product description of zxmp s385_v2_40

ZXMP S385(V2.40)

SDH-Based Multi-Service Node Equipment

Product Description

ZXMP S385 Product Description

ZTE Confidential Proprietary I

ZXMP S385 Product Description About the Document

Version Date Author Approved By Remarks

R1.0 12/19/2007 Not open to the Third Party

R1.1 01/15/2007 Not open to the Third Party

R1.2 12/2007 Not open to the Third Party

R1.3 05/2008 Not open to the Third Party

Copyright 2008 ZTE Corporation Shenzhen P. R. China ZTE CONFIDENTIAL: This document contains proprietary information of ZTE Corporation

and is not to be disclosed or used except in accordance with applicable agreements.

Due to update and improvement of ZTE products and technologies, information of the document is subjected to change without notice.


ZTE Confidential Proprietary II

Target Readers

This document is intended for any one who needs a general command of the features, applications, structure and technical specifications of ZXMP S385(V2.40).

Structure of This Specification

This specification describes the system functions, hardware structure and configuration, network application and technical indices of ZXMP S385.

Chapter 1 System Functions

This chapter introduces typical functions and features of ZXMP S385, including cross-connect, service access, protection functions, system control & communication, etc.

Chapter 2 System Mechanical Structure

This chapter introduces system hardware mechanical structure and the adaptable cabinet installation of ZXMP S385.

Chapter 3 Boards And Slots

This chapter introduces the slots and boards of ZXMP S385, including names (code), applying rule and unit power consumption, etc.

Chapter 4 Application Of MSTP

This part presents basic networking characteristics and applications of MSTP service.

Chapter 5 Networking And Protection

This chapter presents protection modes (including equipment level and network level) and characteristics of ZXMP S385.

Chapter 6 Performances And Indexes

This chapter details the technical parameters, physical and networking performance of the ZXMP S385.

Chapter 7 Environment Adaptability

This chapter lists the environmental indices which ZXMP S385 can operate normally for a long term.

Appendix

This chapter lists international standards to which S385 conforms and the reference abbreviations terms used in this specification.


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Table of Contents

1 System Function.................................................................................................................6 1.1 System overview........................................................................................................6 1.2 Cross-connection and extension capabilities ...............................................................6 1.3 Powerful Service Access Ability ................................................................................6

1.3.1 Optical Interfaces .............................................................................................7 1.3.2 Electrical Interfaces..........................................................................................7 1.3.3 Data Interfaces .................................................................................................7

1.4 Integrated WDM Function .........................................................................................8 1.5 Complete Equipment Protection Ability .....................................................................8 1.6 Perfect Network Protection Ability.............................................................................9 1.7 Reliable Timing Synchronization Processing..............................................................9 1.8 System control and communication .......................................................................... 10 1.9 Overhead Processing................................................................................................ 10 1.10 Easy For Maintenance And Upgrade ........................................................................ 11 1.11 Alarm input/output................................................................................................... 11 1.12 System power supply ............................................................................................... 12 1.13 Perfect EMC and Operation Safety........................................................................... 12

2 System Mechanical Structure.......................................................................................... 13 2.1 Appearance of equipment......................................................................................... 13 2.2 Cabinet structure ...................................................................................................... 13 2.3 Sub-rack structure .................................................................................................... 14 2.4 Dimensions and weights of components ................................................................... 15

3 Boards And Slots.............................................................................................................. 16 3.1 Introduction to the boards......................................................................................... 16 3.2 Slots......................................................................................................................... 17 3.3 Connector-type for All kinds of Service Interface..................................................... 19

4 Application of MSTP ....................................................................................................... 21 4.1 Application of Ethernet Service................................................................................ 21

4.1.1 EPL: Ethernet Private Line............................................................................. 21 4.1.2 EVPL (Ethernet Virtual Private Line) ............................................................. 21 4.1.3 EPLAN (Etherrnet Private LAN).................................................................... 22 4.1.4 EVPLAN (Ethernet Virtual Private LAN)....................................................... 23

4.2 Application of ATM Service .................................................................................... 23

5 Networking And Protection............................................................................................. 24 5.1 Application of Basic Service .................................................................................... 24 5.2 Hardware-level Protection........................................................................................ 24

5.2.1 Power supply protection ................................................................................. 24 5.2.2 Double bus design .......................................................................................... 25 5.2.3 Cross-Connect Protection and Clock Protection.............................................. 25 5.2.4 Tributary Card 1:N Protection ........................................................................ 25 5.2.5 Automatic Laser Shutdown(ALS) function ..................................................... 25


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5.3 Network-level protection.......................................................................................... 26 5.4 Protection switch time.............................................................................................. 26

6 Performances And Indexes .............................................................................................. 27 6.1 STM-N optical interfaces performance..................................................................... 27 6.2 PDH interfaces performance and indexes ................................................................. 28 6.3 Performance of data boards ...................................................................................... 29

6.3.1 Performance of SEC24/48............................................................................ 29 6.3.2 Performance of SEE....................................................................................... 31 6.3.3 Performance of TGE2B.................................................................................. 32 6.3.4 Performance of RSEB .................................................................................... 33 6.3.5 Performance of MSE...................................................................................... 34 6.3.6 Performance of AP18................................................................................... 35 6.3.7 Performance of TGSA8................................................................................ 35

6.4 Physical Performance of Ethernet............................................................................. 36 6.4.1 Ethernet interface types and followed standard ............................................... 36 6.4.2 GE interface types and followed standard ....................................................... 37

6.5 Performance of OAD ............................................................................................... 39 6.6 Performance of OBA................................................................................................ 40 6.7 Performance of OPA................................................................................................ 41 6.8 Performance of DCM............................................................................................... 41 6.9 Error Performance.................................................................................................... 42 6.10 Jitter index at interfaces............................................................................................ 42

6.10.1 Jitter and wander tolerance of PDH input interface ......................................... 42 6.10.2 Jitter and wander tolerance of SDH input interface ......................................... 43 6.10.3 Inherent output jitter of STM-N interface ....................................................... 45 6.10.4 Mapping jitter of PDH tributary...................................................................... 45 6.10.5 Combined Jitter .............................................................................................. 45 6.10.6 Jitter transfer function of the regeneration relay .............................................. 46

6.11 Clock timing and synchronous characteristics........................................................... 46

7 Environment Adaptability ............................................................................................... 49 7.1 Power supply requirements ...................................................................................... 49 7.2 Grounding requirements........................................................................................... 49 7.3 Environment requirements ....................................................................................... 49

7.3.1 Operation Environment .................................................................................. 49 7.3.2 Environment for Storage ................................................................................ 51 7.3.3 Cleanness requirements .................................................................................. 51 7.3.4 Bearing Requirements of the Equipment Room .............................................. 51 7.3.5 Electronic Static Discharge (ESD).................................................................. 52

7.4 Safety requirements.................................................................................................. 54

8 Appendix .......................................................................................................................... 56 8.1 Followed standards .................................................................................................. 56

8.1.1 International standards of ITU ........................................................................ 56 8.1.2 Corporate standards and other standards ......................................................... 59

8.2 Abbreviations........................................................................................................... 60


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Figures and Tables

Figures Figure 1 Appearance of S385 Sub-rack...................................................... 13 Figure 2 Structure and Configurations of Cabinet ...................................... 14 Figure 3 The shelf plug-in board................................................................ 15 Figure 4 Board slot layout of main subrack................................................ 18 Figure 5 Board slot layout of expansion subrack........................................ 19 Figure 6 EPL............................................................................................. 21 Figure 7 EVPL .......................................................................................... 21 Figure 8 EPLAN ....................................................................................... 22 Figure 9 EPLAN ....................................................................................... 22 Figure 10 EVPLAN..................................................................................... 23 Figure 11 ATM VP-RING........................................................................... 23 Figure 12 Basic Physical Topologies for ZSMP S385.................................. 24 Figure 13 The ALS principle ....................................................................... 26 Figure 14 The jitter and wander tolerance at E1 PDH input interface ........... 42 Figure 15 The jitter and wander tolerance at T1 PDH input interface ........... 43 Figure 16 The jitter tolerance of STM-N terminal multiplexer input interface44 Figure 17 The input jitter tolerance of STM-N SDH regenerator .................. 44 Figure 18 The jitter transfer characteristics of a regeneration relay............... 46

Tables Table 1 Optical Interfaces Provided by ZXMP S385.................................... 7 Table 2 Electrical Interfaces Provided by ZXMP S385 ................................ 7 Table 3 Ethernet services Provided by ZXMP S385..................................... 8 Table 4 Equipment level protection provided by ZXMP S385...................... 8 Table 5 Overhead-Byte Usage List ............................................................ 10 Table 6 Configuration of ZXMP S385 ....................................................... 13 Table 7 Dimensions and Weight of Structural Parts ................................... 15 Table 8 Boards/unit list (with power consumption) .................................... 16 Table 9 Connector-type of interface........................................................... 19 Table 10 SDH system protection switch time............................................... 26 Table 11 Performance of the STM-1 optical interface .................................. 27 Table 12 Performance of the STM-4 optical interface .................................. 27 Table 13 Performance of the STM-16 optical interface ................................ 27 Table 14 Performance of the STM-64 optical interface of ZXMP S385........ 28 Table 15 Performance of the PDH electrical interface.................................. 28 Table 16 Input port permitted attenuation, frequency deviation and output port signal bit rate tolerance .................................................................................. 28 Table 17 Requirements for the input/output port reflection attenuation ........ 29 Table 18 SEC48 and SEC24 Performance ............................................... 29 Table 19 Performance of TGE2B of ZXMP S385 ........................................ 32 Table 20 Ethernet interface index ................................................................ 36 Table 21 Transmission index of FE MMF optical interface.......................... 36


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Table 22 Receiver index of FE MMF optical interface................................. 36 Table 23 index of FE short distance SMF optical interface........................... 36 Table 24 receiver index of FE short distance optical interface...................... 37 Table 25 Transmission index of FE long distance SMF optical nterface ....... 37 Table 26 Receiver index of FE long distance optical interface ..................... 37 Table 27 GE interface index ........................................................................ 37 Table 28 Transmission index of GE MMF optical interface ......................... 38 Table 29 Receiver index of GE MMF optical interface ................................ 38 Table 30 Transmission index of GE short distance SMF optical interface..... 38 Table 31 Receiver index of GE short distance optical interface .................... 38 Table 32 Transmission index of FE long distance SMF optical interface...... 39 Table 33 Receiver index of GE long distance optical interface..................... 39 Table 34 Performance of OADD ................................................................. 39 Table 35 Performance of OADC.................................................................. 40 Table 36 Performance of OBA Module........................................................ 40 Table 37 Performance of OPA Module ........................................................ 41 Table 38 Performance of the DCM .............................................................. 41 Table 39 SDH system error performance ..................................................... 42 Table 40 The input jitter and wander tolerance of PDH interface ................. 43 Table 41 The output jitter and wander tolerance of the PDH interface.......... 43 Table 42 Input jitter and wander tolerance (UIP-P) of SDH ......................... 44 Table 43 Input jitter and wander tolerance of the SDH................................. 44 Table 44 Input jitter tolerances of STM-N regenerators ............................... 44 Table 45 STM-N interface inherent output jitter indexes of SDH ................. 45 Table 46 STM-N network interface output jitter indexes of SDH ................. 45 Table 47 Mapping jitter specifications ......................................................... 45 Table 48 Combined jitter ............................................................................. 45 Table 49 Jitter transmission parameters of a regeneration relay.................... 46 Table 50 The SEC/SEE Index list ................................................................ 46 Table 51 The wander limit value under constant temperature (MTIE).......... 47 Table 52 The wander limit value under temperature impact (MTIE) ............ 47 Table 53 The wander limit value under constant temperature (TDEV) ......... 47 Table 54 Climate requirement ..................................................................... 49 Table 55 Density requirements for chemical active substances..................... 50 Table 56 Density requirements for mechanical active substances ................. 50 Table 57 Requirements for mechanical stress............................................... 50 Table 58 Climate requirement ..................................................................... 51 Table 59 Requirements for mechanical stress............................................... 51 Table 60 Static discharge anti-interference................................................... 52 Table 61 RF electromagnetic radiated susceptibility .................................... 52 Table 62 Electrical fast transient burst susceptibility at the DC power port... 52 Table 63 Electrical fast transient burst susceptibilities at the signal cable and control cable ports.......................................................................................... 52 Table 64 Surge susceptibility of DC power .................................................. 53 Table 65 Surge susceptibility of the outdoor signal cable ............................. 53 Table 66 Surge susceptibility of the indoor signal cable ............................... 53 Table 67 Conductivity susceptibility of RF field .......................................... 53


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Table 68 Conductive emission electromagnetic interference at the direct current port ................................................................................................................ 53 Table 69 Radioactive emission electromagnetic interference........................ 53


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1 SYSTEM FUNCTION 1.1 System overview

ZXMP S385 is an intelligent optical transmission platform newly released by ZTE. ZXMP S385 targets the backbone or large capacity convergent layer of network which can satisfy present and future network requirements. It is an ideal transmission system in constructing broadband transmission networks. ZXMP S385 provides rich service access functions and complete protection mechanism, facilitating its wide applications. ZXMP S385 adopts modular design, incorporating SDH, Ethernet, ATM, PDH and other technologies. It can transmit voice and data services efficiently on the same platform. The equipment has five versions, V1.10, V2.00, V2.10, V2.20 and V2.40. V1.10 is 2.5G MSTP equipment and V2.00/V2.10/V2.20/V2.40 is 10G/2.5G MSTP equipment. V1.10 can be smoothly upgraded to V2.00/V2.10/V2.20/V2.40. This document is based on ZXMP S385 V2.40.

1.2 Cross-connection and extension capabilities Cross Clock board (CSF/CSE/CSA) of ZXMP S385 provides the cross-connect function and fulfill the straight-through, broadcast, add/drop, loop back and cross-connection (VC-4/VC-12 level) of services without blocking. CSF board implements high-order and low-order cross-switching functions. CSF has a space-division switching capacity of 1536 1536 VC4. In which, 256256 VC4s are assigned to the time-division cross-connect service unit, the others are allocated to the space-division cross-connect unit of the system. CSE board implements high-order and low-order cross-switching functions. CSE has a space-division switching capacity of 1152 1152 VC4. In which, 256256 VC4s are assigned to the time-division cross-connect service unit, the others are allocated to the space-division cross-connect unit of the system. CSA board implements high-order and low-order cross-switching functions. CSA has a space-division switching capacity of 256 256 VC4. In which, 3232 VC4s are assigned to the time-division cross-connect service unit, the others are allocated to the space-division cross-connect unit of the system. The equipment can supports maximum 14 service slots and access a large amount of PDH, SDH and data services. It can process 176-path ECC, and support the network topologies as linear, ring, hinge, ring with chain, tangent ring and cross ring of STM-N levels meeting the complex networking requirements thoroughly.

1.3 Powerful Service Access Ability ZXMP S385 adopts modular structure, with its hardware including cross-connect card, clock card, control card, service card and service interface card. The service access capacity is shown in following table.



A single sub-rack of ZXMP S385 has 14 slots for service boards and 10 slots for interface boards. All slots could create protection. The equipment can access a large amount of PDH, SDH and data services at one time.

1.3.1 Optical Interfaces ZXMP S385 provides five types of optical interfaces: OTU2, STM-64, STM-16, STM-4 and STM-1, as shown in Table 1.

Table 1 Optical Interfaces Provided by ZXMP S385

Board Type Rate (Mbit/s) Board Integration (channel/board) Maximum Access Quantity

OTU2 10709.225 1 14

STM-64 9953.280 1 14

STM-16 2488.320 1/4 56

STM-4 622.080 1/2/4 56

STM-1 155.520 2/4/8/16 192

ZXMP S385 also provides STM-64/STM-16 colored interfaces comply with ITU-T G.692 and ITU-T G.695, which can be connected to DWDM/CWDM directly without the OTU board. ZXMP S385 has the one-interface OTU2 optical line board to support AFEC or G.709 standard FEC function. By increasing the line rate, the board can correct the bit errors in the line transmission. It may increase the receiving sensitivity by about 2dB or the OSNR tolerance by 5-7dB, and work with OBA+OPA and Dispersion Compensation Module (DCM) to implement the LH transmission without electrical regeneration. ZXMP S385 also provides OTU2/STM-64/STM-16 DWDM wavelength interface with ITU-T standard 50GHz grid in C-band.

1.3.2 Electrical Interfaces ZXMP S385 provides STM-1 electrical interface and PDH electrical interfaces, as listed in Table 2.

Table 2 Electrical Interfaces Provided by ZXMP S385

Board Type Rate (Mbit/s) Board Integration (channel/board) Maximum Access Quantity

STM-1 155.520 4/8/16 160

E3 34.368 6 60 T3 44.736 6 60

E1 2.048 63 630

T1 1.544 63 630

1.3.3 Data Interfaces There are several data boards in ZXMP S385 V2.40SEC/SEE, TGE2B, RSEB, MSE, AP18, TGSA8 and SEG. SEC24 and SEC48 board provide 810M/100M+GE Ethernet services which support L2 switching function and VC-12 virtual cascading function. SEE board provides 810M/100M and 2GE interfaces, and it supports Ethernet OAM function and port-level protection. TGE2B board provides 2GE adaptive Ethernet services.



RSEB board provides 810M/100M+2GE interfaces which employs the bandwidth of SDH/MSTP ring network to provide the dual-ring topology and implement the ring interconnection of RPR nodes. MSE board implements 810M/100M+2GE Ethernet service accessing, L2 data forwarding, MPLS message processing. It provides virtual bridge function of L2 network and quality guarantee for end-to-end service. FE Ethernet interfaces of each Ethernet board above can be optical or electrical. It provides FE optical interface via ESFE8 and optical interface via OIS18 respectively. 10M/100M optical or electrical interfaces are available via replacing interface board. AP18 board is mainly used to converge or aggregate ATM service to SDH transmission network. It provides 8155 Mbit/s optical interfaces at the ATM side and 1622 Mbit/s non-concatenation data flow at the system side. TGSA8 board supports 8 user interfaces which adopt SFP optical module. The first 4 user interfaces may respectively offer GE or SAN service. SAN service includes 1G Fiber Channel and 1G FICON services. The other 4 user interfaces may offer 4GE services. SEG board supports 1x10GE interface.

Table 3 Ethernet services Provided by ZXMP S385

Board Name Interface Type Board Integration (channel/board) Maximum Access Capacity

SEC24/48 810M/100 M +GE 8FE+1GE 80FE+14GE

SEE 810M/100 M +2GE 8FE+2GE 80FE+28GE

TGE2B 2GE 2GE 28GE

RSEB 810M/100 M +2GE 8FE+2GE 64FE+16GE

MSE 810M/100 M +2GE 8FE+2GE 64FE+16GE

AP18 8155 Mbit/s 14 112

TGSA8 (4SAN+4GE) or 8GE (4+4) or 8 (56+56) or 112

SEG 1x10GE 1x10GE 14

1.4 Integrated WDM Function ZXMP S385 has OAD (Optical Add/Drop) board to add/drop or multiplex/demultiplex 4 fixed-wavelengths of optical signals. OAD board consists of two types in all: OADD is for DWDM signals and OADC is for CWDM signals. ZXMP S385 optical line board has DWDM or CWDM optical interfaces, and OAD board can add/drop DWDM or CWDM optical signals. Both of them work together to actualize OAD interface function. ZXMP S385 single sub-rack supports at most 112 channels of DWDM OAD interfaces or 112 channels of CWDM OAD interfaces.

1.5 Complete Equipment Protection Ability Table 4 shows the equipment level protection of ZXMP S385.

Table 4 Equipment level protection provided by ZXMP S385 Items protected Protection scheme E1/T1 processing board 1:N (N9) tributary protection switching (TPS)



E3/T3 processing board 1:N (N4) TPS

STM-1 processing board(except OEL116 board) 1:N (N4) TPS

FE board 1:N (N4) TPS

CSF/CSE/CSA(Cross-switch and Synchronous-clock board) 1+1 hot backup

NCP/ENCP board 1+1 hot backup

SMI board 1+1 hot backup

48 V power interface board 1+1 hot backup

ZXMP S385 supports the co-existence of several different TPS protection. ZXMP S385 adopts a dual-bus hierarchical design for service bus, overhead bus and clock bus, which improves system reliability and stability.

1.6 Perfect Network Protection Ability In terms of the network level protection, ZXMP S385 supports multiplex section protection (MSP) ring, linear MSP, unidirectional path switched ring (UPSR), subnet connection protection (SNCP) and logical subnet protection (LSNP), etc. ZXMP S385 can implement all networking features recommended by ITU-T. It supports the route reconstruction of Ethernet and IP, and meets IEEE802.3E.

1.7 Reliable Timing Synchronization Processing The clock timing/synchronization unit is composed of Cross Clock board (CSF/CSE/CSA) and SCI board. The unit completes system timing and network synchronization. It implements the following functions: 1. Providing system clock signals and system frame header signals for all the

units of the SDH equipment. 2. Providing overhead bus clock and frame header 3. Providing the corresponding interface for upper-level controller to

configure and monitor the clock unit. SCI board of ZXMP S385 provides 4 external reference clock output and 4 external reference clock input. The interface type is 2Mbit/s or 2MHz. SCI can be configured with four external 2.048M clock input references and 28 lines (or tributary) 8K timing input references. Synchronization can select external clocks, line clocks or E1/T1 tributary clocks. The protection switching of clock reference sources bases on the alarm information and clock synchronization status message (SSM) algorithm-based automatic switching. ZXMP S385 provides E1 tributary re-timing function. It supports synchronous priority switching based on the SSM algorithm, optimizes synchronous timing distribution of the network, prevents the occurrence of timing loops and keeps network synchronization the optimal status. ZXMP S385 supports synchronization receiving from following clock sources: 1. STM-N tributary signal 2. Besides dedicate signal of 2048kHz, receive from BITS or from other

SDH network elements. 3. Internal oscillator is controlled by crystal



A software-controlled or a hardware phase lock circuit is used to implement four working modes: a. Fast pull-in; b. Locked; c. Holdover; d. Free run.

1.8 System control and communication 1. The Net Control Processor (NCP) and Enhanced Net Control Processor

(ENCP) implement the system control and communication function, which includes sending the configuration commands to all MCUs via S interface and collecting their performance and alarm information.

2. NM information intercommunicates between NEs via the ECC channel. 3. The order-wire board (OW) performs the order-wire function. It actualizes

the intercommunication of order-wire phones between NEs via E1 and E2 bytes. It employs an independent CPU for order-wire and communicating with NCP processor via S interface.

4. The Qx interface board is the communication interface between NE and subnet management control center (SMCC). With Qx interface, NCP can report to SMCC the alarm and performance information of the NE and subnet and receive the commands and configurations sent from SMCC to the NE and subnet. The f interface is the LMT access interface of local NM, which is for the access management of portable PC.

5. The reset and ring trip are on the rack. Other interfaces are on QXI and SCI boards.

6. The NCP/ENCP boards monitor the fan plug-box of the NE. The power distribution unit performs the over/under voltage monitoring of input voltage.

7. The alarm I/O: the NCP/ENCP boards offers 8-path external alarm switch quantity interfaces, collects the alarm signal of NE and transmits it to the alarm box and the first-cabinet-in-a-row.

8. It offers 2-path switch quantity (UC) interface and may output 2-path switch quantity for user.

1.9 Overhead Processing The overhead process of ZXMP S385 is performed by NCP/ENCP board, OW board, CSF/CSE/CSA board, optical line boards and ATM board. ZXMP S385 supports overhead transparent transmission, i.e. low rate service signal and overhead can transfer transparently in STM-16 frame. It greatly improves the network construction flexibility, abates the tension of insufficient optical fiber resources, and ensures the NM integrity and the NM information continuity.

Table 5 Overhead-Byte Usage List

Overhead type

Overhead name ZXMP S385 application

A1, A2 Frame position indication for regeneration section, A1:11110110,A2:00101000 J0 S385 may identify, set and transparent transmit J0 byte Z0 Not applied

D1~D12 S385 may set DCC of D1D3 or D1D12, and support the transparent transmission of D1D12

RSOH/MSOH

E1, E2 S385 supports E1, E2 order wire telephone, as well as E1,E2 transparent transmission.



F1 S385 provides F1 64kbps co-directional data interface, and the transparent transmission of F1 byte

B1 Used for the error code monitor of regeneration section

B2 Used for the error code monitor of MS

K1, K2 Used for the auto-protection switchover (APS) command of MS

S1 b5~b8 used for synchronous status message

M1 Used for MS far-end difference indication

AU pointer AU PTR The rate adjustment on AU level

J1 Used for high-order path trace, able to be set

B3 Used for path error code monitoring

C2 Used for expressing the composition or maintenance status of VC-3/VC-4/VC-4X, able to read and write

G1 Used for returning the status and performance of path terminal to the path origin of VC3/VC4/VC4XC F2, F3 Not applying

H4

Affording the general position indication to payload, as well as the special payload Position (i.e. H4 may be the multi-frame position indication of VC12 and VC2); and performing VC3/VC4 virtual concatenation

K3 Not applied

N1 Not applied

V5 Providing the functions of error code test, signal mark and channel status for VC1/VC2 J2 VC1, VC2 path trace byte, able to be set

N2 Not supported

POH

K4 Used for the virtual concatenation process of low-order path

1.10 Easy For Maintenance And Upgrade With the following functions, the system becomes more reliable, featuring good maintainability and easy scalability: 1. It supports optical power monitoring functions. 2. It supports online loading and remote upgrading of card software

(including FPGA logic). 3. It provides the daily maintenance function. In case of a fault, it can quickly

locate the fault to the card level. 4. All cards provide the temperature monitoring function. 5. Pluggable optical module (SFP module, LC connector). 6. The actions of plugging in or removing plug-in modules while equipment

is powered and operating wont cause any danger or problem to any part of the system.

7. The rate of SFP module could be changed by NMS.

1.11 Alarm input/output NCP provides 8 external alarm Boolean value input interfaces and 4 external alarm out put interfaces.



NCP collects alarm indication signals from NEs and sends them to the alarm box and the first cabinet of the line. The system provides two user alarm output interfaces and level alarms. It shares a DB9 interface with F1 interface at the backplane side.

1.12 System power supply ZXMP S385 equipment employs the dual-power system to access the -48V power in the equipment room and distributes the -48V DC power in the power distribution box. It adopts separate power supply mode. No power boards in the sub-rack, the -48V power directly powers each board via the MB board through a DC/AC conversion module. Two lines of independent external -48V DC power supply, -48VGND and the system protection GND are led from the connectors on the distribution frame and then connected to the sub-rack power distribution board. The power distribution (PD) board provides the equipment with the following functions such as -48V power switch, distribution, isolation, EMI filtering, protection against lightening and surge, fan power supply and control

1.13 Perfect EMC and Operation Safety EMC, operation safety and fire/explosion protection of the equipment are fully considered in the circuit board design.



2 SYSTEM MECHANICAL STRUCTURE 2.1 Appearance of equipment

A standard "ETSI cabinet + sub-rack" structure is used for ZXMP S385. Both the cabinet and sub-rack unit are designed in the principle of front-facing installation and maintenance to save equipment space and allow for back-to-back installation, front-facing operations and maintenance.

Figure 1 Appearance of S385 Sub-rack

2.2 Cabinet structure The basic units of equipment includes cabinet, sub-rack and power distribution box. ZXMP S385 uses the uniform transmission cabinet. A 2.2m or 2.6m cabinet can accommodate one sub-rack. Rack supports back to back mode. The cabinet structure and configuration are shown in Table 6.

Table 6 Configuration of ZXMP S385 Cabinet Height Power Distribution Box Sub-rack 2.2 m (Valid height 47U) 3U 43U+1U(wind-guide self)

2.6 m (Valid height 56U) 3U 43U+1U(wind-guide self)



1. Cabinet; 2. Power distribution shelf; 3. Cabling area;

4. Sub-rack; 5. Dust-proof shelf; 6. Alarm indicators; 7. Front door

Figure 2 Structure and Configurations of Cabinet

2.3 Sub-rack structure ZXMP S385 sub-rack includes board, fan plug-in box and dustproof unit. Structure of sub-rack is shown in Figure 3. ZXMP S385 sub-rack consists of two parts, main subrack and expansion subrack, with similar board slot layout. The plug-in board area of main subrack or expansion subrack, each subrack is separated into 2 layers, where, the top layer is for interface boards with 10 slots and the low layer is for service boards with 14 slots.



Figure 3 The shelf plug-in board

2.4 Dimensions and weights of components The dimensions and weight of the structural parts are shown in Table 7.

Table 7 Dimensions and Weight of Structural Parts Structural Part Dimensions(mm) Weight (kg)

2,000 (H) 600 (W) 300/600 (D) 47/85

2,200 (H) 600 (W) 300/600 (D) 50/90 Cabinet

2,600 (H) 600 (W) 300/600 (D) 55/100

Sub-rack 1874.8 (H) 482.6 (W) 270 (D) 63

Power distribution box 132.5 (H) 482.6 (W) 269.5 (D) 5

Fan shelf 43.6 (H) 436 (W) 245 (D) --

Dust-proof shelf 43.6 (H) 482.6 (W) 250 (D) 2

Ventilation unit 43.6 (H) 482.6 (W) 250 (D) 3

Upper cabling area 133 (H) 482.6 (W) 250 (D) --

Service interface board 277.8 160 2 (H W D) --

Service board PCB320 (H)210 (W)2(D) panel345.6 (H)5HP(W)

--

Note: 1. The cabinet weight refers to the weight of an empty cabinet. 2. the depth of CS, NCP/ENCP, OW, the interface boards in the upper-layer interface area and the function boards in the lower-layer interface area service board refers to the thickness of PCB. 3. 1HP=5.08mm.



3 BOARDS AND SLOTS 3.1 Introduction to the boards

The board names (code), applying rule and unit power consumption of ZXMP S385 is shown in Table 8. The maximum input current of shelf is 32A.

Table 8 Boards/unit list (with power consumption)

Board Board name and configuring explanation

Power consumption(W)

NCP Net Control Processor, 1 for standard configuration, 2 able to practice 1+1 protection 6

ENCP Enhanced Net Control Processor, 1 for standard configuration, 2 able to practice 1+1 protection 10

LKNCP Link board for Net Control Processor 0 SMI Service and management interface 25 OW Order-wire 15 QxI Qx interface 1 for standard configuration 2

CSA Cross-switch and Synchronous-clock (256x256 VC4 high order with 32x32 VC4 low order) 49.5

CSE Cross-switch and Synchronous-clock (1152x1152 VC4 high order) 36

CSF Cross-switch and Synchronous-clock (1536x1536 VC4 high order) 40 (without TCS)

TCS64 Cross-switch with low-order 15 TCS128 Cross-switch with low-order 26.3 TCS256 Cross-switch with low-order 45.5 SCIB B-type clock interface board (2Mbit/s) 2 SCIH H-type clock interface board (2MHz) 2

OL64FEC Optical Line of OTU2, with L-64.2cIf, L-64.2c IIf or L-64.2pf. Supports FEC function 35

OL64 Optical Line of STM-64, with S-64.2b, L-64.2cI, L-64.2cII, P1L1-2D2 or L-64.2p. 30

OL16 Optical Line of STM-16, with S-16.1, L-16.2, L-16.2JE, L-16.2U or L-16.2P 25

OL164 Optical Line of STM-164, with S-16.1, L-16.2 or L-16.2U 30

OL42 Optical Line of STM-42 15

OL44 Optical Line of STM-44 13 OL14 Optical Line of STM-14 15 OL18 Optical Line of STM-18 18 OEL116 Optical Line/Electrical Line Process of STM-116 20

LP14 Line Process of STM-14, used together with electric interface switchover board or bridge board 6.5

LP18 Line Process of STM-18, used together with electric interface switchover board or bridge board 6.5

ESS14 Electrical Interface of STM-14 12

ESS18 Electrical Interface of STM-18 12

EP36 Electrical Process of E3/T36 23 ESE36 Electrical Interface Switching of E3/T36 3.2



BIE3 Bridge Interface of STM-1e/E3/T3/FE,used for the interface slot corresponding to protection board 9.5

EPE163(75) Electrical Process of E163 (75) 15

EIE163(75) Electrical Interface of E163 (75) 0.5

ESE163(75) Electrical Interface Switching of E163 (75) Before switchover 0.5, after switchover 16 EPE163(120) Electrical Process of E163 (120) 15 EPT163(100) Electrical Process of T163 (100) 15

EIT163 Electrical Interface of T163 (100) or E163 (120) 0.5

EST163 Electrical Interface Switching of T163 (100) or E163 (120) Before switchover 0.5, after switchover 16

BIE1 Bridge Interface of E1/T1 0.5

SEC48 Enhanced Intelligent Ethernet Processing Board(48:1) customer side 8FE(optical or electrical)+GE

38

SEC24 Enhanced Intelligent Ethernet Processing Board(24:1) customer side 8FE(optical or electrical)+GE

25

SEE Enhanced Intelligent Ethernet Processing Board, customer side 8FE(optical or electrical)+ 2GE 28

RSEB Embedded RPR Ethernet Processing Board, customer side 8FE(optical or electrical)+2GE 35

MSE Embedded MPLS Ethernet Processing Board, customer side 8FE(optical or electrical)+2GE 45

AP18 8155Mbit/s optical board at the ATM side and 1622Mbit/s non-concatenation data flow at the system side.

26

TGE2B GE transparent process board 25

TGSA8 SAN service processing board, customer side 4SAN+4GE or 8GE 37

SEG 10GE process board 30

OIS18 Optical interface board cooperating with Ethernet board 7

OEIS1x8 Optical/Electric interface of 8STM-1 3

ESFE8 Ethernet electric board cooperating with Ethernet board 2.5

OADD Optical add/drop unit board for 4 channels of fixed wavelength DWDM optical signals. 6

OADC Optical add/drop unit board for 4 channels of fixed wavelength CWDM optical signals. 6

FAN Fan board 4.2

OBA12 Optical Booster Amplifier board(12dBm) built-in 25

OBA14 Optical Booster Amplifier board(14dBm), built-in 25



OPA32 Optical Pre-Amplifier(-32dBm), built-in 25

OPA38 Optical Pre-Amplifier(-38dBm), built-in 25

3.2 Slots The board slot layout of main subrack is shown in Figure 4. The following matters should be noted:



1. The optical boards in the service slots

(OL64FEC/OL64/OL16/OL4/OL1/GE/10GE) can be interchanged. 2. The electrical interface boards (such as EPE1/EPT1/EP3/LP1) can only be

inserted in ten slots (slots 1 ~ 5 and 12 ~ 16). OEL1x16 can be inserted in slots 1 ~ 7 and 10 ~ 16.

3. The correspondence between the electrical interface boards and the cabling boards is as follows: Slots 1 ~ 5 correspond to Slots 61 ~ 65 in sequence and Slots 12 ~ 16 correspond to Slots 68 ~ 72 in sequence.

4. The slots of the EPE1/EPT1 protection boards are not fixed and they can be inserted any of the ten slots to implement 1:N (N 9) protection. The bridge boards and the protection boards are configured in the paired slots.

5. The OBA OPA and OAD boards can be inserted in any of the service slots. 6. When no tributary protection function is to be implemented, the electrical

interface boards should be configured with the corresponding interface boards and the paired relationship is shown in Item 3. To implement the 63*2M function, an EPE1 board and an EIE1 board should be configured.

7. The QxI/SCI boards are mandatory, and the QxI should be configured in Slot 66 and the SCI in Slot 67.

8. Slots 8 and 9 are used to hold the two CSF/CSE/CSA boards that form hot backup for each other. CSF board can support 5Gb/s bandwidth for expansion subrack.

9. Slots 18 and 19 are used to hold the two NCP/ENCP boards that form hot backup for each other.

Figure 4 Board slot layout of main subrack The board slot layout of expansion subrack is shown in Figure 5. The following matters should be noted: 1. When the expansion subrack is used, the main subrack must be configured

with ENCP and CSF (CSF boards must be configured to 1+1 mode and ENCP board may be configured to 1+1 mode). The low speed service



must be configured with SMI board which must be configured to 1+1 mode and inserted into slot 108 and 109.

2. Slot 117 is idle. Slot 118 or 119 is inserted with one passive board LKNCP. 3. The QxI/SCI boards are mandatory, and the QxI should be configured in

Slot 166 and the SCI in Slot 167. 4. Service slots in the expansion subrack may be configured with such boards

as OA, OAD, E1/T1 electrical processing board, E3/T3 electrical processing board and SEC/SEE boards.

5. The OBA OPA and OAD boards can be inserted in any of the service slots. 6. EPE1/EPT1/EP3/SEC/SEE boards can only be inserted in ten slots (slots

102 ~ 105 and 112 ~ 116). 7. Slot 101 and 116 may be inserted with 34/45M board and FE protection

board. Slot 161 and 172 may be inserted with 34/45M board and FE bridging board instead of such boards as ESFEx8 (the same as the main subrack).

8. The correspondence between the electrical interface boards and the cabling boards is as follows: Slots 101 ~ 105 correspond to Slots 161 ~ 165 in sequence and Slots 112 ~ 116 correspond to Slots 168 ~ 172 in sequence.

Figure 5 Board slot layout of expansion subrack

3.3 Connector-type for All kinds of Service Interface Table 9 Connector-type of interface

Service Interface Connector Type remark E1/T1(75/100Ohm) SCI

E1 (120 Ohm) SCI E3,T3,STM-1e(75 Ohm) CC4

External Clock(75 Ohm) CC4/DB9



External Clock(120 Ohm) DB9

FE(100Base-Tx) RJ45 Full-Duplex/Half-Duplex FE(100Base-Fx) LC/PC Full-Duplex

STM-1/4/16/64 LC/PC STM-1/4/16 support SFP

Alarm DB25/DB9



4 APPLICATION OF MSTP 4.1 Application of Ethernet Service

4.1.1 EPL: Ethernet Private Line

Figure 6 EPL

MSTP access node accesses data of important clients via FE interface, as shown in the above figure. After adapted with GFP encapsulation rate rather than L2 switching, user data is mapped into SDH VCG, then transmitted from end to end via SDH network to destination node. In the above process, link bandwidth depends on VCG. It is occupied only by a user just like a physical private line, so end-to-end QoS of services can be ensured. Different from conventional private line, MSTP can employ LCAS protocol or NM configuration to adjust link bandwidth flexibly and dynamically, and support traffic control. EPL can ensure transparent transmission of Ethernet service, e.g., Ethernet MAC frame and VLAN label. Ethernet service can be protected in SDH protection mode.

4.1.2 EVPL (Ethernet Virtual Private Line)

Figure 7 EVPL In the above figure, user data are accessed via several user ports, and share the bandwidth of one network-side port (WAN port), i.e., one VCG The bandwidth at WAN port can also be configured. It is required to adopt VLAN technique to ensure isloation between different user ports.



The advantage of the scheme is that all user ports can share bandwidth at WAN port, CIR and PIR should be configured to ensure QoS at user ports, and user Ethernet service adopts SDH physical-layer protection. EVPL is applied to virtual private line interconnection of different users (interconnected via VLAN) between two nodes. For example, VLAN1 and VLAN2 are two branches of industrial and commercial systems, and VLAN3 and VLAN4 are two branches of tax system.

4.1.3 EPLAN (Etherrnet Private LAN)

Figure 8 EPLAN The services at 3 branches can be converged to headquarter via star network composed of SDH timeslot links. MSTP at central node is embedded with L2 switching function. For central converged services, link bandwidth from branches to headquarter is exclusive, so end-to-end QoS can be ensured. And the network is highly reliable. When a branch fails, services at other branches still work. User Ethernet service adopts SDH physical-layer protection.

Figure 9 EPLAN

The services between 3 branches and headquarter can form Ethernet shared ring through SDH virtual connections via VCAT. But it is required in the configuration that each MSTP node in the ring support L2 switching and STP. In this way, less fiber bandwidth is occupied when large quantities of nodes are available in the ring. In order to avoid unfair bandwidth allocation among the nodes, the supervision is required to control LAN port traffic at each node. The ring adopts SDH physical-layer protection. Because Ethernet ring crosses several SDH rings, STP protection can also be used.



4.1.4 EVPLAN (Ethernet Virtual Private LAN)

Figure 10 EVPLAN The services between branches and headquarters of company A and B can form virtual Ethernet shared ring through SDH virtual connections via VCAT. But it is required in the configuration that each MSTP node in the ring support L2 switching and STP. The services of two companies are isolated by VLAN. In this way, less fiber bandwidth is occupied when large quantities of nodes are available in the ring. In order to avoid unfair bandwidth allocation among the nodes, the supervision is required to control LAN port traffic at each node. The ring adopts SDH physical-layer protection. Because Ethernet ring crosses several SDH rings, STP protection can also be used. EPL is applied to private line interconnection between two users.

4.2 Application of ATM Service ATM service can be converged to one 155M channel in VP-RING. In the following figure, one 155M channel can carry ATM services of node B,C,D, all the converged services go to BAS via node A.

Figure 11 ATM VP-RING 155M VP-RING is based on SDH network. It can coexist with SDH ring transmitting other services. In addition, ATM transparent transmission on SDH network can connect several VP-RINGs in serial to form a mixed ring.



5 NETWORKING AND PROTECTION 5.1 Application of Basic Service

ZXMP S385 is mainly applied to the local, metropolitan and backbone transmission networks. ZXMP S385 can provide all the networking features recommended by ITU-T, such as TM, REG, ADM, and MADM. The following picture is the basic physical topology of ZXMP S385. ZXMP S385 can support Chain, Star, Tree, Ring and MESH connection and protection.

1. Chain

2. Star

3. Tree

4. Ring

5. Mesh

TM

TM

TM

TM

TM TM TM

TM

TM

TM

ADM

ADM

ADM

ADM

ADM

ADM

ADM

ADM

DXC/ADM

DXC/ADM

DXC/ADM

DXC/ADM

DXC/ADM

DXC/ADM

TM

Figure 12 Basic Physical Topologies for ZSMP S385

5.2 Hardware-level Protection

5.2.1 Power supply protection 1. Out-of-cabinet power protection For ZXMP S385 equipment, one or two -48V power cables are introduced to the cabinet via the air switch in the power distribution box. When two groups of equipment room power supplies are introduced to the device, the power



supply works in 1+1 protection mode to make sure that the device works well in the case of either the power group failure. 2. Inside-cabinet power protection The dual-air switch control ensures the power supplies of every input power and every shelf are isolated and with no influence on each other. QxI/SCI carries out the 1:1 protection for input power, the power filtering, and the protections as anti-reverse connection and anti-overcurrent; and it may practice the normal application even with no self-own rack (with customers rack). On shelves, it supplies power to boards separately to guarantee no power influence on the boards inside all boards, and actualizes the hot powered plug of boards. The switchover control circuit is under 1:N protection and the 3.3V power supply is under 1:1 protection.

5.2.2 Double bus design ZXMP S385 adopts dual-bus design for hardware and applies the hierarchy of service bus, overhead bus and clock bus, which improves the reliability and stability of system.

5.2.3 Cross-Connect Protection and Clock Protection ZXMP S385 adopts two CSF/CSE/CSA boards to enable 1+1 protection. In the system, two CSF/CSE/CSA boards adopt the active/standby work mode. In case the active card is failed, the NMS controls the switching of the two cards.

5.2.4 Tributary Card Protection PDH service cards enable 1:N hardware service protection. E1/T1 service cards adopt 1:N (N



Figure 13 The ALS principle

5.3 Network-level protection ZXMP S385 can provide all networking features recommended by ITU-T. Protection modes include: 1. MSP 1+1/1:N 2. UPSR 3. BPSR 4. DNI protection 5. SNCP (at path layer VC12/VC3/VC4) 6. Logic subnet protection (LSNP) Protection features of ZXMP S385 equipment also include ETHERNET/IP re-routing that is in compliance with IEEE802.3E specification.

5.4 Protection switch time Table 10 SDH system protection switch time

Protection scheme Type Time CSF/CSE/CSA



6 PERFORMANCES AND INDEXES 6.1 STM-N optical interfaces performance

Performance of the OTU2/STM-64/16 /4/1 optical interfaces is shown as follows.

Table 11 Performance of the STM-1 optical interface

Nominal bit rate 155520kbit/s Classification code S-1.1 L-1.1 L-1.2 Working wavelength (nm) 1310 1310 1550 Source type MLM SLM SLM Min transmitting optical power (dBm) -15 -5 -5 Max transmitting optical power (dBm) -8 0 0 Minimum extinction ratio (dB) 8.2 10 10 Poorest sensitivity (dBm) -28 -34 -34 Minimum overload point (dBm) -8 -10 -10 Transmitter at reference point S Optical path between Point S and R Receiver at reference point R

G.957-compliant


Nominal bit rate 622080kbit/s Classification code S-4.1 L-4.1 L-4.2 Working wavelength (nm) 1310 1310 1550 Source type MLM SLM SLM Min transmitting optical power (dBm) -15 -3 -3 Max transmitting optical power (dBm) -8 2 2 Minimum extinction ratio (dB) 8.2 10 10 Poorest sensitivity (dBm) -28 -28 -28 Minimum overload point (dBm) -8 -8 -8 Transmitter at reference point S Optical path between Point S and R Receiver at reference point R

G.957-compliant


Nominal bit rate 2488320kbit/s Classification code S-16.1 L-16.2 L-16.2JE L-16.2P L-16.2U Working wavelength (nm) 1310 1550 1550 1550 1550 Source type SLM SLM SLM SLM SLM Min transmitting optical power (dBm) -5 -2 +2 -2 -2

Max transmitting optical power (dBm) 0 3 5 3 3



Minimum extinction ratio (dB) 8.2 8.2 8.2 8.2 8.2 Poorest sensitivity (dBm) -18 -28 -28 -28 -28 Minimum overload point (dBm) 0 -9 -9 -9 -9 Transmitter at reference point S Optical path between Point S and R Receiver at reference point R

G.957-compliant

Table 14 Performance of the STM-64 optical interface of ZXMP S385

Nominal bit rate 9953280kbit/s Classification code S-64.2b L-64.2c1 L-64.2c2 P1L1-2D2 Working wavelength (nm) 1550 1550 1550 1550 Source type SLM SLM SLM SLM Min transmitting optical power (dBm) -1 -2 3 0 Max transmitting optical power (dBm) 2 2 6 4 Minimum extinction ratio (dB) 8.2 8.2 8.2 9 Poorest sensitivity (dBm) -14 -22 -22 -24 Minimum overload point (dBm) -1 -9 -9 -7 Transmitter at reference point S Optical path between Point S and R Receiver at reference point R

G.691 or G.959.1-compliant

6.2 PDH interfaces performance and indexes Performance of PDH electrical interfaces is shown as Table 15.

Table 15 Performance of the PDH electrical interface

Type 1544kbit/s 2048kbit/s 34368kbit/s 44736kbit/s 155520kbit/s

Code pattern AMI or B8ZS HDB3 code HDB3 code B3ZS code CMI code

Bit rate of signals at output port Attenuation tolerance at input port Frequency deviation tolerance at input port

G.703- compliant

G.703- compliant

G.703- compliant

Anti-interference capability of input port

G.703- compliant

G.703- compliant

- - -

Permitted input port attenuation, permitted frequency deviation and output port signal bit rate tolerance are listed in the following table.

Table 16 Input port permitted attenuation, frequency deviation and output port signal bit rate tolerance

Interface rate

Permitted input port frequency deviation(regular squared attenuation)

Permitted input port frequency deviation

Output port rate tolerance



1544kbit/s -- Greater than 32ppm Less than 32ppm

2048 kbit/s 0dB~6dB, 1024kHz Greater than 50ppm Less than 50ppm

34368 kbit/s 0dB~12dB, 17,184kHz Greater than 20ppm Less than 20ppm

44736 kbit/s -- Greater than 20ppm Less than 20ppm

155520 kbit/s 0dB~12.7dB, 78MHz Greater than 20ppm Less than 20ppm

l Reflection attenuation at the input/output ports

For input/output port reflection attenuation index of various electronic ports of ZXMP S385, please refer to Table 17.

Table 17 Requirements for the input/output port reflection attenuation

Interface bit rate Test frequency range Reflection attenuation (dB)

51.2kHz~102.4kHz 12

102.4kHz~2048kHz 18 2048Kbit/s input port

2048kHz~3072kHz 14

860kHz~1720kHz 12

1720kHz~34368kHz 18 34368Kbit/s input port

34368kHz~51550kHz 14

155520Kbit/s input/output port 8MHz~240MHz 15

l Anti-interference capability of the input port

The ratio of main signals to interference signals is 18dB. l Output port waveform

The output port waveform complies with template specified in G.703 Recommendation. l Over-voltage protection of the input and output interfaces

The input and output interfaces must bear 10 continuous standard pulses (5 positive and 5 negative) without being damaged. The rising time of a standard pulse is 1.2ms, the width is 50ms and the voltage amplitude is 20V.

6.3 Performance of data boards There are several data boards in ZXMP S385 V2.40: SEC/SEE, TGE2B, RSEB, MSE, AP18 and TGSA8.

6.3.1 Performance of SEC24/48 SEC24 and SEC48 board provide 810M/100M+GE Ethernet services which support L2 switching function and VC-12 virtual cascading function.

Table 18 SEC48 and SEC24 Performance

Characteristics of Ethernet board Explanation of board function and size

Property sort Board name Processing board SEC48, interface board OIS18 and ESFE8

Processing board SEC24, interface board OIS18 and ESFE8

Interface type 10BASE-T/100BASE-TX,100BASE-FX,1000BASE-SX/LX/ZX Ethernet port

Connector RJ45/LC



QTY of board interface 810/100M+1GE

Port work mode (rate, full duplex, half duplex and auto-negotiation)

Support (100BASE-FX and 1000BASE support only full duplex)

Optical module able to plug Support

Front-outlet for GE panel; Interface board outlet for FE;

Interface mode Provide optical interface in cooperation with OIS1x8, Provide electrical interface in cooperation with ESFEx8

FE electrical interface 1:N protection Support N < -4

Remote download and upgrade Support

Max. port QTY at system SDH side (WAN port) 48 24

1.25G 622M

Support 8VC4 (Each VCG supports 1VC4);

Support 4VC4 (Each VCG supports 1VC4);

Support 24VC3 (Each VCG supports at most 3VC3);

Support 12VC3 (Each VCG supports at most 3VC3);

Total backplane mapping bandwidth

Support 504VC12 (Each VCG supports at most 63VC12).

Support 252VC12 (Each VCG supports at most 63VC12).

VC12 Virtual concatenation

Support (The multipath delay compensation supported by VC12 is 32ms)

VC3 Virtual concatenation Support (The delay supported by VC3 is 32ms)

Virtual concatenation

VC4 mapping Support (VCG includes only one VC4)

Multi-direction convergence ratio 48 24 Dynamic VCG bandwidth increase/decrease, no damage with service

support support

LCAS management functions support support

LCAS protocol, satisy ITU-T G.7042 standard Multi-path

protection of VCG level, protecting time



Bandwidth adjustment granule based on port and stream

Flow policing supports bandwidth granularity in steps of 64kbps

Granule based on port 64K rate limit

Support the flow control based on port Full duplex 802.3x PAUSE frame flow control

Port trunk function Trunk of even ports, up to 8FE

2-layer switching capacity Bi-direction 6.6Gbps Bi-direction 4.2Gbps

2-layer exchange

support the dynamic learning and static configuration of MAC address, satisfy IEEE802.1D bridge connecting function; MAC address study rate satisfies the index >1024/s, and able to set the aging time

Support 2-layer exchange transfer, the exchange of local side and the exchange of SDH side

support support

Supported MAC address address space 8K. Support 2 study modes: IVL and SVL.

Support Stacked VLAN/QinQ function Support

Support STP and RSTP Support RSTP, which is compatible with STP.

Support IGMP Snooping Support IGMP Snopping V2.0 Support IGMP Snopping V2.0

Broadcast packet suppression function support support

Supported VLAN QTY and scope

Support 1022 VLAN, where 2 VLAN are remained and used for transparent transmission. The VLAN quantity will be decreased by 2 each time the transparent transmission quantity is increased by 1.

COS function Support the service classification by following port, port+VLAN and port+802.1p. The level of COS is 5 levels.

QoS Support Policing + PQ based on flow Support CIR and EIR Support CIR & EIR rate at level of 64kbps 2-layer VPN function (EVPL, EVPLAN services) Support in Stack VLANQ-in-Qmode.

The intercommunication of different products inside company

Intercommunicating with EOS series boards, RPR functional RSEB board and MPLS functional board

Support Ethernet performance monitor of port level Support support

6.3.2 Performance of SEE l Providing 810M/100M+2GE interfaces. l Support 48VCG. VCG mapping mode may be VC-12-Xv/VC-3-Xv/VC-

4-Xv. VCG supports at most 1.25G bandwidth. l The total mapping bandwidth of SDH backplane is 1.25Gbps. l The unidirectional Ethernet switching capacity is 2.2Gbps. l Support E-Line, E-Tree and E-LAN services. l Configure S-VLAN according to port or customer CE-VLAN.



l Support Ethernet OAM to facilitate fault locating and performance

inspection.

l Support GFP RDI-CSF alarm. l Support Ethernet access rate control and DifferServ. l Support EPS protection. l Support port dispatching fairness of best-effort service.

6.3.3 Performance of TGE2B TGE2B board provides 2GE adaptive Ethernet services.

Table 19 Performance of TGE2B of ZXMP S385

Characteristics of Ethernet board Explanation of board function Property sort Board name TGE2B

Ethernet port characteristics 1000BASE-SX/LX/ZX Connector LC QTY of board interface 2 Port work mode (rate, full duplex and auto-negotiation) Support

Ethernet port

Optical module able to plug Support Interface mode Front-outlet on panel

Remote download and upgrade Support

Max. Port QTY at system SDH side (WAN port) 2

2.5G

Total backplane mapping bandwidth Support 16VC4 (Each VCG supports at most 8VC4), or 48VC3 (Each VCG supports at most 24VC3).

Virtual concatenation VC3 Virtual concatenation

Support (The delay supported by VC3 is 8ms. The board adopts the V3-AU3-AUG mode and the mapping is not made via VC4. Some problems occur in the interconnection with other vendors equipment and in the test. The interconnection and test adopt VC4 instead of VC3. )

VC4 Virtual concatenation Support (The delay tolerance supported by VC4 is 8ms.)

Dynamic VCG bandwidth increase/decrease, no damage with service

Support (The dynamic service bandwidth adjustment leads to 100ms loss. There is no problem in the function and interconnection.)

LCAS management functions (enable, alarm, event report)

Support

LCAS protocol

Multi-path protection of VCG level, protecting time Support



EOS system port can be used for RPR service cross-ring, or intercommunication with EOS boards as SEC/SEE and MSE. It supports LCAS protocol. RPR SPAN port and EOS system port share the 2.5 Gbit/s SDH processing bandwidth. They support maximum 2.5 Gbit/s of RPR ring total bandwidth, and maximum 155 Mbit/s of EOS bandwidth (RPR ring total bandwidth and EOS bandwidth cannot reach the maximum values simultaneously). RSEB board has the following functions: l Switching capacity: 5G, backplane bandwidth:2.5G;

l Providing 8FE2GE user Ethernet interfaces;

l Compliant with IEEE802.17, support for two RPR SPAN, capable of forming 1.25G bidirectional ring at most;

l Support for interoperation of RPR ring and EOS chain, implementing conversion of mapping granules;

l Support for Bypass RPR MAC function, used as EOS transparent transmission board to support transparent transmission of two GE+4 FEs;

l EOS port supporting CSF OAM function, with point-to-point LST function available;

l Support for IGMP Snooping broadcast protocol, support for IPTV application;

l Support for LACP protocol, providing large-capacity dynamic link aggregation function with protection;

l Good service security isolation, support for Q in Q-based VLAN VPN; l Support for VC-12-Xv/VC-3-Xv/VC-4-Xv, LCAS and GFP.

6.3.5 Performance of MSE MSE board is applicable to the MAN access layer and convergence layer, focusing on accessing or aggregating distributed services to the upper layer network. MSE board performs the following operations on services from different locations: stream classification, destination address identification, rate control, dispatch, service reshaping. The services are transmitted via Ethernet or SONET/SDH interface after the message is encapsulated by specific protocol. MSE implements Ethernet service access, L2 data forwarding, MPLS message process and mapping from Ethernet data to SDH data. MSE board provides customer interfaces as 8FE+2GE which are compliant with IEEE802.3 specification. FE can be electrical or optical interface. MSE adopts the flow method to process Ethernet message, supports multiple switch methods such as MPLS/VLAN/MAC and provides virtual bridge function of L2 network and quality guarantee for end-to-end service. It is one of the critical equipment to construct the network for virtual private line and virtual private service network. l System-side capacity: MSEB backplane bandwidth is 2.5G, supports

maximally sixty-four VCGs which can select different VC granules. Maximally 252VC12 (with each VCG containing 63VC12 at most) can be configured to cooperation with VC4/VC3;



l Supports MPLS label switching with switching capacity of 3.6G;

l Supported protocols: supports virtual concatenation compliant with ITU-T G.707, supports VC-12-Xv/VC-3-Xv/VC-4-Xv; supports LCAS functions compliant with G.707 and G.7042; supports GFP encapsulation method compliant with G.7041.

l It supports OSPF-TE route protocol and RSVP-TE resource reservation protocol.

l Support EPL, EVPL, EPLAN and EVPLAN applications.

l Supports CoS (classification of service) based on port and VLAN, offers VFI forwarding adapting to pseudo-wire;

l Features control plane functions, supports RSVP-TE signaling distribution tunnel tag, supports OSPF-TE routing.

l Supports OAM function of LSP, supports LSP 1+1/1:1 protection.

6.3.6 Performance of AP18 AP18 board is mainly used to converge or aggregate ATM service data to SDH transmission network. It provides 8155 Mbit/s optical interfaces at the ATM side to perform functions as ATM layer processing and mapping from ATM cell to VC-4. It provides 1622 Mbit/s non-concatenation data flow at the system side. With 622M backplane bandwidth and 622Mbps cell switching capacity, it can select 1-4 VC-4 channels to transmit ATM services. l Backplane bandwidth: 622M, cell switching capacity: 622Mbps. l Supports four ATM service types as constant bit rate (CBR), realtime

variable bit rate (rt-VBR), non-realtime variable bit rate (nrt-VBR) and unspecific bit rate (UBR).

l Supports VP/VC switching. l Support VP uni-directional/bidirectional 1+1 and 1:1, supports VPRing,

VCRing functions.

l Support OAM function of ATM, supports VP protection switching, the switching request can be alarms as VP-AIS (Virtual path-based alarm indication signal), LOS (loss of signal), LOF (loss of frame), OOF (out of frame), LAIS (line alarm indication signal), LCD (loss of cell delineation), and LOP (loss of pointer).

l Supports ATM space, logic multicast, when performing ATM exchange, it can copy one input ATM cell flow (VP, VC) to multiple output ATM links.

6.3.7 Performance of TGSA8 TGSA8 has SAN and GE transparent transmission interface. It supports 8 user interfaces which adopt SFP optical module. The first 4 user interfaces may respectively offer GE or SAN service. SAN service includes 1G Fiber Channel and 1G FICON services. The other 4 user interfaces may offer 4GE services. TGSAx8 provides 42.5G service bus at the system side. The total bandwidth is 10G. Other characteristics of TGSAx8 are showed as follows:



l Support GFP and comply with G.7041. l Support LOF, OOF, AU-AIS and AU-LOP alarm check. l Provide line-side and user-side loopback functions of user interface. l Support VC-3 and VC-4 mixed concatenation. Any VCG may be

respectively configured to VC-3 or VC-4 virtual concatenation. VC-3 supports VC-3-->TU-3-->AU-4 mapping path.

l Support LCAS protocol and complies with G.7042.

6.4 Physical Performance of Ethernet

6.4.1 Ethernet interface types and followed standard Table 20 Ethernet interface index

Type Rate (bps) followed standard Interface type interface

10BASE-T 10M IEEE 802.3 Electronic interface RJ45, category 3 UTP

100BASE-TX 100M IEEE 802.3u Electronic interface RJ45, category 3 UTP 100BASE-FX 100M IEEE 802.3u M-1.1/S-1.1/L-1.1 SFP-LC

All optical interface indices are described as following. 1. FE MMF optical interfaceM-1.1

Table 21 Transmission index of FE MMF optical interface

Item 62.5/125m MMF Unit Transmission unit type MMF LD

Transmission distance 2 KM

Interface SFP-LC

Wavelength (, range) 1270~1380 nm

Trise/Tfall (maximum;10%~90%) 3 ns

RMS spectrum width (maximum) 63 nm

Output optical power (maximum) -14 dBm

Output optical power (minimum) -20 dBm

Output optical power when the LD is shut down (maximum) -45 dBm

Extinction ratio (minimum) 10 dB

Table 22 Receiver index of FE MMF optical interface

Item 62.5/125m MMF Unit Wavelength(, range) 1270~1380 Nm

input optical power (maximum) -14 dBm

Receiver sensitivity -30 dBm

2. FE short distance SMF optical interfaceS-1.1 Table 23 index of FE short distance SMF optical interface

Item 10/125m SMF Unit Transmission unit type SMF LD




Interface type SFP-LC

Wavelength(, range) 1261~1360 nm

Trise/Tfall (maximum;20%~80%) 2.5 ns

RMS spectrum width(maximum) 7.7 nm

output optical power(maximum) -8 dBm

output optical power(minimum) -11.5 dBm

Output optical power when the LD is shut down(maximum) -45 dBm

Extinction ratio(minimum) 9 dB

Table 24 receiver index of FE short distance optical interface

Item 10/125m SMF Unit Wavelength (, range) 1261~1360 nm

Input optical power (maximum) -8 dBm


3. FE long distance SMF optical interfaceL-1.1 Table 25 Transmission index of FE long distance SMF optical nterface




Wavelength (,range) 1261~1360 nm


RMS spectrum width (maximum) 3 nm

output optical power(maximum) 0 dBm

output optical power(minimum) -5 dBm


Extinction ratio (minimum) 10 dB

Table 26 Receiver index of FE long distance optical interface

Item 10/125m SMF Unit Wavelength (,range) 1261~1360 Nm



6.4.2 GE interface types and followed standard Table 27 GE interface index

Type Rate(bps) followed standard Interface type interface

1000BASE-SX 1000M IEEE 802.3z M-1.8 SFP-LC

1000BASE-LX 1000M IEEE 802.3z S-1.1 SFP-LC

1000BASE-ZX 1000M IEEE 802.3z L-1.2 SFP-LC



All optical interface indices are described as following: 4. GE MMF optical interfaceM-1.8

Table 28 Transmission index of GE MMF optical interface

Item 62.5/125m MMF Unit Transmission unit type MMF LD

Transmission distance 275 m

Interface SFP-LC

Wavelength (, range) 830~860 nm



Output optical power(maximum) -4 dBm

Output optical power(minimum) -9.5 dBm


RIN(maximum) -117 dB/Hz


Table 29 Receiver index of GE MMF optical interface

Item 62.5/125m MMF Unit Wavelength(range) 770~860 nm

input optical power(maximum) 0 dBm


Minimum return loss 12 dB

Intensified receiving sensitivity (maximum) -12.5 dBm

5. GE short distance SMF optical interfaceS-1.1 Table 30 Transmission index of GE short distance SMF optical interface




Wavelength(,range) 1270~1355 nm



output optical power(maximum) -3 dBm

output optical power(minimum) -9.5 dBm Output optical power when the LD is shut down(maximum) -35 dBm



Table 31 Receiver index of GE short distance optical interface

Item 10/125m SMF unit



Wavelength ( range) 1270~1355 nm




6. GE long distance SMF optical interfaceL-1.2 Table 32 Transmission index of FE long distance SMF optical interface


Transmission distance 80 Km


Wavelength (,range) 1540~1570 nm


RMS spectrum width (maximum) 0.16 nm

output optical power(maximum) 5 dBm

output optical power(minimum) 0 dBm Output optical power when the LD is shut down(maximum) -45 dBm



Table 33 Receiver index of GE long distance optical interface

Item 10/125m SMF Unit Wavelength(,range) 1270~1600 nm

Input optical power(maximum) 0 dBm



6.5 Performance of OAD OAD board consists of OADD and OADC. l OADD can add/drop 4 wavelengths of DWDM optical signals. These 4

wavelengths are among C-band 40 wavelengths. l OADC can multiplex/demultiplex 4 wavelengths of CWDM optical

signals and 1 channel of 1310nm optical signal. These 4 wavelengths are 1471/1491/1511/1531nm or 1551/1571/1591/1611nm.

l OADD/OADC can be upgraded. With board cascading, it can multiplex/demultiplex 8 wavelengths of optical signals.

OAD board may process the control commands from NM to make the online upgrade of board software.

Table 34 Performance of OADD

Parameter Item Unit Min Max

Frequency Range THz 192.1 196.0

Wavelength Range nm 1529.55 1560.61



Channel Spacing GHz 100

0.5 dB Passband nm 0.11 -

20dB Passband nm - 1.20

In-drop dB 2.5 3.3

Add-out dB 2.5 3.3 Insertion Loss

In-out dB - 2.4

Insertion Loss Uniformity dB - 1.0

Table 35 Performance of OADC

Item Unit Parameter Channel Number 6 5 4

Central wavelength nm 1471/1491/1511/1531 1471/1491/1511/1531

1551/1571/1591/1611

Passband @ 0.5dB nm 6.5 6.5 6.5

Wavelength range of upgrade port nm 1544.5~1621 1544.5~1621 -

dB 0.5 0.5 0.5 Ripple

@ 1310 Port dB 0.7 - -

Passband @ 1310 Port nm 12601360 - -

Ln- CWDM dB 2.3 2.0 -

UPGCWDM dB - - 1.7

Ln UPG dB 2.3 2.0 -

Insertion Loss (Including connectors)

Ln -1310nm dB 1.2 - -

6.6 Performance of OBA Table 36 Performance of OBA Module

Performance Unit OBA12 OBA14 OBA19 Operating wavelength nm 1530~1565 1530~1565 1530~1565

-12~4(10G) Input power dBm -12~4

-6~4(2.5G) -6~4

Output power(maximum) dBm 12 14 19

Dynamic range of output power (dB) dB 3 3 3

7~26(10G) Gain dB 5~24

7~20(2.5G) 12~25

Small Signal Gain dB >25 >25 >25

Noise Index dB 5 5 5

Input return loss dB 45 45 45

output return loss dB 45 45 45

Output pump leakage dBm -30 -30 -30

Input pump leakage dBm -30 -30 -30

PDG dB 0.5 0.5 0.5

PMD ps 1 1 1

Power(full temperature range) W



Operating temperature -15~65 -15~65 -15~65

Operating humidity 5~95 5~95 5~95

Storage temperature -40~75 -40~75 -40~75

Optical Connector LC/PC LC/PC LC/PC

NoteOBA19 Only operating at 155M and 622M bit rate.

6.7 Performance of OPA Table 37 Performance of OPA Module

Performance unit OPA38 OPA32 Operating wavelength nm 1550.12 1550.12

Filter-3dB bandwidth nm 0.45 0.45

Filter -20dB bandwidth nm 1.2 1.2

Input power dBm -38~20 -32~15

Output power(maximum) dBm -9 -6

Dynamic range of output power (dB) dB 3 3

Gain dB 26~32 25~31

Small Signal Gain dB 30 30

Noise Index dB 4.5 4.5

Input return loss dB 45 45

output return loss dB 45 45

Output pump leakage dBm -30 -30

Input pump leakage dBm -50 -50

Forward ASE level dBm -30 -30

Backward ASE power level dBm -30 -30

Pump wavelength nm 980 980

PDG dB 0.2 0.2

PMD ps 1 1

Power W 15 15

Power supply V -4810% -4810%

Operating temperature -15~65 -15~65

Operating humidity 5~95 5~95

Storage temperature -40~75 -40~75

Optical Connector LC/PC LC/PC

6.8 Performance of DCM The Dispersion Compensating Modules compensates the dispersion of conventional single mode fiber (G.652/G.655)

Table 38 Performance of the DCM

Type DCM-20 DCM-40 DCM-60 DCM-80 DCM-100 Dispersion compensated range(ps/nm) -32915 -68021 -102031 -136041 -164041

Insert loss(dB) 4.1 5.1 7.0 8.9 12.1

typical value -3.2 -4.4 -6 -7.7 -11.5



PMD(2-step) 0.5 1.0 1.2 1.3

PMD(Typical)(ps) -0.4 -0.4 -0.5 -0.6

PMD cost(dB) 0.1 0.1 0.1

Note 1. Each DCM needs a 1U-high DCM-Box.; 2. Generally Only 10G system need to consider dispersion problem; 3. DCM80 can only be located in front of OBA and cannot be located after OPA

6.9 Error Performance For each circuit direction and for bi-directional section and path, the error performance is monitored separately, the SDH performance of ZXMP complies with ITU-T G.784, G.828 and G.826. The SDH performance includes performance items such as BBE, ES, SES, FBBE, FEES, FESES, PSC, PJC+, PJC-, UAS, etc. The long term and short-term error performances of ZXMP S385 are complied with ITU-T G.828 and M.2101 recommendation. According to ITU-T G.821 and G.826, in 420km HRDP (Hypothetical Reference Digital Path), SDH system error performance of ZTEs transmission product is as follows, these figures are tested in field and test duration is not less than 24 hour.

Table 39 SDH system error performance Bit rate(kbit/s) 2048 44736 155520 622080 2488320

ESR 1.84810-6 3.46610-6 7.39210-6 1.84810-5 3.710-5 SESR 9.2410-8 9.2410-8 9.2410-8 9.2410-8 9.2410-8 BBER 9.2410-9 9.2410-9 9.2410-9 9.2410-9 9.2410-9

The performance is better than ITU-T recommendation.

6.10 Jitter index at interfaces For ZXMP S385, the jitter and wander tolerance for G.703 PDH and SDH interface conform to ITU-T G.823, G.824 (45Mbps) and G.825 respectively.

6.10.1 Jitter and wander tolerance of PDH input interface The jitter and wander tolerance at ZXMP S385 PDH input interface meets the requirements shown in Figure 14, Figure 15 and Table 40.

Peak-peak jitter and wander(logarithm)

A0

A3

A1

A2

f0 f10 f9 f8 f1 f2 f3 f4 Jitter frequency(logarithm)

Slope: -20dB/10 octave

Figure 14 The jitter and wander tol

product description of zxmp s385_v2_40

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