The SEMATECH Cost of Ownership Model

Mike BermanMike Berman

U of ArizonaU of Arizona

AGENDA

Why use it?Why use it? How to use it?How to use it? What if?What if?

CoO of a new systemCoO of a new system Process 1 Vs Process 2Process 1 Vs Process 2 Quality Improvement ToolQuality Improvement Tool

SummarySummary

Purpose:

““The SEMATECH Cost of Ownership The SEMATECH Cost of Ownership (SCoO) model was developed to address (SCoO) model was developed to address the economic and productive performance the economic and productive performance of a tool while operating in pre-production of a tool while operating in pre-production or in production.”or in production.”

Description:

““The SCoO model is a calculator to perform The SCoO model is a calculator to perform a cost comparison of options for completing a cost comparison of options for completing a step in a semiconductor wafer fabrication a step in a semiconductor wafer fabrication process”process”

Why is the SCoO so important?

Manufacturing cost control is critical to Manufacturing cost control is critical to survival in the market place.survival in the market place.

For cost control you must: For cost control you must: Know the cost of each stepKnow the cost of each step Understand the reasons for these costsUnderstand the reasons for these costs Control and reduce the costsControl and reduce the costs

ASP’s drop each year, So must costs!!!ASP’s drop each year, So must costs!!!

Why use the SEMATECH Model?

Independent of OEM & the SupplierIndependent of OEM & the Supplier Developed by SEMATECHDeveloped by SEMATECH It is the De Facto standardIt is the De Facto standard It permits “Apple’s to Apple’s comparisonsIt permits “Apple’s to Apple’s comparisons

Cost of Ownership Calculation

RELIABILITYPERIODIC CHECKSOPERATING RATETHRUPUT YIELD CoO Cost per wafer outDEFECT DENSITY CalculatorACQUISITION COSTSSPACE REQUIREDPROVE IN COSTSTRAININGOPERATING COSTS

The SEMATECH Model is

NOT

A MEASURE OF THE PROCESSA MEASURE OF THE PROCESS If the new process does not work orIf the new process does not work or Has a lower yield, do not waste your timeHas a lower yield, do not waste your time

ABSOLUTEABSOLUTE Able to make tools smaller!Able to make tools smaller!

Model Description

The Model is very comprehensiveThe Model is very comprehensive Up to 90 inputs & 210 output parametersUp to 90 inputs & 210 output parameters Can be used with as few as 10 inputs & 1 outputCan be used with as few as 10 inputs & 1 output Once understood it produces simple and fast resultsOnce understood it produces simple and fast results The Rewards are enormous:The Rewards are enormous:

High benefit to effort ratioHigh benefit to effort ratio

Detailed insight into the cost makeup of each stepDetailed insight into the cost makeup of each step

““What if” type questions can be addressedWhat if” type questions can be addressed

The SCoO is most useful as a The SCoO is most useful as a comparison toolcomparison tool..

Dos & Do Nots:

Do not “improve” “improve” the technique used to find the values

Do “add spreadsheets within the spreadsheet” See next page for examples

Examples

For sputter Target cost per wafer:For sputter Target cost per wafer: Target Life, Target cost, Avg. process depTarget Life, Target cost, Avg. process dep

Cost of gas per waferCost of gas per wafer(Etch/CVD):(Etch/CVD):

Volume & cost of tankVolume & cost of tank Usage, flow and time (all steps)Usage, flow and time (all steps)

CmpCmp Pad cost, life(in polish mins or wafers)Pad cost, life(in polish mins or wafers)

Major parts of the Model:

Title: Fill in more detail than you will need!Title: Fill in more detail than you will need! In 1 year they will all look the same!In 1 year they will all look the same!

VOLUME/THROUGHPUT DATA EQUIPMENT DATA PRODUCTION/RUNNING DATA (usage) MAINTENANCE COSTS PERSONNEL PER SYSTEM /STANDARD RATES ANNUAL COST PER GOOD WAFER ($) MANAGEMENT SUMMARY

PHOTO LITHOGRAPHY WORK SHEET

E10-90 Equipment States Stacking ChartUNSCHEDULED

DOWNTIME

re-qualtime

EQUIPMENT SCHEDULEDDOWNTIME DOWNTIME

Set-UpOperations

TimePRODUCTIVE

TIME Total Time168 Hr/week

EQUIPMENTUPTIME Qual production test Production

Time Waiting Results time

STANDBY

ENGINEERING

NON-SCHEDULED

Title: Fill in more detail than you will need!

1 COST OF OWNERSHIP CALCULATION 3/ 22/ 2000

2 FOR: U-R-Fabs SUPPLIER: CMP Full Process MODEL: ABC123

3 Q LEVEL: DATA FROM: M. Berman DATED: 3/22/2000

VOLUME/THROUGHPUT DATA

INPUT SHEET PAGE 1 OF 3VOLUME/THROUGHPUT DATA DENOMINATIONTIME NOT AVAILABLE SCHEDULED MAINTENANCE 10 HRS/WK(PER SYSTEM) ENGINEERING USAGE 17 HRS/WK

STANDBY 18 HRS/WKPRODUCTION TESTS SCHEDULED #/WKMTTT 0.50 HOURSMTBF 75 HOURS (R)

G118=106.8 AVERAGE RESPONSE TIME 4 HOURS(Total hours/wk) MTTR 4 HOURS

MTBA 100 HOURS (R)MTTA 6 MINUTES

THROUGHPUT @ CAPACITY PER SYSTEM 40.0 WFRS/HOUR (R)PRODUCTION REQUIREMENTS 95% burdened 4271.4 STARTS/WK (R)LOT SIZE 25 WFRS/LOT (R)REDO RATE % AS DECIMALTHROUGHPUT YIELD 99.50% % AS DECIMAL (R)DEFECT DENSITY 0.100 PER cm 2̂# OF SYSTEMS 1 OPERATOR CAN RUN 2 NUMBER (R)

EQUIPMENT DATA

EQUIPMENT DATAORIGINAL COST PER SYSTEMEQUIP COST $2,500,000 DOLLARS

TRANSPORTATION COST $500,000 DOLLARSINSTALLATION COST DOLLARSOTHER DEPRECIABLE COST DOLLARS

MOVES AND REARRANGEMENTS/SYSTEM DOLLARSSYSTEM PROVE IN COSTS ENGINEERING EFFORT 40 MAN-HOURS(PER SYSTEM) MAINTENANCE EFFORT 30 MAN-HOURS

OPERATOR EFFORT MAN-HOURSSUPPLIES $2,000 DOLLARSMATERIAL DOLLARSOTHER COSTS DOLLARS

FLOOR SPACE PER SYSTEMCLASS 1 Front of tool 10 SQ. FEETCLASS 10 SQ. FEETCLASS 100 Back of tool 17 SQ. FEETOTHER Pump/TCU/RF 18 SQ. FEET

TRAINING REQUIREMENTS OPERATORS MAN HOURS(PER SYSTEM) ENGINEERS MAN HOURS

MAINTENANCE PERSONNEL MAN HOURSOTHER COSTS DOLLARS

PRODUCTION/RUNNING DATA (usage)INPUT SHEET PAGE 2 OF 3PRODUCTION/RUNNING DATA DENOMINATIONUTILITY USAGE PER SYSTEMELECTRICITY, Kw-hr/wk 17 $7,140 ANNUAL COST

NATURAL GAS ANNUAL COSTCITY WATER ANNUAL COSTDI WATER ANNUAL COSTCHILLED WATER ANNUAL COST

SUPPLY COSTS PER SYSTEMChemicals ANNUAL COSTL/min min/waf. $/L per wafer ANNUAL COST

0.1 1.675 $15.00 Slurry $2.51 $536,717 ANNUAL COST0.1 1.675 $2.50 H2O2 $0.42 $89,453 ANNUAL COST

ANNUAL COSTPads ANNUAL COST

Pad type cost/pad Wf/pad pads/Wk Extral/week Total pads ANNUAL COST1400 K 500 250 17.09 2 19.09 $477,237 ANNUAL COSTPolitex 100 750 5.70 1 6.70 $33,476 ANNUAL COSTDF200 10 500 0.00 1 1.00 $501 ANNUAL COST

ANNUAL COST ANNUAL COSTPROTECTIVE CLOTHING ANNUAL COSTOFFICE SUPPLIES ANNUAL COSTCOMPUTER SOFTWARE ANNUAL COSTEXPENSED COMPUTER EQPT. ANNUAL COSTCOMPUTER SUPPLIES ANNUAL COSTFORMS ANNUAL COSTOTHER PRODUCTION COSTS ANNUAL COST

WASTE DISPOSAL COSTS/SYSTEM ANNUAL COSTMATERIAL COSTS/SYSTEM TEST WAFERS WAFERS/WEEK

OTHER MATERIALS ANNUAL COST

MAINTENANCE COSTS

MAINTENANCE COSTS PARTS $50,000 ANNUAL COST(PER SYSTEM) SUPPLIER SERVICE CONTRACT ANNUAL COST

SUPPLIER TRAINING ANNUAL COST

SOFTWARE CONTRACT ANNUAL COST

PERSONNEL PER SYSTEM ENGINEERS HOURS/WEEK

SUPERVISION HOURS/WEEK

CONTRACT LABOR ANNUAL COST

PERSONNEL PER SYSTEM /STANDARD RATES

INPUT SHEET PAGE 3 OF 3STANDARD RATES DENOMINATIONSCHEDULED PRODUCTION HOURS/WEEK/TEAM 42 HOURS

TEAMS COVERING A WEEK 4 TEAMSDAYS/YEAR 350 DAYSHOURS/DAY 24.0 HOURSOPERATOR PRODUCTIVE TIME 80% % AS DECIMAL

BURDENED SALARY RATESENGINEERING $100,000 ANNUAL RATESUPERVISION $80,000 ANNUAL RATE

BURDENED LABOR RATES OPERATOR $26.00 HOURLY RATEMAINTENANCE PERSONNEL $26.00 HOURLY RATE

SPACE (RENT) RATES CLASS 1 $360.00 $/SQ. FT./YEARCLASS 10 $240.00 $/SQ. FT./YEARCLASS 100 $100.00 $/SQ. FT./YEAROTHER $50.00 $/SQ. FT./YEAR

OTHER SUPPORT SERVICESEMPLOYEE RELATED $ PER EMPLOYEE/YRPRODUCTION RELATED $ PER YEAR

ADMINISTRATIVE RATES INSURANCE % OF EQPT VALUEPERSONAL PROP. TAXES % OF EQPT VALUEINTEREST 10.00% % RATEINFLATION RATE 3.00% ANNUAL %LIFE OF EQUIPMENT (ST LINE) 5 YEARS

TEST WAFER COST $80.00 $/WAFERVALUE OF INCOMING WAFER AT THIS POINT IN PROCESS $400.00 $/WAFERVALUE OF COMPLETED WAFER AT END OF PROCESS FLOW. $1,400.00 $/WAFERDIE AREA 1 cm 2̂PROBABILITY OF A FAILURE FROM A DEFECT AT THIS STEP 0.16

The “Must” have lines (only 7)

VOLUME/THROUGHPUT DATA DENOMINATIONTIME NOT AVAILABLE SCHEDULED MAINTENANCE 10 HRS/WK(PER SYSTEM) ENGINEERING USAGE 17 HRS/WK

STANDBY 18 HRS/WKMTBF 75 HOURS (R)MTBA 100 HOURS (R)

THROUGHPUT @ CAPACITY PER SYSTEM 40 WFRS/HOUR (R)PRODUCTION REQUIREMENTS 95% burdened 4271 STARTS/WK (R)LOT SIZE 25 WFRS/LOT (R)THROUGHPUT YIELD 0.995 % AS DECIMAL (R)# OF SYSTEMS 1 OPERATOR CAN RUN 2 NUMBER (R)EQUIPMENT DATAORIGINAL COST PER SYSTEM EQUIP COST 2,500,000$ DOLLARS

The more you use, the better it is!VOLUME/THROUGHPUT DATA DENOMINATIONTIME NOT AVAILABLE SCHEDULED MAINTENANCE 10 HRS/WK(PER SYSTEM) ENGINEERING USAGE 17 HRS/WK

STANDBY 18 HRS/WKMTBF 75 HOURS (R)MTBA 100 HOURS (R)

THROUGHPUT @ CAPACITY PER SYSTEM 40 WFRS/HOUR (R)PRODUCTION REQUIREMENTS 95% burdened 4271 STARTS/WK (R)LOT SIZE 25 WFRS/LOT (R)THROUGHPUT YIELD 0.995 % AS DECIMAL (R)# OF SYSTEMS 1 OPERATOR CAN RUN 2 NUMBER (R)EQUIPMENT DATAORIGINAL COST PER SYSTEM EQUIP COST 2,500,000$ DOLLARS

TRANSPORTATION COST 500,000$ DOLLARSSUPPLY COSTS PER SYSTEM ChemicalsL/min min/waf. $/L per wafer

0.1 1.675 15 Slurry 2.5125 536,717$ ANNUAL COST0.1 1.675 2.5 H2O2 0.41875 89,453$ ANNUAL COST

Pads ANNUAL COST

Pad type cost/pad Wf/pad pads/Wk Extral/weekTotal pads ANNUAL COST1400 K 500 250 17.0895 2 19.0895 477,237$ ANNUAL COSTPolitex 100 750 5.695166 1 6.695166 33,476$ ANNUAL COSTDF200 10 500 0.002 1 1.002 501$ ANNUAL COSTWASTE DISPOSAL COSTS/SYSTEM ANNUAL COSTMAINTENANCE COSTS PARTS 50,000$ ANNUAL COST(PER SYSTEM) SUPPLIER SERVICE CONTRACT ANNUAL COST

How to use the SCoO

It’s in Excel-not PowerPoint!It’s in Excel-not PowerPoint!

Standard Rates

Burdened Salary Burdened Salary EngineerEngineer $115,000$115,000 SupervisionSupervision $100,000$100,000 OperatorOperator $30./Hr$30./Hr MaintenanceMaintenance $35./Hr$35./Hr

Administrative RatesAdministrative Rates InsuranceInsurance 0.47 %0.47 % Personal Prop. TaxPersonal Prop. Tax 1.34 %1.34 % InterestInterest 10.0 %10.0 % Inflation RateInflation Rate 3.0 % 3.0 % Life of EquipmentLife of Equipment 5 years5 years Test Wafer CostTest Wafer Cost $80.00$80.00

Value of incoming Value of incoming $100 to $1400$100 to $1400 Value of completedValue of completed $1,500.$1,500.

Output (line 525)MANAGEMENT SUMMARY

$/WAFERPRODUCTION

THROUGHPUT YIELD 99.50% $2.01DEFECT DENSITY (cm2) 0.10PROBE YIELD 100.00%COMPOSITE YIELD (Throughput Yield X Probe Yield) 99.50% $2.01

* PRODUCTION UTILIZATION CAPABILITY 84.47%

EQUIPMENTORIGINAL CAPITAL COST PER SYSTEM $2,500,000 $2.35RAW THROUGHPUT (Throughput at Capacity) 40MAXIMUM WAFER STARTS PER WEEK PER SYSTEM 4272

** EQUIPMENT UTILIZATION CAPABILITY 84.47%

HEADCOUNT PER SHIFTDIRECT 0.4 $0.46MAINTENANCE 0.2 $0.12INDIRECT 0.0TOTAL 0.6 $0.58

TOP THREE COST DRIVERSCONSUMABLES 47.15% $5.72EQUIPMENT (Depr, Moves, Qual, Space, Train'g) 23.57% $2.86SCRAP 16.57% $2.01ALL OTHERS 12.70% $1.54

COST PER GOOD WAFER OUT $12.13

Output (line 357/382)

GOOD WAFER ($)

ANNUAL COSTS

($K)

% OF TOTAL COST

EQUIPMENT $2.88 611 23%CONSUMABLES $5.39 1145 44%MATERIAL $0.00 0 0%MAINTENANCE $0.35 74 3%LABOR $0.44 93 4%SUPPORT PERSONNEL $0.00 0 0%SCRAP $2.01 427 16%SUPPORT SERVICES $0.00 0 0%ADMINISTRATIVE COSTS $1.27 270 10%

TOTAL $12.33 2620 100%

SURPRISES !!

Capital cost of the equipment may not be the Capital cost of the equipment may not be the driver for Cost of Ownershipdriver for Cost of Ownership

MTBF (>75 hr.) impact on utilization & cost MTBF (>75 hr.) impact on utilization & cost reduction is not as significant as previously reduction is not as significant as previously thoughtthought

Defect density & Line Yield are far more Defect density & Line Yield are far more important then previously anticipatedimportant then previously anticipated

The cost of the wafer at the process step is more The cost of the wafer at the process step is more important than previously consideredimportant than previously considered

Defect Density

Die area (Line 104)Die area (Line 104) 1 cm21 cm2 Probability of a failure (Line 105) Probability of a failure (Line 105) 16.6%16.6% Defect Density (Line 21) Vs Cost of WaferDefect Density (Line 21) Vs Cost of Wafer

.01 (defects/cm2).01 (defects/cm2) $8.49$8.49

.05.05 $15.06$15.06

.10.10 $23.27$23.27

.2.2 $39.69$39.69

.5.5 $88.95$88.95

.9.9 $154.64$154.64

CoO Scrap ($) CalculationUSER INPUTS ARE:

Start Rate (R)Thruput yield (Y)Physical defect density (D)

STANDARD IMPUTS ARE:Value of product wafer (V)Weeks per year worked (W)Die area (A)Probability of electrical defect (P)

THE FORMULA IS:$=R*W*V*(1-(Y/(1+A*P*D)))

CoO of a “New System”

Use your “best” numbersUse your “best” numbers Be fairBe fair Use a run rate of Max. (for most models) Use a run rate of Max. (for most models) This is NOT a measure of the ProcessThis is NOT a measure of the Process This is only an This is only an estimate, your real cost may

vary

Process 1 Vs Process 2

Be FairBe Fair Throughput & Defect Density are the main Throughput & Defect Density are the main

Drivers. Drivers. Use “real” numbers, not specsUse “real” numbers, not specs If you do not have “Real” Defect Density If you do not have “Real” Defect Density

Data, use “0”.Data, use “0”.

Quality Improvement Tool

Major use of the ModelMajor use of the Model Only change key cellsOnly change key cells Changes in “Throughput” need changes in Changes in “Throughput” need changes in

“Production requirements”“Production requirements” This can be used for “small changes”This can be used for “small changes”

How do I get my copy?

SEMATECH stopped support on 4-15-95.SEMATECH stopped support on 4-15-95. Now it is call “ TWO COOL” from Now it is call “ TWO COOL” from

Wright, Williams, & KellyWright, Williams, & Kelly 11875 Dublin Boulevard, Suite D26211875 Dublin Boulevard, Suite D262 Dublin, CA 94568Dublin, CA 94568 1-510-803-58801-510-803-5880

Cost $7,190.00 (in 1995)Cost $7,190.00 (in 1995)

SUMMARY

You now know more than most usersYou now know more than most users Use it, work with it Use it, work with it Split your screen, place line 382 at the top Split your screen, place line 382 at the top

of your screen, and make changes and see of your screen, and make changes and see how they change the total CoO.how they change the total CoO.