE demonstration trailer with a sample of the device described in the second presentation (along with other notable exhibits) will be available for visiting from 3:00pm to 6:00pm in the parking lot outside the restaurant.
THURSDAY May 13, 2010
OEB Industry Applications
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 30
Novel Magnetic Materials and Magnetic Devices
Speaker: Prof. Yang-Ki Hong, University of Alabama Time: 11:00 AM Cost: none Place: Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley RSVP: Please respond by email with name,
company, to Peter Fischer, [email protected] by May 12
Web: ewh.ieee.org/r6/oeb/mag
A number of recent results achieved in the areas of ferrite, magnetic films and nanoparticles, and design and performance of magnetic RF devices by the author’s laboratory will be introduced. The first part of this talk focuses on spherical barium ferrite (S-BaFe) nanoparticles for terabytes tape cartridge, vortex chirality in spin-valve nanodisk for spin-torque transfer random access memory (STT-RAM), magnetic domain structure of submicron permalloy ring, scaling effect of S-shaped permalloy nano-element on bias field for magnetic logic element, biferroic Y-type hexaferrite for magneto-electric random access memory (ME-RAM), and green energy permanent magnets (MnAl and MnBi) for electric vehicles applications. The second part covers a self-biased GHz hexaferrite circulator, a miniature ferrite MHz-GHz antenna, and a low-power MHz ferrite inductor. Finally, future novel magnetic materials will be suggested as they underpin multifunctional magnetic devices.
MONDAY May 17, 2010OEB Magnetics
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 31
Nanotechnology – State of the Art and Applications
Speakers: IEEE Distinguished Lecturer from TX
State, Univ ov Albany CSNE, NEC Japan, U of TX NanoMed, Harvard, UCSD, Max Planck Inst, Stanford, SJ BioCenter, Nanosys, AMAT, IBM, others
Time: Tuesday 8:00 AM - 6:00 PM; Wednesday 8:00 AM - 5:00 PM
Cost: IEEE Members $160, Students $125, Non-Members $210 (before April 30th)
Place: National Semiconductor Bldg E-1 CMA Room. 2900 Semiconductor Drive, Santa Clara
RSVP: from the website Web: www.ieee.org/nano
Tuesday May 18th 7:30 AM Registration & Continental Breakfast Morning: - Dr. Michael Liehr, VP Strategy CNSE Albany, “State
of US Nanotech” - Dr. Shuichi Tahara, Gen. Mgr. Nanoelectronics Res.
Labs, NEC Electronics, “State of Pacific Rim Nanotech.”
- Dr. Burton Lee, Stanford Univ, “State of European Nanotech.”
- Mark Bunger, Director, Lux Research, “NanoBio Medical Business”
- Melinda Richter – Executive Director – San Jose BioCenter -"An Incubator Approach to NanoBio Development"
- Bikash Chatterjee - President & CTO -Pharmatech Associates, Inc. - “Regulatory Issues - Nanotechnology in Therapeutic Delivery Systems”
Noon: Lunch and networking Afternoon: - Dr. Mauro Ferrari, Chair, Dept. of Nanomedicine,
Univ. Texas, “Silicon Nanotech for Medicine” - Dr. Charles Lieber, Professor, Harvard,
“Nanoelectronics Meets Biology: From Ultrasensitive Detection to Cellular Interfaces”
- Adityo Prakash, CEO of Verseon, “Engineering Novel Drug Molecules: Replacement of Trial and Error Driven Discovery by Systematic Quantitative Methods”
- James Gee, Distinguished Member of Technical
Staff, Applied Materials, Co., - “Nano-enabled Solar”
- Joe Fisher, CEO, Contour Energy Systems, "Reshaping Portable Power Using Nano Materials"
- Thomas Daue, President, Smart Material Corporation, “Energy Harvesting Systems Using Piezo-electric Macro Fiber Composites”
5:00 PM Mixer and networking / Appetizers / Drinks / Sponsors
Wednesday May 19th Morning: - Dr.Richard B. Kaner, Professor of Chemistry and
Professor of Materials Science & Engineering, UCLA, “Synthesis and Applications of Conducting Polymer Nanofibers.”
- Dr. Wenbing Yun, CTO, Xradia, "Nondistructive 3D Vizualization of Nanoworld"
- Jon Brodd, CEO, Cima Nanotech,"Self Aligning Nano Technology for Electronics"
- Dr. Walter Trybula, IEEE Distinguished Lecturer and Director Nanomaterials Application Center – Texas State University,
- Dr. Hans Stork, VP and CTO Applied Materials, “Nanotechnology in Semiconductor Industry” - Dr. Mike Stuke, Prof. Max Planck Inst., "Laser-
direct-write creation of free-standing 3D structures and some biotech applications"
- Dr. Joy Cheng - Research Staff Member, Lithography Materials Group, IBM Almaden Research Center - "Nanofabrication: bottom-up meets top-down".
12:30: Lunch and networking Afternoon: - Dr Jason Hartlove, President and CEO Nanosys,
Inc. " From Concept to Creation: The Journey from R&D to Everyday Products"
- Dr. Deli Wang, Professor ECE, UCSD "Nanowires for nanoelectronics applications"
- Dr. Jeff Neaton, Director, LBNL Molecular Foundry, "Novel Materials and Mechanisms for Solar
Energy Conversion" - Prof. Cun-Zheng Ning, Professor of Electrical
Engineering, Center of Nanophotonics-Arizona Institute of NanoElectronics, Arizona State University, "Composition graded alloy nanowires for full-spectrum solar cells"
TUESDAY-WEDNESDAY May 18-19, 2010
SCV Nanotechnology
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 32
Half a Century of Lasers: How it All Got Started
Speaker: Jeff Hecht, Author of Beam: The Race to
Make the Laser Time: Networking/Light Dinner at 6:00 PM,
Presentation at 7:00 PM Cost: none Place: Applied Materials Bowers Cafeteria, 3090
Bowers Ave., Santa Clara RSVP: from the website Web: www.ewh.ieee.org/r6/scv/leos
Jeff Hecht is the author of Beam: The Race to Make the Laser (Oxford University Press, 2005), Understanding Lasers 3rd ed (IEEE Press/Wiley 2008) and several other books. He is a contributing editor to Laser Focus World, a correspondent for New Scientist magazine, and writes regularly for Optics & Photonics News. He holds a B.S. in electronic engineering from Caltech, and has been writing about lasers since 1974.
The laser's conceptual roots go back to Albert
Einstein's idea of stimulated emission, but the action didn't start until the invention of the microwave maser in the 1950s. The next logical step was to the higher frequencies of light waves, but how to get there was a problem. Charles Townes formulated the physics problem of how to build a laser. Then he and Gordon Gould separately solved it on paper, launching a race to make the laser that soon involved Bell Labs, ARPA, Columbia University, IBM, American Optical, and other labs. The winner of the race was a dark horse, Theodore Maiman of Hughes Research Labs, with an elegant design that others replicated within weeks of its disclosure, starting the laser age. This talk will describe the laser race, and the dawn of the laser age.
WEDNESDAY May 19, 2010
SCV Photonics
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 33
Applying Therapeutic Device Innovation To Clinical Medicine:
The Evalve Story Speaker: Dr. Fred St. Goar, El Camino Hospital Time: Optional dinner at Nexus Cafeteria in the
Clark Center, 6:15 pm (no host, no reservations); Presentation at 7:30 PM
Cost: none Place: Room M-114, Stanford University Medical
School, Stanford RSVP: not required Web: www.ewh.ieee.org/r6/scv/embs
Fred St.Goar is an interventional cardiologist at El
Camino Hospital. He did his internal medicine and cardiology training at Stanford in the eighties during the hayday of cardiology medical device development where he took his lead from the plethora of successful enterpreneurs who were actively involved with the Stanford program including Tom Fogarty, John Simpson, Paul Yock and Rich Popp to name a few. Since his training he has been actively involved in the early development of a number of projects that went on to become successful companies including Heartport, Cardiovascular Imaging Systems and Cryovascular Systems. In 1999 he cofounded with the Foundry, a then fledging medical device incubator. Evalve, a company that prior to recently being acquired by Abbott was recognized as one of the leaders in area of percutaneous mitral valve intervention. His talk will take you through the Evalve story from the perspective of a physician innovator.
WEDNESDAY May 19, 2010
SCV Engineering in Medicine and Biology
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 34
Behind the Scenes at IEEE SPECTRUM,
with Tekla Perry : Speaker: Tekla S. Perry, Senior Editor, IEEE
Spectrum Magazine Time: Networking & Pizza at 6:30 PM;
Presentation at 7:00 PM Cost: none Place: National Semiconductor Building E
Auditorium, 2900 Semiconductor Drive, Santa Clara
RSVP: not required Web: www.ewh.ieee.org/r6/scv/pels
Tekla Perry, Senior Editor at IEEE SPECTRUM Magazine, covers consumer electronics, electronics and the environment, and high-tech startups from Spectrum's west coast office in the heart of Silicon Valley, just a few blocks from Stanford University. Her feature articles, podcasts, blog posts, videos, and product reviews typically look at the people as well as the technology behind the news. In 2008, she spearheaded Spectrum's coverage of the U.S. transition to digital television; her multimedia report on a new battery technology and the engineer behind it, "The Lady and the Li-On," was featured on public radio's nationally syndicated program, "Here and Now." Tekla's a long-time Spectrum veteran; her articles on Xerox PARC, the Atari VCS, the birth of the graphical user interface, global warming, and the problems of the U.S. air traffic control system (which won an award from the American Society of Business Publication Editors) have become oft-referenced classics. She received a B.A. degree in journalism from Michigan State University.
Keep up-to-date on electrotechnology in the SF Bay Area – Join the email Distribution List for the IEEE’s e-GRID today!
www.e-grid.net/subscribe
News of upcoming meetings and conferences, delivered twice a month to your INBOX – no cost.
You've seen this publication for as long as you've
been an IEEE member. A veteran editor will tell you how it's changed, how the editorial process really works, and what being a technology journalist today is like in a world of podcasts and blogs and youtube. For anyone who has ever thought about writing an article for a technology magazine, who might be interviewed by the technology press, or is simply a curious reader.
For an RSS feed of upcoming meetings/events, visit:
www.e-grid.net/rss
Choose from 10 different categories!
WEDNESDAY May 19, 2010
SCV Power Electronics, with Women in Engineering
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 34
Electronics Manufacturing by Inkjet Printing
Speaker: Joel Yocom, Conductive Inkjet Technology Time: Networking and pizza at 6:30 PM,
Presentation at 7:00 PM Cost: $5 for IEEE members, $10 for non-
members (pay at the door) Place: nVIDIA - 2800 Scott Blvd., Building E,
Santa Clara RSVP: from the website Web: ewh.ieee.org/r6/scv/ce
Joel Yocom is a 25+ year veteran of the flexible circuit board industry and has specialized in the development of new technologies during much of that time. He has worked for industry leaders such as Parlex, Litchfield Precision Components and Gould in developing products and services to support the advancement of flexible circuit technology. For the last 3 ½ years Joel has led the business development efforts for Conductive Inkjet Technology, where he is Business Development Manager, and explored opportunities in the exploding Printed Electronics market.
Inkjet printing is of great interest in the field of
electronics manufacture because its digital nature negates the need for physical tooling. A wide variety of active and passive materials are currently being investigated for use in inkjet printed electronics. These include semiconductors, light emitters and photovoltaic materials as well as dielectric materials and conductors. The range of conducting materials that can be printed is somewhat limited by the constraints of inkjet printing. Ideally, particle sizes should be below 1 micron and the viscosities and surface tensions of the fluids need to be tailored to the particular printhead being used. Regardless of these limitations, various technologies are now being implemented in the production of circuit boards, interconnects and antennas by inkjet printing. The properties of these inkjet printed circuits do not currently mimic traditional PCB materials – in particular, the sheet resistances of inkjet printed materials tend to be significantly higher than traditional copper clad laminate and the minimum feature sizes are somewhat larger than state of the art semi-additive plating. However, inkjet printed circuit technologies are a still finding many applications which are particularly well suited to their properties and the digital nature of their application.
TUESDAY May 25, 2010
SCV Consumer Electronics
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 35
Overview of Recent Developments in HAMR Technology
Speaker: Jan-Ulrich Thiele, Seagate Technology, Inc. Time: Networking and pizza at 7:00 PM,
Presentation at 7:30 PM Cost: none Place: Western Digital, 1710 Automation Parkway,
San Jose RSVP: Not required Web: ewh.ieee.org/r6/scv/mag
Jan-Ulrich Thiele holds a PhD in Physics from the University of Basel in Switzerland. After 12 years at IBM and Hitachi GST working on many aspects of magnetic recording technology, he joined Seagate Technologies in Spring 2008 as a Technologist and Senior Director for Media R&D where he currently leads a team of Scientists and Engineers developing HAMR media technology
Both leading contenders in the hard disk drive
(HDD) industry’s continuing quest for ever increasing areal storage densities, bit patterned media recording (BPM) and heat assisted magnetic recording (HAMR), will bring profound changes to the components and architecture of the HDD and the way they are manufactured. In this presentation Dr. Thiele will give an overview of the working principles of HAMR, the current status and remaining challenges for the envisioned introduction of this recording technology at areal densities of 1 Tbit/in2 or above.
TUESDAY May 25, 2010SCV Magnetics
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 36
Arc Flash Management and Technology & Plant Tour
Speakers: Ed Rossi, President; Ashok Kulkarni, Vice
President Engineering; Predrag Milovac, Design Development Manager, Industrial Electric Mfg (IEM)
Time: Social and buffet-style dinner at 5:30 PM; Presentation at 6:00 PM; Plant tour at 7:00 PM
Cost: none (reservations required; seating limited)
Place: Industrial Electric Mfg (IEM), 48205 Warm Springs Blvd., Fremont
RSVP: please email Jim Avery, [email protected] to reserve your seat
Web: www.e-grid.net/docs/1005-sf-ias.pdf
Ed Rossi is president and chief executive officer of IEM. Under his direction, IEM annual sales have grown over 400% since 2004 and the company has forged a solid reputation as a manufacturer of custom electrical distribution equipment.
Ashok Kulkarni is vice president of engineering at IEM, overseeing the development of new products and customer solutions, product testing, IEM processes, and agency certifications. Kulkarni was awarded a Ph.D in Electrical Engineering from Texas A&M.
Predrag Milovac is design development manager at IEM responsible for the research, development and execution of IEM’s new arc resistant switchgear. Milovac earned a Master of Science from Purdue University.
Measures to increase equipment and personnel
safety in manufacturing are reflected in new approaches and technologies designed to help minimize the risk of workplace dangers in the event of an arc flash. With a multitude of potential dangers and new ones continuously emerging, companies must be diligent in their ongoing efforts while considering new approaches and technologies to improve plant safety. This presentation will focus on implementing techniques and practices designed to reduce hazards and minimizing risk for workers who must enter an area with an electrical arc-flash potential.
TUESDAY May 25, 2010
SF Industry Applications
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 37
Thermal Management for the Design of Telecom and Server Systems
(with Lab Tour) Speaker: Marlin Vogel, Electronic Cooling Solutions Time: Registration, free pizza and soft drinks at
11:30 AM; Presentation at 12:00 Noon; Tour at 12:30 PM
Cost: none Place: Thermal Design Center, 2915 Copper
Road, Santa Clara RSVP: Through the website link; limited to first 40
registrants. Web: www.cpmt.org/scv
Marlin Vogel has over 25 years of experience in thermal management of electronic and aerospace products. He holds 11 patents and has authored or co-authored over 20 technical papers and publications. Before joining ECS, Marlin held a position as a Senior Staff Engineer at Sun Microsystems, where he worked on a wide variety of projects during the last 18 years. Prior to working at Sun, Marlin held a position as Engineering Specialist while at the General Dynamics military aircraft division for 7 years, 2 years as a Research Assistant at University of Wisconsin, and 2 years as an Engineer at Ipsen Industries. Marlin has a Masters of Science Degree in Mechanical Engineering from the University of Wisconsin - Milwaukee.
A systematic approach will be provided for architecting
and determining the feasibility of a system thermal design, along with presenting the necessary process steps required to validate and finalize a reliable system design. The approach includes combining “back-of-the-envelope” calculations with computational fluid dynamic (CFD) analysis to identify a preliminary system design; identify critical areas for long lead thermal component design, if applicable, such as heat pipe heat sinks or air movers; define thermal component and system testing in order to determine boundary conditions required by the CFD analysis for updating the system design, along with validating preliminary and final versions of the thermal design. The role and impact of the thermal architect and design process on the overall system architecture and design will be presented. Wind tunnel test methods will be demonstrated for validating the system airflow performance, along with validating air mover performance.
The facility tour will also include demonstrating CFD analysis prediction of airflow results for a system, depicting the steady state airflow trajectory path through the system.
THURSDAY May 27, 2010
SCV Components, Packaging and Manufacturing Technology
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 38
Multiscale Magnetic Models: From Electronic Structure
to Device Design Speaker: Roy Chantrell, Physics Department, The
University of York Time: 11:00 AM Cost: none Place: Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley RSVP: Please respond by email with name,
company, to Peter Fischer, [email protected] by May 24
Web: ewh.ieee.org/r6/oeb/mag Professor Roy Chantrell has made a number of
contributions to the theory of magnetism, in particular the development of models of spin dynamics in complex magnetic systems. He has published around 340 refereed research papers with over 5000 citations and has given invited papers at the major international magnetism conferences (MMM and Intermag) and at specialist magnetism meetings. Until 1989 he was Professor at the University of Central Lancashire, moving to the Universities of Keele (1989), Bangor (1996) and Durham (1999). His research group consisted of around 7 students and postdoctoral researchers and received extensive support from the national funding councils, the EU and industry. In 2001 he moved to Seagate research (Pittsburgh) to establish and lead a theory group carrying out work on lengthscales ranging from ab-initio calculations to large-scale micromagnetic simulations. Here he initiated pioneering research into the development of atomistic calculations with parametrised ab-initio information. This was applied especially to nanoparticles of FePt, to an understanding of the physics of heat-assisted magnetic recording, and to the development of atomistic models of read elements. Chantrell was the recipient of a Seagate Technical Achievement Award in 2004. In August 2004 he was appointed to a chair of Condensed Matter Theory at the University of York, UK. He currently leads a group comprising 1 academic member of staff, 1 postdoctoral researcher and 8 postgraduate students.
(Continued, next column)
Magnetic materials make a vital contribution to a number of technologies, including of course magnetic recording. Increasingly, materials are structured on the nanoscale in order to produce the desired properties for specific applications. In addition, future applications may require heating of the material up to and beyond the Curie temperature characteristic of the magnetic phase transition. The important consequence is that the usual formalism, termed ‘micromagnetics’, cannot be used to investigate such complex phenomena. I will describe the development of new approaches linking electronic structure calculations and atomistic spin models of magnetic materials and outline applications to the fundamental understanding of ultrafast magnetisation reversal. In particular I will show that magnetisation reversal in a timescale of 300 femtoseconds is possible, and will describe the implications for heat assisted magnetic recording.
Finally, I will outline recent developments which allow the bridging of the atomistic and mesoscopic lengthscales, allowing the models to be applied to the understanding of macroscopic experiments and ultimately to device design. This model will be applied to the investigation of heat assisted magnetic reversal and also opto-magnetic reversal, in which magnetisation reversal occurs in response to a pulse of circularly polarised laser light.
It is shown (in agreement with experiment) that switching times on the sub-picosecond timescale are possible, with important implications for magnetic recording and spin-electronic devices.
- - - - - - - - - - - - - - - - - - - - From Oct 1986 - Sept 1987 he was Visiting Fellow,
Mathematics Department, Imperial College, London. Since then Chantrell has held numerous visiting scientist positions, most recently at the Universite Pierre et Marie Curie (Paris), Fudan University (Shanghai) and the National University of Singapore, where he has been appointed visiting Professor from 2009-2012. He is Editor of the Journal of Magnetism and Magnetic Materials, a member of the advisory board of a number of international conferences, and make regular contributions as member of the program and publications committees of these meetings. He was a member of the management committee of the UK EPSRC Advanced Magnetics Program (1995-1998). He is a member of the AdCom of the IEEE Magnetics Society, and Coordinator of the IEEE Magnetics Society Distinguished Lecturer Programme.
FRIDAY May 28, 2010
OEB Magnetics
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 39
Link Your Business Plan to Your Financing Needs
(5-part Webinar)
Instructor: Dr. Dileep Rao, adjunct professor and
author of Lessons from Bootstrap to Billions Time: 11:00 AM - Noon (monthly, part 1 of 5) Cost: IEEE members: $69 each or $129 for all
five. Non-members: $99 for each or $225 for all five
Place: on the Internet RSVP: Sign up in advance, from the website Web: www.ieeeusa.org/careers/webinars/2010/
Bootstrap-to-Billions.html
Dr. Dileep Rao, financier, columnist, adjunct professor and workshop leader, has partnered with the IEEE-USA Entrepreneurial Activities Committee to conduct a series of webinars for you. Dr. Rao financed more than 450 businesses and real estate projects as the vice-president of a venture development financial institution.
Currently, Rao is an advisor to governments, Fortune 1000 corporations, development financial institutions and entrepreneurs on business development and financing. He also teaches New Business Development & Financing in MBA and Executive MBA programs in the United States, Europe and Asia, and has been selected as Outstanding MBA Teacher at the Carlson School of Management located at the University of Minnesota. Rao is an entrepreneurial finance columnist for Forbes.com, and has written such acclaimed books as Handbook of Business Finance & Capital Sources and Business Financing: 25 Keys to Raising Money. He also holds two engineering degrees and a Ph.D. in Business Administration.
Dr. Dileep Rao, author of Lessons from
Bootstrap to Billions, will lead a series of IEEE-USA webinars for future and seasoned entrepreneurs. The webinars will be based on his book, which illustrates how, contrary to currently popular belief, entrepreneurs can bootstrap to success. Bootstrap to Billions shows entrepreneurs and managers how business giants used alternate financing options to grow. Most of them — about 80 percent — never got venture capital. These entrepreneurs found their best market; designed the right strategy; developed the organization culture and leadership; and reached the top with capital-efficient strategies that minimized the need for capital. Lack of money did not constrain their growth. Many entrepreneurs may be better off using alternate financing to build and control their business, and to create wealth and keep it. Dr. Rao's presentations are broken down into a series of five monthly webinars: 20 May 2010 - Link Your Business Plan to Your
Financing Needs 24 June 2010 – Matching Financing Needs to the
Right Financial Structure 22 July 2010 - Fine-Tune Financing: Finding the
Right Sources/Instruments 19 August 2010 - Reduce the Agony: Learn How to
Find Financing 16 September 2010 - After the Financing: Better
Decisions & Control
See Part 2 description later in this GRID.pdf (on June 24th)
THURSDAY May 20, 2010 (1 of 5) IEEE-USA Entrepreneurs Webinar Series
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 40
48-Core Cloud Computer Chip Speaker: Jason Howard, Senior Technical
Researcher, Intel Time: Networking with food and beverage at 6:30
PM; Presentation at 7:00 PM Cost: $2 donation helps cover food Place: National Semiconductor, Building E
Conference Center, 2900 Semiconductor Drive, Santa Clara
RSVP: Via EventBrite link: 48corechip.eventbrite.com Web: ewh.ieee.org/r6/scv/computer
Jason Howard is a senior technical research lead for the Advanced Microprocessor Research team within Intel Labs, Hillsboro, Oregon. During his time with Intel Labs, Howard has worked on projects ranging from high performance low power digital building blocks to the 80-Tile TeraFLOPs NoC Processor. His research interests include alternative microprocessor architectures, energy efficient design techniques, variation aware and tolerant circuitry, and exascale computing.
Jason received the B.S. degree and M.S degree in electrical engineering Brigham Young University, Provo, UT, in 1998 and 2000 respectively. He joined Intel Corporation in 2000. He has authored and co-authored several papers and has several patents issued and pending.
In this talk, Jason Howard describes a processor integrating 48 IA-32 cores, 4 DDR3 memory channels, and a voltage regulator controller in a 6×4 2D-mesh network-on-chip architecture. Located at each mesh node is a five-port virtual cut-through packet switched router shared between two cores. Core-to-core communication uses message passing while exploiting 384KB of on-die shared memory. Fine grain power management takes advantage of 8 voltage and 28 frequency islands to allow independent DVFS of cores and mesh. At the nominal 1.1V, cores operate at 1GHz while the 2D-mesh operates at 2GHz. As performance and voltage scales, the processor dissipates between 25W and 125W. The 567mm2 processor is implemented in 45nm Hi-K CMOS and has 1,300,000,000 transistors.
TUESDAY June 8, 2010
SCV Computer, with Solid State Circuits
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 41
Novel Fine Pitch, Low Profile, Low Cost Connector Technology
Speaker: David Light, VP Technology, Neoconix, Inc. Time: Dinner at 6:00 PM; Presentation at 6:45 PM Cost: $20 if reserved by June 7 ($10 for students,
unemployed); $5 more at door; vegetarian available; no cost for presentation only
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: Through the website link Web: www.cpmt.org/scv
David Light is Vice President, Technology at Neoconix, Inc. Prior to joining Neoconix in September, 2009, he was an independent consultant in providing ongoing and project-based services in technology development, intellectual property evaluation, business strategy, and technology marketing to clients including Tessera, Samtec, Flint Hills Solutions, Microconnex, Coleman Research Group, Latham and Watkins, and Neoconix, in areas spanning microelectronics packaging, high density substrates, and surface mount technology. His career has included fundamental process and materials R&D, process and product development, technology management, marketing and business development, manufacturing operations, and General Management. His areas of expertise include substrates and printed circuits, semiconductor packages (including assembly, test and burn-in), interconnect technologies, test tooling, and miniaturized electronic systems. David’s career began at the IBM T.J. Watson Research Center, in the electrochemical studies group, and has included technology and business leadership positions at IBM Microelectronics, Tessera, Flex2Chip, and Sunright/KES Systems.
David is a graduate of Stanford University. He has over three dozen issued US patents and has authored numerous technical publications and presentations. He is a member of IEEE CPMT.
This talk will present a revolutionary connector
technology providing unparalleled design flexibility at low cost. A photolithographic approach to connector definition coupled with batch, printed circuit manufacturing methods allows highly configurable designs. Pin-out modifications, electrical performance tuning, tailoring of mechanical characteristics, and even adjustment of connector thickness can be accomplished quickly and easily with CAD modifications to low cost photo-masks and/or by modifications to the bill of materials. Connectors can be custom designed and fully optimized for each revision or generation of a product, with minimal tooling costs and lead time. Lithographically defined contact arrays also enable high levels of integration and miniaturization — pitch is no longer limited by the practical limitations of injection molding connector housings into which free standing spring contacts are subsequently stitched. Neoconix utilizes a MEMS process model, implemented using the low-cost printed circuit substrate infrastructure, to fabricate contact arrays that can scale with advances in photo-lithography and HDI printed circuit substrate technology.
The connector fabrication process starts by defining arrays of copper alloy beams, in sheet format, in their ultimate configuration using large format, batch lithography and etch methods. The arrays of beams, still in sheet format, are then formed into three dimensional, 'S'-shaped cantilever beams, using low cost, programmable dies. The sheets of contact arrays are subsequently integrated into connector 'interposer' structures using standard printed circuit fabrication processes, including lamination, plating, and etching. The resulting one or two sided contact arrays can function as freestanding interposers or are readily integrated into standardized, low cost connector housings that provide alignment, attachment and actuation.
This talk will review basic elements of the Neoconix PCBeam technology, and will use real-world applications as well as simulations to describe recent learning on the relative impact of the flexible design elements on signal integrity and bandwidth, mechanical characteristics, durability, contact resistance, and reliability, and will describe applications where system level designs have been improved from a functional, form factor and/or cost perspective by implementing Neoconix interconnect structures.
WEDNESDAY June 9, 2010
SCV Components, Packaging and Manufacturing Technology
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 42
Nanophosphors: Lighting to Life Sciences
Speaker: Dr. Ravi P. Rao, Materials Research
Laboratory, SRI International Time: Registration & light lunch at 11:30 AM;
Presentation at 12:00 Noon Cost: IEEE Members and Students $5;
Non-Members $10 Place: National Semiconductor Bldg E-1 CMA
Room, 2900 Semiconductor Drive, Santa Clara
RSVP: from the website Web: www.ieee.org/nano
Ravi P Rao is currently working as Phosphor Program Leader at SRI International. He obtained his Ph. D. from Indian Institute of Technology in material science in 1982. Since then, he has worked in Government, academia and industry and continues his work in developing phosphors for Lighting, Displays, Medical, Military, Security, Solar Energy, and Authentication. He published a book, contributed number book chapters publications (79), 19 patents. He is a Fellow of the Luminescence Society of India. He is also a senior member of IEEE, SID, LSI and other scientific societies.
Nanomaterials are extensively investigated due to
better optical, electrical and mechanical properties in various applications. In nanocrystals, the quantum confinement effect plays an essential role in optical transitions. Nanocrystals have large surface-to-volume ratios. Luminescent properties will depend on the size and surface structure of nanocrystals. Various nanophosphors of novel formulations and processes of synthesis with better morphology, high efficiency, improved stability and longer life are being developed at SRI International. Efforts are being made to employ these nanophosphors in medical applications such as photodynamic therapy, DNA sequencing, high resolution digital mammography, cancer diagnosis and therapeutics, bio-imaging, -dosimetry, and –tagging. Advantages of applying these nanophosphors in LED based solid state lighting, 3D displays, in defense as NIR sensors, and invisible markers, and in security to sense nuclear radiation from WMD (biological and nuclear events), and authentication markers along with various process in synthesis and manufacturing will be described. Finally, pros, cons and challenges (cost, environmental impact, personal safety, health risks and storage) in manufacturing of nanophosphors will also be presented.
TUESDAY June 15, 2010
SCV Nanotechnology
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 43
Cyber Security for Industrial Control Systems
Speaker: Joseph Weiss, Managing Partner, Applied
Control Solutions, LLC Time: No-host social at 5:30 PM; Presentation at
6:15 PM; Dinner at 7:15 PM; Presentation continues at 8:00 PM
Cost: Dinner is $20 for IEEE members; $25 for non-members
Place: Marie Callender's Restaurant - The Garden Room, 2090 Diamond Blvd, Concord
RSVP: Please respond by June 16 to Gregg Boltz, [email protected], 925-210-2571
Web: www.e-grid.net/docs/1006-oeb-ias.pdf
Joseph Weiss is an industry expert on control systems and electronic security of control systems, with more than 35 years of experience in the energy industry. Mr. Weiss spent more than 14 years at the Electric Power Research Institute (EPRI). He provided testimony before three House subcommittees and one Senate Committee. He has published over 60 papers on instrumentation, controls, and diagnostics including a chapter on cyber security for Electric Power Substations Engineering and the book Protecting Industrial Control Systems from Electronic Threats. He was tasked to write the White Paper on Industrial Control Systems Security for the Center for Strategic and International Studies Blue Ribbon Panel preparing cyber security recommendations for the Obama administration. Mr. Weiss has conducted several SCADA, substation, plant control system, and water systems vulnerability and risk assessments and conducted short courses on control system security. He established and chairs the annual Control System Cyber Security Conference. Mr. Weiss is an ISA Fellow with two patents on instrumentation and control systems. He is a registered professional engineer in the State of California, and a Certified Information Security Manager.
The convergence of Industrial Control Systems (ICS) with general information technology (IT) systems has created security vulnerabilities for the traditionally isolated ICS. The convergence is driven by: 1) the need to share process monitoring data among different corporate work groups; 2) the wide-spread adoption of Ethernet for data communication of ICS; and 3) the ability to leverage existing IT networks and backbone systems.
Corporate downsizing has led to the need for remote access to support ICS. Remote access includes dial-up, LAN/WAN, wireless, etc. With the flexibility of remote access come additional cyber security vulnerabilities. This presentation will describe what is control system cyber security, how it is different than business IT security, provide some actual examples of control system cyber incidents, and provide recommendations for what companies can do to better secure their systems.
THURSDAY June 17, 2010
OEB Industry Applications
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 44
An Investigation of Magnetic Reversal at Almost the Nanoscale
Speaker: E. Dan Dahlberg, School of Physics and
Astronomy, University of Minnesota Time: 11:00 AM Cost: none Place: Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley RSVP: Please respond by email with name,
company, to Peter Fischer, [email protected] by June 16
Web: ewh.ieee.org/r6/oeb/mag
E. Dan Dahlberg received the B.S. and M.S. in physics from the University of Texas at Arlington in 1970 and 1972, respectively, and the Ph.D. from University of California, Los Angeles, in 1978. He joined the faculty at the University of Minnesota in 1980 and is currently a professor of physics and an Institute of Technology Distinguished Professor. He is the director and principal investigator of the Magnetic Microscopy Center (MMC) at the university. His recent research is on exchange bias, the physics of magnetic tunnel junctions, and noise in magnetic devices. Some of his previous research includes magnetotransport and other magnetic properties of thin films and multilayers, the dynamics of spin glasses, nonequilibrium superconductivity, the thermodynamics of magnetic superconductors, and the quantum Hall effect.
Prof. Dahlberg is a member of Sigma Pi Sigma (1971) and a Fellow of the American Association for the Advancement of Science (1995) and the American Physical Society (1996). He was an Alfred P. Sloan Foundation Research Fellow (1981-1985). He served as general chair of the 2001 Joint Magnetism and Magnetic Materials (MMM)-Intermag Conference and as an editor of several MMM and MMM-Intermag conferences. He was divisional councilor to the Division of Condensed Matter Physics of the American Physical Society (1999-2002), a member of the Executive Board of American Physical Society (2001-2002), and Vice President of the International Union of Pure and Applied Physics (IUPAP) (2006-2009).
One of the current frontiers in magnetism is to
understand the domain structure and the magnetization reversal in nanometer-sized particles.
Explorations at these length scales have been aided by the development of new magnetic imaging techniques, one of which is the magnetic force microscope (MFM), a variant of the atomic force microscope. We have utilized the high resolution MFM (30 nm) we developed to increase our fundamental understanding of magnetism on this length scale. I will discuss the field-induced magnetic reversal in particles on the order of hundreds of nanometers in width and about twice that in length. In general, for the small aspect (length to width) ratio, the magnetization reverses by the formation of a single vortex and its propagation down the length of a particle (when the fields are applied perpendicular to the long axis). There are some surprises when the aspect ratio of the particles increases.
Monday June 21, 2010
OEB Magnetics
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 45
An Investigation of Magnetic Reversal at Almost the Nanoscale
Speaker: E. Dan Dahlberg, School of Physics and
Astronomy, University of Minnesota Time: 11:00 AM Cost: none Place: Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley RSVP: Please respond by email with name,
company, to Peter Fischer, [email protected] by June 16
Web: ewh.ieee.org/r6/oeb/mag
E. Dan Dahlberg received the B.S. and M.S. in physics from the University of Texas at Arlington in 1970 and 1972, respectively, and the Ph.D. from University of California, Los Angeles, in 1978. He joined the faculty at the University of Minnesota in 1980 and is currently a professor of physics and an Institute of Technology Distinguished Professor. He is the director and principal investigator of the Magnetic Microscopy Center (MMC) at the university. His recent research is on exchange bias, the physics of magnetic tunnel junctions, and noise in magnetic devices. Some of his previous research includes magnetotransport and other magnetic properties of thin films and multilayers, the dynamics of spin glasses, nonequilibrium superconductivity, the thermodynamics of magnetic superconductors, and the quantum Hall effect.
Prof. Dahlberg is a member of Sigma Pi Sigma (1971) and a Fellow of the American Association for the Advancement of Science (1995) and the American Physical Society (1996). He was an Alfred P. Sloan Foundation Research Fellow (1981-1985). He served as general chair of the 2001 Joint Magnetism and Magnetic Materials (MMM)-Intermag Conference and as an editor of several MMM and MMM-Intermag conferences. He was divisional councilor to the Division of Condensed Matter Physics of the American Physical Society (1999-2002), a member of the Executive Board of American Physical Society (2001-2002), and Vice President of the International Union of Pure and Applied Physics (IUPAP) (2006-2009).
One of the current frontiers in magnetism is to
understand the domain structure and the magnetization reversal in nanometer-sized particles.
Explorations at these length scales have been aided by the development of new magnetic imaging techniques, one of which is the magnetic force microscope (MFM), a variant of the atomic force microscope. We have utilized the high resolution MFM (30 nm) we developed to increase our fundamental understanding of magnetism on this length scale. I will discuss the field-induced magnetic reversal in particles on the order of hundreds of nanometers in width and about twice that in length. In general, for the small aspect (length to width) ratio, the magnetization reverses by the formation of a single vortex and its propagation down the length of a particle (when the fields are applied perpendicular to the long axis). There are some surprises when the aspect ratio of the particles increases.
Tuesday June 22, 2010
SCV Magnetics
May 2010 V is i t us a t w w w . e - G R I D . n e t Page 46
Matching Financing Needs to the Right Financial Structure
(5-part Webinar)
Instructor: Dr. Dileep Rao, adjunct professor and
author of Lessons from Bootstrap to Billions Time: 11:00 AM - Noon (monthly, part 2 of 5) Cost: IEEE members: $69 each or $129 for all
five. Non-members: $99 for each or $225 for all five
Place: on the Internet RSVP: Sign up in advance, from the website Web: www.ieeeusa.org/careers/webinars/2010/
Bootstrap-to-Billions.html
Dr. Dileep Rao, financier, columnist, adjunct professor and workshop leader, has partnered with the IEEE-USA Entrepreneurial Activities Committee to conduct a series of webinars for you. Dr. Rao financed more than 450 businesses and real estate projects as the vice-president of a venture development financial institution.
Currently, Rao is an advisor to governments, Fortune 1000 corporations, development financial institutions and entrepreneurs on business development and financing. He also teaches New Business Development & Financing in MBA and Executive MBA programs in the United States, Europe and Asia, and has been selected as Outstanding MBA Teacher at the Carlson School of Management located at the University of Minnesota. Rao is an entrepreneurial finance columnist for Forbes.com, and has written such acclaimed books as Handbook of Business Finance & Capital Sources and Business Financing: 25 Keys to Raising Money. He also holds two engineering degrees and a Ph.D. in Business Administration.
Dr. Dileep Rao, author of Lessons from
Bootstrap to Billions, will lead a series of IEEE-USA webinars for future and seasoned entrepreneurs. The webinars will be based on his book, which illustrates how, contrary to currently popular belief, entrepreneurs can bootstrap to success. Bootstrap to Billions shows entrepreneurs and managers how business giants used alternate financing options to grow. Most of them — about 80 percent — never got venture capital. These entrepreneurs found their best market; designed the right strategy; developed the organization culture and leadership; and reached the top with capital-efficient strategies that minimized the need for capital. Lack of money did not constrain their growth. Many entrepreneurs may be better off using alternate financing to build and control their business, and to create wealth and keep it. Dr. Rao's presentations are broken down into a series of five monthly webinars: 20 May 2010 - Link Your Business Plan to Your
Financing Needs 24 June 2010 – Matching Financing Needs to the
Right Financial Structure 22 July 2010 - Fine-Tune Financing: Finding the
Right Sources/Instruments 19 August 2010 - Reduce the Agony: Learn How to
Find Financing 16 September 2010 - After the Financing: Better
Decisions & Control
THURSDAY June 24, 2010 (2 of 5) IEEE-USA Entrepreneurs Webinar Series