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Simulation of high speed serial interconnection (report from PH/ESE first discussion about high speed serial link simulations) J. Christiansen, S. Baron 1 EUG - 08/24/22

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Tools What we need: A tool to make PCB and sub-structure simulation: Pre-Layout analysis (use of models, S-parameters, BER simulation, eye diagram) Post-Layout verification (EMC hot spots on entire PCB, crosstalk, timing..) 2-D, 3-D field solvers Tools available at CERN – Ansoft Maxwell 2D and 3D – CST Microwave Studio (3D EM field solver) – Allegro AMS (former P-Spice, circuit simulation) – Do we have Cadence PCB SI/PI or any other PCB simulation tool? – Latest experience within our group: few years ago with SpectraQuest and Maxwell, recent with CST Some of us have briefly played with some other tools – Agilent ADS – Mentor Hyperlynx – Ansoft HFSS, AWR Microwave Office – Partners using Stateye (public domain) J. Christiansen, S. Baron3EUG - 1/30/2016

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Page 1: Simulation of high speed serial interconnection (report from PH/ESE first discussion about high speed serial link simulations) J. Christiansen, S. Baron1EUG

Simulation of high speed serial interconnection

(report from PH/ESE first discussion about high speed serial link

simulations)

J. Christiansen, S. Baron 1EUG - 05/03/23

Page 2: Simulation of high speed serial interconnection (report from PH/ESE first discussion about high speed serial link simulations) J. Christiansen, S. Baron1EUG

Vital expertise for experiments’ upgrades

• Serial links from front-end chips to GBT (or alike)– 40 – 320/640 Mbits/s (or higher ?)– Electrical distance: 10cm to 1 – 2 m (pre-emphasis and filters)– Low mass / low power (low current/voltage) / low noise / Low BER/ Low failure rate/ low ?– SEE

• Optical FE links (Versatile/GBT)– 5 – 10 Gbits/s– Short distance electrical: 1 - 10 cm.– Long distance electrical if deported optoelectronics: 1 – 2 m ! (pre-emphasis and filters)– SEE

• Communication between FPGA's on same board.– 1 – 10G– 1 – 30cm

• Communication between boards via backplanes/cables (trigger, TCA, etc.)– 1 – 10G– 10cm – 100cm– Connectors– Pre-emphasis, filters, etc.

• DAQ interface links.– 10G – 100G commercial

• TTC optical links.– Compatible to GBT but no SEE problem

• Etc.

J. Christiansen, S. Baron 2EUG - 05/03/23

Page 3: Simulation of high speed serial interconnection (report from PH/ESE first discussion about high speed serial link simulations) J. Christiansen, S. Baron1EUG

Tools• What we need: A tool to make PCB and sub-structure simulation:

• Pre-Layout analysis (use of models, S-parameters, BER simulation, eye diagram)• Post-Layout verification (EMC hot spots on entire PCB, crosstalk, timing..)• 2-D, 3-D field solvers

• Tools available at CERN– Ansoft Maxwell 2D and 3D– CST Microwave Studio (3D EM field solver)– Allegro AMS (former P-Spice, circuit simulation)– Do we have Cadence PCB SI/PI or any other PCB simulation tool?– Latest experience within our group: few years ago with SpectraQuest and Maxwell, recent

with CST• Some of us have briefly played with some other tools

– Agilent ADS– Mentor Hyperlynx – Ansoft HFSS, AWR Microwave Office– Partners using Stateye (public domain)

J. Christiansen, S. Baron 3EUG - 05/03/23

Page 4: Simulation of high speed serial interconnection (report from PH/ESE first discussion about high speed serial link simulations) J. Christiansen, S. Baron1EUG

PH/ESE plans

• PH/ESE working group being set-up to:– Identify a common set of tools we will use for the

group and on which we will get expertise (if possible within the CERN tool kit, of course)

– Organize the interface with EN-ICE on the specific subjects of high-speed transmission links:• layout rules and simulation• PCB library (vias, material, ..)• PCB QA

– Try to identify the companies able to build boards and prototypes according to the rules previously set

J. Christiansen, S. Baron 4EUG - 05/03/23