Brazilian  Semiconductor  Scenario  and  Opportuni3es    

1  

Jacobus  W.  Swart    

Imec,  Leuven,  Belgium  and  

 UNICAMP,  Campinas,  Brazil    

Outline  1.  Introduc3on  2.  Main  Actors  

1.  Universi3es,  Ins3tutes,  INCT’s    2.  IC  Design  Houses  3.  Semiconductor  Fabs  4.  Value  Chain  Services  

3.  Government  Support  4.  The  ASIC  Ecosystem  for  Innova3on  5.  Imec  IC-­‐Link  6.  Conclusions   2  

1.  Indroduc3on  •  Brazil  -­‐  a  fast  adopter:  

•  R&D  at  ITA  and  USP  in  the  50’s  •  First  plant  by  Philco  in  São  Paulo  for  diodes  and  transistors  in  the  60’s  

•  Many  back-­‐end  plants  for  discrete  devices  a]er  the  60’s  

•  Microelectronics  Labs:  •  LME/USP  –  end  of  60’s  •  In  the  70’s:  LED  and  LPD  at  UNICAMP  and  CPqD  

•  Industries  in  the  80’s:  •  Discrete  devices:  Semikron,  Aegis,  Icotron  +  many  back-­‐end’s  •  IC’s:  SID  Microeletrônica  (front-­‐end,  back-­‐end,  Design),  Itaucom  (back-­‐end,  Design),  Elebra  (Design)  

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ROM 2 k Bit, 1978, nMOS (LME, EPUSP)

90’s  

•  Opening  of  boarders  for  import  •  Deindustrializa3on  started  •  Increasing  electronics  trade  deficit    •  But  con3nuous  R&D  at  academy.  

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2000’s  

•  New  industrial  policies  •  New  lows  and  incen3ves  •  Airac3on  of  new  industries:  front-­‐end  and  back-­‐end  

•  IC  Brazil  program:  DH’s  and  training  

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2.  Main  Actors  

1. Universi3es,  Ins3tutes,  INCT’s    2.  IC  Design  Houses  3. Semiconductor  Fabs  

4. Value  Chain  Services    

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2.  Main  Actors  –  Universi3es  &  Ins3tutes  •  Fabrica3on:  Materials  and  Processes  

– Silicon  based:  USP,  UNICAMP,  UFRGS,  UFPE  –  III-­‐V  based:  USP,  UNICAMP,  PUC-­‐RJ,  UFMG  –  Ins3tutes:  CBPF,  CETENE,  CTI,  INPE  and  LNNano  

•  IC  Design  and  EDA  tool:  –  FEI,  ITA,  PUC-­‐RS,  UFAM,  UFCG,  UFMG,  UFPE,  UFPel,  

UFPB,  UFPR,  UFRGN,  UFRGS,  UFRJ,  UFSC,  UFSM,  UnB,  UNESP,  UNICAMP,  UNIFEI,  UNIPampa,  Univali,  USP  

•  Photonic  IC  –  ITA,  CTI,  UNICAMP,  USP  and  others    

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Centro  de  Componentes  Semicondutores  –  UNICAMP  (  www.ccs.unicamp.br)  

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Gap    120  nm  

With  resonant  frequency  of  1.55  µm   Without  resonant  frequency  

• control  separately    ion  energy  (RF  power)  and  ion  flux  (µW  power).    • operate  at  low  pressure  (1-­‐100  mTorr)  ⇒  reduce  ion  surface  spuiering  • A  2.45GHz   µW  source  generates  the  plasma  at  high  power  • A  13.56  MHz  RF  power  source  biases  separately  the  sample  chuck.  

ECR  (Electron  Cyclotron  Resonance)  

     ECR  System  

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     E-­‐beam  lithography  

Electron  Lithography  within  10  nm  resolu3on;  

Nano  photonics;  NanoFETs  

Centro  de  Componentes  Semicondutores  –  UNICAMP  (  www.ccs.unicamp.br)  

2.1  Main  Actors  –  INCT  networks  •  INCT  NAMITEC  

–  124  researches,  23  ins3tu3ons  –  Silicon  micro  and  nanoelectronics  systems  –  Concluded  degrees  (6.5  years):  120  PhD,  300  MSc  –  600  papers  ISI  journals,  1500  papers  at  conferences  

•  INCT  DISSE  –  12  researchers,  8  ins3tu3ons  –  III-­‐V  semiconductor  devices  

•  INCT  INEO  –  42  researchers,  26  ins3tu3ons  – Organic  electronics  &  optoelectronics  

•  FOTONICOM  12  

2.2  Main  Actors  –  IC  Design  Houses  Ins2tu2on   Aprox  number  of  Designers   Loca2on  CEITEC   70   Porto  Alegre  CETENE   20   Recife  Chipus   25   Florianópolis  CIMATEC/Senai   Salvador  CPqD   30   Campinas  CTI   30   Campinas  DFChip   10   Brasília  Eldorado   50   Campinas  Idea!   12   Campinas  LSITec   40   São  Paulo  NXP   145   Campinas  SiliconReef   10   Recife  Unitec   60   Ribeirão  das  Neves  Von  Braun   20   Campinas   13  

2.2  Main  Actors  –  Training  Centers  •  One  year  intense  training  program  –  based  on  Cadence  material  and  tools.  

•  One  year  on  the  job  training  •  Support  by  MCTI  through  CNPq  and  FINEP  •  Two  training  centers:  

– CT1  at  UFRGS,  Porto  Alegre  – CT3  at  USP,  São  Paulo.  

•  Now  in  danger  due  to  lack  of  budget.  

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2.3  Main  Actors  –  Semiconductor  Fabs  

Company   Ac2vity   Loca2on  BrPhotonics   Photonic  IC’s   Campinas  CEITEC  SA   Front-­‐end  CMOS  +  Fabless   Porto  Alegre  HTMicron   Back-­‐end  memories   São  Leopoldo  Mul3laser   Back-­‐end  memories   Extrema  Semikron   Power  discrete  devices   Carapicuiba  Smart   Back-­‐end  memories   A3baia  SUNEW   OPV   Belo  Horizonte  Unitec   Front-­‐end  CMOS   Ribeirão  das  Neves  

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2.4  Main  Actors  –  Value  Chain  Aggregators  

•  Imec  Representa3ve  Office  Brazil  –  access  to  foundries,  packaging,  tes3ng,  logis3cs,  consultancy,  training  

•  FastCompany  Brazil  –  represent  ARM  and  Synopsys.  •  Other  providers  of  services:  

– directly  abroad  

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3.  Governmental  Support  •  Incen3ves  lows:  

– PADIS  –  Informa3cs  Low  – Lei  do  Bem  – Portaria  950  

•  Project  funds,  loans  and  equi3es:  – BNDES,  BNDESPar  – FINEP  – FAPESP:  PIPE  and  PITE  programs  – FUNTELL  and  other  agencies.  – Embrapii  

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4.  The  ASIC  Ecosystem  for  Innova3on  

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ASICs  –  Applica3on  Specific  IC’s  •  ASICs  are  needed  in  many  applica3ons  :  

– High  volumes  (consumer)  –  Portability  (medical,  consumer,  ...)  –  Large  SoC  – Mixed  Signal  ICs  –  Low  Power  (Baiery  applica3ons)  –  Sensor  applica3ons  –  IoT  –  Confiden3ality  –  ....  Those  applica3ons  where  unit  cost  is  not  an  issue  at  low  volumes,  ex.  High-­‐end  servers,  high  performance  computers,  space,  ...  

19  

Use  of  FPGA  vs  ASIC  •  Economical  only  for  few  thousands  of  units  •  Technical  solu3on  only  if  power  and  size  is  no  concern.  

20  

Use  of  ASSP  vs  ASIC  •  Semiconductor  market  numbers  2012  

•  Brazil:  product  development  mainly  with  ASSP  •  Great  opportunity  and  importance  for  ASIC  for  similar  to  interna3onal  innova3on  level  

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Semiconductor  Market  2012  

World  US$  Bi1  

%   Brazil  US$  Bi2  

Total   299,9   100   5,1  ASSP   83,7   28   ~x  ASIC   21,3   7,1   ~0,0x  ASIC/ASSP  ra3o   0,25   25   ~  0  

1  Gartner  2  ABINEE  +  MDIC  

Up-­‐coming  revolu3on:    power  consump3on  dilemma!!!  

•  Mobile  products  •  Dependence  on  power  harves3ng  sources  •  Need  for  very  low  power  ASICs  (FPGA  are  not  viable  and  ASSP  are  not  op3mized  for  each  case)  

•  Need  for  large  quan3ty  of  skilled  IC  designers  •  Educa3on,  training  programs  and  MPW  access  is  essen3al  to  par3cipate  and  be  successful.  

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Consumer,  compu3ng,  telecom  and  mobile  have  driven  semiconductor  usage  

In  terms  of  volume,  they  s3ll  do  today  

Market  Evolu3on  

24  

Innova3on  was  driven  mainly  by  large  companies  

SMEs  in  suppor3ng  mode  

25  

Security,  Medical  &  Wearables,    Smart  Home,  Smart  Car,    Vision,  Industrial,  and  ….  IoT    The  new  growth  markets  

Segmenta3on    and  differen3a3on  

26  

Very  difficult  to  navigate  for  large  companies  

Playground  for  many  SMEs  

27  

“Innova.on  is  usually  with  people  who  are  small  and  gi9ed  with  a  good  idea.”    

Chris  Neil,  Maxim  Senior  Vice  President,  Industrial  and  Medical  Solu.ons  Group  

 

•  Innova3on  in  this  new  and  segmented    market  is  diverse  

•  Change  occurs  through  collec3ve  interac3on  •  SME’s  apply  collabora3ve  research,  and    

find  crea3ve  funding  methods  •  We  observe  a  strong  2011-­‐2015  increase  in  ASIC  demand  by  SMEs,  reversing  a  decade  

long  decline  •  Differen3a3on  and  IP  protec3on  provided  by  ASICs  are  main  incen3ves  •  “Substream  Innova2on”  is  the  collec3ve  SME  innova3on  ac3vity  

 

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Observing substream flows

Radio  access   Automo2ve  

Datacom  

Connected    

home  

Imaging  &  Vision  Systems  

Security  

Innovation Domains

Medical  &  Wearables  

Industrial  

29  

 RF  de

sign  complexity

 

 BB  design  complexity  

   .6  

 11ac  

 11ah  

 -­‐MTC  

 2G    3G  

 11ad  

 11n  

Playground for SME’s

Radio access

 Micro  projector  

 Drones  

 BSI  

 X  ray  

Strong center of vision expertise around Leuven

 Touchless  interac3on    Video  processor  unit  

 IP  camera    Hyperspectral  

Imaging and Vision Systems

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Medical & Wearables

… many of them developed by

SME’s

From “hearing aids” to a myriad of devices

 ULP  radios,  and    ULP  design  technology  

for  baiery  operated  wearables  

32  

Medical & Wearables

(UK)

(F, HKG)

(NL)

(I)

33  

Industrial  

Connected home

Source : Greenpeak, at GSA Munich 2014

Many  technologies  and  more  emerging  Technology  in  essence  “not  yet”  affordable    

     but….  

25$ ultimate IoT module

34  

Industrial  

Industrial

 Li-­‐Fi  

 Vehicle  M2M    Agricultural  surveillance  

 Shelf  tag  labels  

 Localiza3on  

 Livestock  Management  

 Smart  shopping  cart  

35  

How can European SMEs be succesful?

Suppliers  

FOUNDRIES  

EDA  

ASSEMBLY  

TEST  

IP  

PBA/PCB  

Large  system  

companies  

Local  m

arket  

IDM  Plessey,  Philips,  

Siemens,  Nokia,  ...  

300  SMEs  

Government  support  •  Financial  s3mula3on  to  innovate  •  Support  training  of  good  engineers  at  academia,  R&D  centers,  design  

houses,  SMEs  •  Easy  and  affordable  access  to  CAD  tools  and  IC  prototyping  •  Create  VC  friendly  climate  to  create  SMEs  

36  

How can European SMEs be succesful?

300  SMEs  

Suppliers  

FOUNDRIES  

EDA  

ASSEMBLY  

TEST  

IP  

PBA/PCB  

Design  houses  &  IP  houses   Large  

system  companies  

Local  m

arket  

WORLD  MAR

KET  

5.  Imec  IC-­‐LINK  – ASIC  services  

•  MPW  and  assembly  services  to  universi3es    and  companies  (called  “Europrac3ce”)  

•  Access  to  TSMC  technologies  for  prototyping  and  volume  produc3on  through  VCA  partnership  with  TSMC  

•  Prototyping  and  volume  :    Assembly  and  Test  – Design  services  

•  RTL  or  netlist  to  GDS2    place  and  route  –  physical  design  

– Over  500  IC  tape-­‐outs  per  year  –  PBA  services,  failure  analysis  and  packaging  design  –  Integrated  photonic  solu3ons  (wafers  &  packaging)  –  First  ac3vi3es  in  1984  

37  

Imec  IC-­‐link  -­‐  The  team  •  80  (now  95)  people  team  of  business  developers,  logis3c  wizards  

consultants  and  technical  support  experts  –  25  in  ASIC  prototyping  and  manufacturing  services  –  25  in  ASIC  design  services  –  12  in  assembly,  test  and  qualifica3on  –  10  in  business  development  and  technology  consultancy  –  8  in  PCB/PBA  services,  failure  analysis  and  advanced  packaging  design  

38  

What  our  customers    typically  need    

– Access  to  leading  edge  technology  at  affordable  cost  –  Prototyping  with  MPW  and  MLM  – Advise  in  technology  selec3on  –  Flexibility  in  business  model  :  from  COT  to  FTK  –  Logis3cs  and  opera3on  support    – Assembly,  test  and  cer3fica3on  services  –  Trusted  supply  chain  partner  –  PCB/PBA  technology  and  design  know  how  – Access  to  leading  edge  IP  

39  

40  

IC-­‐link  as  service  provider  

Funding associations

Foundries  and  IC  Technologies  

IHP  (Germany)  

IHP  SGB25V  0.25µ  SiGe:C  IHP  SGB25VGOD  0.25µ  SiGe:C  IHP  SG25H1  0.25µ  SiGe:C  IHP  SG25H3P  0.25µ  complementary  SiGe:C  IHP  SG25H3  0.25µ  SiGe:C  IHP  SG13B  SiGe:C  Bipolar/Analog  IHP  SG13S  SiGe:C  Bipolar/Analog/CMOS  IHP  SG13C  SiGe:C  CMOS  7M/MIM  

ON  Semi  (Belgium  +  USA)  

0.7µ  CMOS  A/D  2M  0.5µ  CMOS  A/D  3M  0.35µ  CMOS  A/D  5M  0.7µ  CMOS  A/D  I2T100  0.7µ  CMOS  A/D  I2T30  0.35µ  CMOS  A/D  I3T80/50/25    0.5µ  CMOS  C5  EEPROM    

0.8µ  CMOS  A/D  0.6µ  CMOS  A/D  3M  0.35µ  CMOS  A/D  4M  0.8µ  CMOS  50V  0.35µ  SiGe  BiCMOS  4M  0.35µ  CMOS  50V  0.35µ  CMOS  OPTO  0.18µ  CMOS  +  HV  

ams  (Austria)  

TSMC  (Taiwan)  

0.25µ  CMOS  L/MS/RF  0.18µ  CMOS  L/MS/RF  0.13µ  CMOS  L/MS/RF    90nm  CMOS  L/MS/RF  65nm  CMOS  L/MS/RF  40nm  CMOS  L/MS/RF  

UMC  (Taiwan)  

0.25µ  CMOS  L/MMC/RF  0.18µ  CMOS  L/MMC/RF  0.13µ  CMOS  L/MMC/RF  90nm  CMOS  L/MMC/RF  65nm  CMOS  L/MMC/RF    CIS  :  0.18µ  

ARM/Ar3san  (USA)  

Cell  libraries  and  design  kits  for  TSMC  and  UMC  technologies  

Faraday  (Taiwan)  

Cell  libraries  and  design  kits  for  UMC  0.25,  0.18,  0.13µ,  0.11µ,  90nm  &  65nm  CMOS  

Selec3on  criteria  

Well-­‐known  foundry  

Partnership  

Flexible  prototyping  

Small  +  medium  volume  

Silicon  photonics,  MEMS  Foundries  

Si310-PH

PiezoMUMPs

MetalMUMPs

SOIMUMPs

PolyMUMPs

Si substrate

WaveGuide

SiO 2 Si

FiberCoupler PSV

ISIPP25G+

SG25_PIC  

43  

High speed photonics

Low  volume  access    at  affordable  cost  

Prot

otyp

ing

cost

Launch flexibility

1

~0.8

~0.1

~0.025

Full  Mask   Size : ~ 20x30 mm

Any time

MPW  Size : per sqmm MPW schedule

mini  Size : per subblock Selected runs from MPW schedule

MPW  

MPW  MPW  

MPW  MPW  

mini  

mini  MPW  

Size : ~ 10x15 mm Any time

MLM  

MLM  

Source : TSMC

Schema2c  Driven  Layout

Layout

Device  Models

GDS  

Electrical  simula2on

EM  simula2on

Process  varia2on  simula2on

Electro-­‐Op2cal  simula2on

LVS  

DRC  

LFD

Op2cal  proximity  correc2on

Silicon  Thickness  (nm)  

PROCESS  DESIGN  KIT:  PDK  

IP  por|olio  •  TSMC  IP  por|olio  

–  Std  cells,  IOs,  memory  compilers,  PLL,  PHY’s,  ...  –  Can  be  requested  in  TSMC  online  –  Either  free  or  under  license  agreement  

•  Imec  IP  –  State  of  the  art  IP  –  Ranging  from  system  IP  to  advanced  building  blocks,  e.g.  

•  So]ware  Defined  Radio  IP  •  Low  power  ADC  

–  Various  process  technologies  including  state  of  the  art  – Deliveries  and  business  models  tuned  to  your  need  

•  3rd  party  IP  –  Preferred  pricing  for  some  3rd  party  IP  providers  

46  

Assembly  services  – Access  to  best  in  class  packaging  houses  

•  Prototypes    

•  Produc3on  volumes  

–  Imec  team  of  assembly  specialists  •  Selec3on,  customiza3on  of  package,  simula3ons,  ...  

– Wide  range  of  produc3on  and  prototype  packages  •  Plas3c  and  ceramic  •  Open  tool:  QFN,  aQFN  (Mul3  row),  QFP,  CQFP,    ...  •  Customized  packaged:  xxBGA,  WLCSP,    aWLP,  ...  

47  

Test  and  qualifica3on  –  Test  hardware  and  so]ware  development  –  Debugging  and  characteriza3on  –  Qualifica3on  &  Failure  analysis  –  Produc3on  volume  tes3ng  –  Yield  op3miza3on  –  Near-­‐sourcing  for  efficient  test  program    

development  and  small  volumes  produc3on  :  

–  Global  partners  for  high  volume  projects  :  

–  Qualifica3on  experience  mainly  in  Aerospace  [ESCC9000,  ESCC2269000],  Industrial  and  Medical  

48  

Test  facility  and  capabili3es  

49  

Hatina

Teradyne Microflex Quad Site

Teradyne I-flex Teradyne J750

50  

Broaden  your  mind  Strengthen  your  skills    discover  our  por|olio  @  www.imecacademy.be  

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CMOSProcess stepsPackaging & 3DMemoriesMicrosystems & MEMSMaterialsModelingCharacterization &reliability

PhotonicsBeyond CMOS

Digital designAnalog & RFElectronics design &manufacturing

Modeling of circuits &systems

EnergyBiomedical systemsVision systemsWireless systemsSensor systemsLarge Area Electronics

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Version: 15.2.0.153 Powered by Cornerstone OnDemand, Inc. ©2000-2014

All Rights Reserved. Terms - Privacy - Cookies

CMOSProcess stepsPackaging & 3DMemoriesMicrosystems & MEMSMaterialsModelingCharacterization &reliability

PhotonicsBeyond CMOS

Digital designAnalog & RFElectronics design &manufacturing

Modeling of circuits &systems

EnergyBiomedical systemsVision systemsWireless systemsSensor systemsLarge Area Electronics

GET TO KNOW IMEC

INNOVATION AND RESEARCH MANAGEMENT

Search

REGISTER for our newsletter For full offer LOGIN

▸  Established  in  1984  ▸  Largest  independent  R&D  ins3tute  in  Europe  ▸  Total  2015  revenue  of  415  M€  

▸  >  2400  people  ▸  published  998  prominent  scien3fic  papers  

▸  filed  a  record  number  of  180  European  patents  

IMEC  

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Office  USA  San  Francisco    

Belgium  Leuven  The  Netherlands  Eindhoven  

China  Shanghai   Office  Japan  

Tokyo    Taiwan    

Hsinchu  India    

Bangalore  

Worldwide  presence  

Office  Brazil  Campinas    

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IMEC  ac3vi3es  

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MEMS, Sensors,

Photonics

HETEROGENEOUS INTEGRATION

Lithography Devices Interconnects

CORE CMOS FLEXIBLE ELECTRONICS

INTERNET OF HEALTHY THINGS

BAN Life sciences

INTERNET OF POWER

Photovoltaics Power devices

INTERNET OF THINGS

Sensing & connectivity solutions

INDUSTRIALISATION FOUNDRY ACCESS TO >300 SMEs AND >700 ACADEMIA TAPES-OUT MORE THAN 500 IC DESIGNS PER YEAR

Imec IC-link

6.  Conclusions  •  A  considerable  semiconductor  ecosystem  has  developed  in  Brazil.  

•  Governmental  industrial  policies  and  incen3ves  are  of  paramount  importance  for  the  deployment  of  the  semiconductor  sector.  

•  The  new  uprising  markets  offer  great  opportunity  for  development  of  new  components  and  products  for  Brazilian  enterprises,  also  SME’s.  

•  Access  to  interna3onal  broad  range  of  technologies  and  services  are  needed  to  fulfill  the  needs  for  innova3ve  and  compe33ve  products.  

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•  Contacts:  –  jacobus.swart@imec.be,  –  jacobus@fee.unicamp.br    

•  Sorry  for  possible  mistakes  and/or  omissions.  •  Acknowledgment  to  Carl  Das  and  Paul  Malisse  from  IMEC  for  sharing  some  slides  

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