inemi project on assembly-level reliability qualification for enterprise...
TRANSCRIPT
©2014 iNEMI
End of Project Webinar
Feb 27, 2014Co-chairs:
Thomas Homorodi (Dell)
Aamir Kazi (Dell)
iNEMI Project on Assembly-Level Reliability
Qualification for Enterprise PCBAs
1©2014 iNEMI
Agenda
• Industry Participants
• Acknowledgments
• Background and Impetus
• Goals
• Benefits
• Scope: Is/ Is Not
• Schedule
• Document Walk-through & Link
• Wrap up and Next Steps
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Industry Participants
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Acknowledgments
The chairs profusely thank the project participants:
• Fubin Song, Celestica
• Mitchell Ferrill, IBM
• Jeffrey Lee, iST –Integrated Service Technology, Inc.
• Tomy Dong, Lenovo
• Vico Duan, Lenovo
• Leo Zhao, Lenovo
• John Godfrey, Microsoft
• Ander Hsieh, Wistron
• Jimmy Yang, Wistron
And our Project Manager Mark Schaffer, iNEMI
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Background and Impetus
• Proliferation of PCBA assembly sites worldwide
• Concurrent intro of new materials with assembly and
feature complexity
• Opaque, non-standard qualification test suites
• Inconsistent OEM requirements and ODM/EMS/CM
responses for similar assembly complexity
• ODMs receive diverging and conflicting guidance from
the multiple OEMs, leading to…
• Multiple qualification cycles at a single ODM/CM add
time, costs and delays time-to-market
Enterprise PCBA Qualification: Pain Points Addressed
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Problem Statement, Opportunity and Goal
• Problem Statement
– Inconsistency in the qualification of new technology, materials, suppliers/factories at EMS and ODM firms by OEMs (Each OEM has their own, and different, qualification process).
• Opportunity
– “Level the playing field” -- Standardize PCBA reliability qualification methods at the ODM/CM/EMS level
– Improve supplier capabilities
• Goal
– Develop an industry-wide set of common qualification elements and processes for consistent ODM/CM/EMS PCBA reliability
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Benefits
• Standardize OEM qualification suites
– Analogous to the automotive industry’s QS-9000
• Reduce cost
– by avoiding repeated qualification tests
• Satisfy demand
– for qualifying similar technologies across various OEMs
• Level playing field
– Across OEM supply base and industry as a whole
• Reduce ambiguity
– With qualification suites at ODM/CM/EMS
• Streamline, simplify
– Negotiation of qualification suite requirements
• Instill supplier responsibility
• Establish qualification level
– When OEM’s are all aligned it administers a consistent minimum qualification
requirement across supply base
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IS / IS NOT AnalysisThis document IS: This document IS NOT:
Defining an OEM/industry-wide Enterprise (inlc
telecom datacenter) PCBA reliability qualification
methods and processes (toolbox) for developed
products using:
• new suppliers
• new technologies
• new materials
• new processes
Intended for
• Outdoor-telecom
• Military/aerospace
• Medical
For supplier qualifications intended to evaluate
capability and quality. The document is meant to
qualify new technologies where process development
work is complete.
Early R&D for new technology/process or materials’
viability; not for process definition/development or
material evaluation
Identification of Best Known Methods/ Practices in
reliability of electronic OEMs for “new” qualifications.
Developing new reliability test
standards/procedures/test methods
Testing/materials resources commitment
Utilizes existing industry standards/procedures
wherever appropriate.
Regulatory/environmental materials compliance
PCBA-level qualification, with evaluation of risk sites
on PCBs that depend on solder-assembly process
Re-creation of component qualification test methods
and processes
A reliability qualification of newly developed solder
assembly processes, technologies, materials at
manufacturing facilities of new and existing suppliers.
Failure Analysis requirement/procedure development
Raw PCB material/ construction evaluation
Definition of test-level failure criteria. Definition of qualification-suite level failure criteria –
this is the domain of each OEM, and defined by them
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Project Schedule & Tasks
• The Timetable for this project was 12 months
TASK LISTQ1-’13 Q2 Q3 Q4 Q1-’14
J F M A M J J A S O N D J F M
Task 1: Disseminate current document
Task 2: Review OEM documents
Task 3: Gap analyses
Task 4: Develop Flow, of qualification
Task 5: Develop agreement/modifications
Task 6: Editing/rewriting
Task 7: Approval by team
Task 8: Invite EM/CM/ODM feedback
Task 9: Release completed document
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Document Walk-through
iNEMI Project Link
(and document download):
http://www.inemi.org/node/2325
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Wrap up and Next Steps
• Develop database of qualification results
• Classify results by
– Materials: solders, PCBA
– Technology/ complexity: Feature sets affected by processes and factory capabilities
• BGA density and spread on single assembly
• Layer count and PCB thickness
– Assembly Processes
• Reflow, Wave, Selective solder
• Database will help ODM/ CMS business development
– Helps OEMs’ assess EMS/CM by minimizing reliability uncertainty
– Leverage qualification results for new product using previously qualified processes
11©2014 iNEMI
Thank you for attending!
Questions and Comments
