mission profile aware ic design - a case study -

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Mission Profile Aware IC Design - A Case Study -. Goeran Jerke, Robert Bosch GmbH, Automotive Electronics Andrew B. Kahng, University of California , San Diego. - PowerPoint PPT Presentation

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Mission Profile Aware IC Design- A Case Study -

Goeran Jerke, Robert Bosch GmbH, Automotive ElectronicsAndrew B. Kahng, University of California, San Diego

This research project is supported by the German Government, Federal Ministry of Education and Research under the grant number 16M3195C

• Introduction

• Design Challenges

• Mission Profile Aware Design

• Case Study – Electromigration Aware IC Design

• Summary and Conclusion

Overview

Apr 19, 2023 2Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Introduction

Apr 19, 2023Apr 19, 2023

ECUs, mechatronicssensors

MEMS sensors

Semiconductors

OEM

Tier 1

Tier 2

OEM – Original Equipment

Manufacturer

Introduction

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 5

Electronic Control Unit for ESP

Introduction

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 6

Tier 2 +

Tier 1

ECU for Driver Assistance Acceleration Sensor Module

Introduction

Apr 19, 2023 7Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

EnvironmentOEM

Tier 1, OEM

Tier 1

Tiers 1 and 2Foundry

Tier 2Foundry

System DesignPackaging

Constraints

Functional LoadConstraints

Temperatures Responsibility Parameters

Ambient Temperature (Car)

Installation Location (Car)

ECU Housing

ECU (internal)

Component Pin

Device Junction

• IC Technology Node Evolution

Introduction

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 8

Smart-Power

HV-CMOS

CMOS automotive

CMOS leading edge (ITRS)

• Aggressive technology scaling• Time to market co-design• System partitioning and integration• Robustness• Application requirements:– Origin and cause of requirements replicability, quality– Impact on application design and technologies– Application use operating conditions, environmental load– Functional loads thermal, current, voltage, ...– Reliability dominant failure mechanisms

• Complex, heterogeneous and fragmented design flows

Design Challenges

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 9

• Aggressive technology scaling• Time to market co-design• System partitioning and integration• Robustness• Application requirements:– Origin and cause of requirements replicability, quality– Impact on application design and technologies– Application use operating conditions, environmental load– Functional loads thermal, current, voltage, ...– Reliability dominant failure mechanisms

• Complex, heterogeneous and fragmented design flows

Design Challenges

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 10

• Introduction

• Design Challenges

• Mission Profile Aware Design

• Case Study – Electromigration Aware IC Design

• Summary and Conclusion

Overview

Apr 19, 2023 11Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 12

...

OEM

Tier 1

Tier 2

...Tier n

Supply Chain

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 13

...

OEM

Tier 1

Tier 2

...Tier n

Design Chain

MP

MP

MP

MP

MP

MPMP MP

Requirements, Constraints, Functional Loads, Environmental Loads

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 14

...

OEM

Tier 1

Tier 2

...Tier n

Design Chain

MP

MP

MP

MP

MP

MPMP MP

NEW: Achieved Robustness, Dominant Failure Mechanisms RIF

• Design Flow Overview

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 15

1 2

3 3

5

4 4

• Consistent consideration of mission profiles (MP)in supply chain • Reduction of design uncertainty

o More precise requirements and stress factorso Better understanding of system (failure mechanisms)

• Formalized and improved communication o OEM Tier n and Tier n OEM

• Standardization of structure and content of MPs• Electronic format MP documents • RMP Framework

(Tool-independent platform for mission profile aware design)

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 16

• Mission Profile Document– Document header– Operating states definition– Component definition– Property definition– Back-annotation data

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 17

• Mission Profile Document– Document header

• Author• Timestamp• Document history• Mounting location

– Operating states definition– Component definition– Property definition– Back-annotation data

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 18

• Mission Profile Document– Document header– Operating states definition

• Generic data container for operating states Manufacturing, assembly, storage, ... Car: start, acceleration, breaking, stop&go, freeway cruising, ... IC: power-up, idling, power-down, mode_1, mode_2, ...

– Component definition– Property definition– Back-annotation data

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 19

• Mission Profile Document– Document header– Operating states definition– Component definition

• Type e.g. ECU, passive component, IC, sensor, ...• Device I/O port definition (*)

– Operating state dependent environmental and functional loads» Heat flow» Transient/effective voltages and currents» ...

• Profiles– Property definition– Back-annotation data

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 20

(*) A port is a generic object: thermal port or electrical port

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 21

Source: ZVEI Handbook RV EE Modules 2012

• Mission Profile Document– Document header– Operating states definition– Component definition

• Type • Device I/O port definition• Profiles:

– Temperature histogram, gradient and cycling– Humidity vs. temperature histogram– Vibration– ...

– Property definition– Back-annotation data

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 22

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 23

Source: ZVEI Handbook RV EE Modules 2012

• Mission Profile Document– Document header– Operating states definition– Component definition– Property definition– Back-annotation data

• Reliability: Robustness Indication Figures (RIF) of dominant failure mechanisms

• Robustness: Enhanced Worst-Case Distance (WCD)

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 24

Mission Profile Aware Design

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 25

Component Parameter ECU TEEM_Package, TVMLA, TEEM_internal , TComp.Package , ... Board TBoard , ... Package TComp.Package, TComp.Pins, Rth, ... Chip TJunction, ... Sensor Discrete device, ...

Source: ZVEI Handbook RV EE Modules 2012

Component Properties

• Introduction

• Mission Profile Aware Design

• Case Study – Electromigration Aware IC Design

• Summary and Conclusion

Overview

Apr 19, 2023 26Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

• Quality of Functional Load Data

EM Aware Design – Case Study

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 27

Classic Design Flow

Current Aware Design Flow

EM Aware Design – Case Study

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 28

Current Aware Design Flow

Cell-Level

EM Aware Design – Case Study

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 29

Current Aware Design Flow

Block-Level

EM Aware Design – Case Study

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 30

I = 1A DC

AE/QMM

Electrical Overstress (EOS)

VoidsVoids HillockHillock

Electromigration (EM)

AE/QMM

Imax = 1A + Duty cycle

I

I

t

t

Abnormal peak event

EMEOS RPP

EM EOS RPP

AE/QMM

Repetitive Power Pulsing (RPP)

• Quality of Functional Load Data

Current (Density) Aware Routing to prevent EM and EOS

EM Aware Design – Case Study

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 31

• Effective Design Parameters

EM Aware Design – Case Study

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 33

• Electromigration Aware Design Flow

EM Aware Design – Case Study

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 34

1

2

5

3

4

4,5

• Current Density Critical Nets – Automotive IC A

EM Aware Design – Case Study

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 35

Different Mission Profile Next technology node

Base node

• Current Density Critical Nets – Automotive IC B

EM Aware Design – Case Study

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 36

Different Mission Profile

Next technology node

Base node

• Introduction

• Design Challenges

• Mission Profile Aware Design

• Case Study – Electromigration Aware IC Design

• Summary and Conclusion

Overview

Apr 19, 2023 37Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

• Consideration of robustness as design target is essential for automotive electronic designs

• Consistent consideration of mission profiles within the design chain is required (bi-directional flow)

• Current aware design is driven by mission profiles

• Mission profile aware design:– Vendor- and EDA tool-independent focus on design flow – Reduction of design uncertainty– Formalized and improved communication

Summary and Conclusion

Apr 19, 2023 Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego 38

Apr 19, 2023 39Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

Thank You!

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