CNM-IMB Presentation

NATIONAL MICROELECTRONICS CENTRE(CNM)

Microelectronics Institute of Barcelona(IMB)

CNM-IMB Presentation

CNM Organisation ChartSPANISH COUNCIL FOR

SCIENTIFIC RESEARCH (CSIC)Board of Trustees

NATIONAL MICROELECTRONICS

CENTER (CNM)D+T Microelectrónica, A.I.E.

MICROELECTRONICS INTITUTE OF

BARCELONA (IMB)

MICROELECTRONICS INSTITUTE OF MADRID (IMM)

MICROELECTRONICS INSTITUTE OF

SEVILLA (IMSE)

LARGE SCALE FACILITY

(Integrated Clean Room)

CNM-IMB Presentation

CNM-IMB Organisation Chart

Administration

General Services

Management

Departments

Micro-nanosystems

Systems Integration

Large Scale Facility

Integrated Clean Room

Technological Support Units

Maintenance

DirectionDirection

Vice-direction

Lab

s of

Dep

arta

men

ts

CNM-IMB Presentation

2005 Budget: 7.5 M€External Funding: 63 %

External Funding Splitting:

EU: 28%National: 49%Industry: 23%

CNM-IMB

STAFF (2006)

• Researchers 53• Students 44• Clean Room 32• Support Services 13• Management,

Administration & General Services 23

• Visitors 6________________________________

Total 171

CNM-IMB Presentation

2004-2006 External Funding

Incomming (k€) 2004 2005 2006Competitive Projects

• National• Regional• EU

Total Projects

1,050--

1,275

2,325

2,188120

1,308

3,616

3,226300640

4,166

Industrial Contracts 1,281 1,176 1,734

Total 3,606 4,792 5,900

CNM-IMB Presentation

Micro-nanosystems DepartmentSilicon-based Micro and Nanotechnologies (MNS)Micro and Nano-devices (MND)Application Specific Micro and Nanosystems Development (DAE)

Systems Integration DepartmentPower Devices and Systems Integration (IDSP)Microelectronic Circuits and Systems Design and Packaging (DECSM)Biomedical Technologies, Devices and Systems (TDSB)

Micro-Nanofabrication Facility (1,000m2 expanding to 1,500m2

Integrated Clean Room)Equipments, processes and technologies to deal with micro/nano-processes under an integrated approach

CNM-IMB Research Lines

CNM-IMB Presentation

Biochemical System Characterisation Laboratory

Impedance analyzer measurement equipment:Solartron 1260, impedance/gain-phase

Analyzer (10μHz to 32MHz).

Solartron 1294 Impedance interface (10 μHz to 1MHz),100 mohm

to 100 Gohm, IEC601 safety for bio-impedance test on live subjects.

Solartron 125594WBB LF-Frequency Response Analyzer

System (10μHz to 1Mhz).

Potentiostats measurement equipment:Solartron 12608W Electrochemical and impedance analyzer

System. (2A – 200nA)

Autolab PGstat10 A high voltage potentciostat/galvanostat ±1A,± 30V

μAutolab TYPE II ± 80mA ± 12V

PalmSens handheld potentiostat

CNM-IMB Presentation

Power Devices and Systems LaboratoryStatic characterization of components:

Source-measurement units (up to 1100V – 10A)QS and HF CV measurement equipment (-200V/200V)Semiautomatic wafer probers with hot chuck (300ºC)Curve tracers (3300 V – 400 A)

Dynamic characterization of components:Specific measurement circuits for:

Switching timesPower switching lossesShort-circuit characterizationGate driving characteristics

ESD and surge characterization equipments

Equipment for the design, development and characterization of power systems

Multichip power modules fabrication facilities (reflow oven…)

Probe cards fabrication equipment

CNM-IMB Presentation

Thermal Characterisation LaboratoryInfrared Thermography measurement equipment:

AGEMA Thermovision THV-900

Macroscopic lens 40º (Vision field: 73x46 mm)

Microscopic lens (Vision field: 2x1 mm)

Thermal conductivity measurement system

KTH measurement of materials involved in power packages

Internal Infrared Laser Deflection Technique (IIR-LD)

Measurement of power devices internal temperature

Measurement of free carrier concentration

Liquid Crystal Thermography system (ThermVIEW)

Surface temperature mapping using LCs

Liquid crystals from 30 to 160ºC

Spatial resolution up to 0.15 µm using ultra 20x zoom lens

CNM-IMB Presentation

Advanced Packaging Laboratory

Equipments:Manual flip-chip and SMD mounting equipment DR. TRESKY

Automatic flip-chip mounting equipment DATACON 2200PPS

Screen Printing equipment for solder alloys deposition and serigraphy of different paste

elements for chemical sensors

Hot plate PMC 732 SERIES (Tmax=400ºC)

Reflow furnace with vaccum capability ATV TECHNOLGIES Gmbh SRO702 (Tmax=450ºC)

Techniques:Flip-chip mounting for MCM fabrication (applications with sensors, MEMS, power

devices or low signal ICs)

Power Modules assembly

Deposition of solder paste and other materials by screen-printing

CNM-IMB Presentation

Integrated circuits and systems test laboratory

Low frequency characterization

Dynamic signal analyzer (up to 102KHz)

Network/Spectrum Analyzer (10Hz to 500MHz)

Multifunction synthesizer (0Hz to 600KHz, step 0.1Hz)

RF applications characterization

RF Spectrum Analyzer (9KHz to 2.9GHz)

Vector Network analyzer (300KHz to 8GHz)

Low Power Applications characterization

Low noise current pre-amplifier

Programmable current source (1nA to 100mA)

Electrical and behavioral characterization of (micro)electroniccircuits and systems. Spread range of applications: biomedical, sensors, RF communications, image capture and processing,…

CNM-IMB Presentation

Physical Characterization LaboratoryPhysical characterisation

Spreading Resistance measurement systemScanning Electron Microscope (SEM)Automatic polishing machine with multi-sample headAutomatic polishing machine with two heads suitable

for micro-sectionsPolishing machine for Spreading Resistance samples

preparationDiamond saw3 optical microscopes (with micro-measurement

equipment, dark field, and interferential constant)PhotomicroscopePlasma equipment for layer removalProbe system with submicron needles and Laser

cutting facility

Design + CAD

CadenceIC packageSystem package

MentorAnalog/Mixed signal simulationCustom IC designHigh capacity circuit simulationPhysical verificationPhysical optimizationStatic timing analysis

AlteraQuartus IINios IP

SynopsysSystem development toolsAnalogue simulation (Hspice)Front End and verification toolsTCAD device and process

simulation toolsAnsys Ansys MultiphysicsFlowmetrics FlowthermSilvaco

Suprem3 Athena

AtlasSmart Spice

CNM-IMB Presentation

Electronic Systems Integration ServicePrototypes production

Capability of fabrication PCBs multilayer (4 layers)

Through hole plating

SMD/TH Components assembly

Soldering Iron, De-soldering Tool, Pick and Place, Hot Air Rework

Electronic Systems Design Service

Development boards for embedded systems

ARM, NIOS, uBlaze

Up to 700.000 equivalent logic gates

CNM-IMB Presentation

The Large Scale Facility

CNM-IMB Presentation

Clean Room

• 1,000 m2

• House in house structure• Class 10-10,000

CNM-IMB Presentation

Clean Room Equipment

• Thermal processes and CVD equipment

• Ion Implantation equipment• Metallisation equipment• Lithographic equipment

(proximity and stepper)• Nano-lithography (electron

beam and nano-imprint)• Focused Ion Beam (FIB)

• Dry etching equipment• Wet etching and cleaning

equipment• In line test equipment • Atomic force microscope

CNM-IMB Presentation

Technological Processes• Wet and dry oxidations• Ion implantation of B, P, As, N and Ar• Diffusion (several ambients)• CVD (Nitride, Polysilicon, Oxide, BPSG)• Metallisation (Al-Si, Al-Cu, Al-Si-Cu, TaSi, Ti. Ni, Au, Pt)• Polyimide• Wet and dry etching• Surface and bulk silicon micromachining• Anodic bonding• Packaging (Die bonding, Wire bonding, SMD, MCM-D)• In line test (Ellipsometer, Optical interferometer, Profilemeter, Four-

needle probe)• Lithography (Proximity, Step and repeat, Double side)• Nanolithography (AFM, EB, nano-imprint, FIB)

CNM-IMB Presentation

Nanofabrication Laboratory

Provide access to state-of-the art techniques for nanometer-scale fabrication and inspection

• Clean (class 100) Laboratory• e-beam Nanolithography System (Leo 1530 + Raith Elphy plus)

• Atomic Force Microsope(Nanoscope IV + Dimension 3100)

• Nanoimprint lithography (Obducat 4’’ NIL)

• Focused Ion Beam (ZEISS 1560XB (available since July 2006)

All individual nanofabrication process steps are compatible with the CNM Clean Room Technologies

CNM-IMB Presentation

TECHNOLOGY TYPE CHARACTERISTICS APPLICATION

CNM - CMOS CMOS 2 Poly - 2 Metals Analog / Digital

CNM POWER Lateral and vertical DMOS Double Diffusion Power Devices

SiCPower Diodes, JFETs, MOSFETs, MESFETs. High Temperature Sensors

Planar and MESA Technology(2.0 µm)

Power, High Temperature and Biomedical Devices

CNM μSiSTEMS Si Sensors and Actuators Bulk and Surface micro-machining Microsystems

CNM μSiSTEMS Pressure Sensors Piezo-resistive Low Pressure Measurements

CNM - ISFET NMOS Floating Gate FETs Chemical Transducers

MCM Si Substrates Active Substrates and flip-chip Multi-chip Modules

CNM - TOI Si Integrated Optics Technology Dielectrics and Polymers Integrated Optical Components

NANO-FABRICATION Si Nano-mechanical Structures

Surface Nano-machining. Minimum feature size: 100nm

Nano-mechanical and Nano-electro-mechanical Systems

Technologies

CNM-IMB Presentation

Technological Support

Electrical Characterisation

• Device Characterisation and parameter extraction (SPICE)

• Equipment maintenance and set up• Production wafer parametric test• Test structure design and

characterisation• New measurement techniques

development• Application specific system design

and development (demonstrators)• On-wafer electrical characterisation

CNM-IMB Presentation

Design and CAD

• VHDL/Verilog to ASIC/FPGA: Modelling, simulation and synthesis of circuits, IPs and growing to systems on chip

• Support and training to users, purchases and general management of CAD

• CAD development for internal use• Libraries and design kits development for internal

and external technologies• Management of external kits• Back-end: P&R, delay extraction / backannotation

and post layout functional and fault simulation

Technological Support

CNM-IMB Presentation

Facilities Expansion

New Integrated Clean Room (MicroNew Integrated Clean Room (Micro--Nano) 1,400 mNano) 1,400 m22

(End 2007)(End 2007)

Labs and Offices Building(1,400 m2)

Clean Room Expansion