Overview

ECS provides thermal design services to companies in the

electronics industry. We are well vested in design for

telecommunications, computing, networking, and consumer

products. We also have experience in electronics for medical

equipment, avionics, military equipment, automotive electronics,

solar and alternative energy systems, and the gaming industry.

Our capabilities include room, system, board, and package level

thermal analysis and design.

Electronic Cooling Solutions Inc. (ECS)

ECS, founded in 1998, was formed with the vision of

providing the best thermal management consulting

services to the industry world-wide. This vision

continues to be the driving force for the company and

its team.

Based in the heart of Silicon Valley, ECS has

established a reputation for high-quality and cost-

effective solutions for its clients. Members of the team

bring a combination of design, simulation, and

experimental skills to the table, in order to address the

design issues faced by our clients. We have clients

and business relationships throughout the United

States as well as internationally, and work with some of

the biggest names in the electronics industry.

Optical connectors such as these pose a challenging

thermal design problemMarch 7, 2019

Some of our current clients ▪ Agystor

▪ Amulet Hotkey

▪ Arlo

▪ Astronics

▪ Byton

▪ Cerebras

▪ ChargePoint

▪ Ciena

▪ Cisco Systems

▪ Dell

▪ Facebook

▪ GM Cruise

▪ Google

▪ GoPro

▪ Hamamatsu

▪ HP

▪ Infinera

▪ Intel

▪ Kaneka

▪ Keysight Technologies

▪ Lam Research

▪ L3 Communications

▪ Li-Cor BioSciences

▪ Lumileds

▪ M3 Design

▪ Microsoft

▪ Neophotonics

▪ Nokia

▪ NVidia

▪ Oclaro

▪ Palo Alto Networks

▪ Pure Storage

▪ Quantenna

▪ Roche Sequencing Solutions

▪ Samtec

▪ SK Hynix

▪ StudioRED

▪ SurfaceInk

▪ Tascent

▪ Totemiclabs

▪ Verily Life Sciences

▪ Xilinx

Examples of Services

ECS provides a broad and versatile scope of services, including, but

not limited to:

• Cooling system design for high-performance computer servers,

routers, switches and storage products

• Thermal analysis of data centers and computer rooms

• Thermal design and analysis of LED light source products

• Design of cooling solutions for consumer products such as

cameras, handsets, tablets, Wi-Fi routers, notebooks and PCs

• Thermal design of Video Cards and other PCIe products

• System level and board level thermal design of computing products

used by the military

• Steady State and Transient Analysis of IC devices on a JEDEC test

board or other test environment

• Development of compact thermal models for commercial single

chip packages

• Medical devices

• Thermal design and analysis of avionics and premium seat in-flight

entertainment systems

• Thermal design and analysis of a broad range of products that

utilize LCD displays ranging from tablets to high-end 3-D displays

SFP+ Temperature Profile using IR Camera

53

61

Laser Driver (56)

59

Post Amp IC (69)

52.3

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Our Analysis Tools

Design and Simulation

Our highly trained staff has extensive experience and expertise with

design, modeling, experimental tools and other equipment. We strive to

maintain a generous portfolio of thermal analysis tools so that we can

support our many customers.

Design Tools

We employ state of the art design tools in order to best address our

customer needs. Our design tools include:

▪ FloTHERM, FloTHERM XT, FloEFD and IcePak are

Computational Fluid Dynamics (CFD) software that enable up-front

simulation of airflow and heat transfer for proposed designs, prior to the

availability of hardware that can be tested.

▪ Pro-E Creo and SolidWorks so that data can easily be transferred

into our analysis environment from our customers MCAD models.

▪ FloVENT is used to analyze room and data center environments that

include multiple systems housed in cabinets and racks.

▪ HeatsinkDesigner is used to quickly optimize heatsinks that may

then be placed in either a FloTHERM or IcePak system or board level

model environment.

Thermal profile of air passing through a high-end

telecommunications switch box.

March 7, 2019

Electronic Cooling Solutions (ECS)provides clients with thermal solutions. Our

test facilities are used for design verification

tests to ensure that a product’s design goals

are met. Prototypes can be built and tested

to prove and refine concepts.

Our lab capabilities are also used to

complement its CFD and FEA modeling

tools and other analytical design resources.

Fan performance tests, such as pressure

vs. flow as a function of PWM input, and

flow impedance of heat exchangers and

filters, are examples of lab test results used

as inputs to the simulations.

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Testing Capabilities

ECS utilizes tools to make volumetric airflow, air velocity, and temperature measurements. This includes:

▪ Several airflow test chambers that can measure volumetric airflow ranging from less than 1 CFM to up to

4,500 CFM and which are used to do volumetric flow and impedance measurements for cards and systems.

▪ High and low temperature testing and cycling as well as simulation of high altitude conditions using

appropriate environmental test laboratories.

▪ Fan testing and measurement of the airflow

impedance of filters, grill patterns and other

porous materials used to ensure EMC and safety

compliance.

▪ Thermal characterization of natural convection

products

▪ Infrared imaging used to show hot-spots on

cabinets and circuit boards

▪ PWM controller to manage fan speed in order to

meet acoustic requirements

▪ Other experimental capabilities include:

- Design and construction of load boards and test

fixtures

- Calibration of thermal test chips and use of test

chips for system and board level thermal

design.

4,500 CFM Volumetric Flow Chamber for Airflow Characterization

March 7, 2019

The figure to the left

is an illustration of a

test station in the

ECS lab that is used

to experimentally

evaluate the thermal

performance of heat

exchangers and cold

plates.

ECS uses CFD tools to analyze and design cold plates and heat

exchangers. We also utilizes an in-house software tool to calculate

system level pressure drop at various flow rate.

Liquid Cooling Capabilities

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Cold Plate Characterization

The test vehicle is used to evaluate the thermal performance of a cold plate designed for cooling of high power IC

packages. It also includes a liquid pump, a flow meter, and a liquid to air (or liquid to liquid) heat exchanger.

Thermocouples are used to measure liquid temperatures in and out as well as the copper block temperature.

Heater Assembly:

1” x 1” Heater

> 99.5% of heat going to cooler UT

Power Dissipation: Up to 2.5 kW or 380 W/cm2 (limited by

heater temperature).

Note: Other heaters and other sized copper blocks can be

used or alternately can be replaced by an IC device.

Liquid Cooling Capabilities

ECS is involved in analytical and experimental liquid cooling studies. Below is a schematic of an ECS

designed test station used to evaluate heat exchanger and cold plate performance.

Thermocouple T-WaterIN

Liquid/Air or Liquid/Liquid heat exchanger

Heat outInsulated heat source (see below)

Flow Meter

Thermocouple T-WaterOUT

Cooler UT

Liquid Pump

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T3ster (top), and ‘structure function’ output for a power

transistor (bottom).

T3ster Transient Thermal Measurement

The T3ster Transient Thermal Measurement equipment gives

ECS the capability for fast, accurate testing and

characterization of semiconductor components.

The T3ster equipment is capable of measuring the real time

transient thermal responses directly on the component die.

Coupled with advanced analysis software this data can be

used to generate ‘structure’ functions. The structure functions

reveal the thermal resistance of each object in the heat flow

path and can pinpoint changes such as delamination or voids

in the die attach.

The T3ster can be used for a range of test applications:

Component Characterization:

- ICs, LED’s, IGBT, power transistors etc.

- RθJC measurement according to JEDEC JESD 51-14

- In-situ component characterization within actual

environment.

- Dynamic Compact Thermal Model (DCTM) generation and

verification.

- Thermal interface material (TIM) characterization &

thermal conductivity measurement.

- Packaging qualification testing.

Reliability Studies:

- Non-destructive failure analysis

- Thermal cycling / ageing of components and

Die attach, TIM degradation

March 7, 2019

Electronic Contamination Inspection

and Testing allows ECS to help clients with

their cleanliness and contamination-related

questions. We have on-site facilities for

inspecting electronic components and

assemblies, using a microscope and camera

system connected to a computer for image

analysis and archival. Surface cleanliness

can be assessed, using our in-house C3

tester for ionic contamination concentration.

ECS also has resources for further tests,

such as ion chromatography to determine

the nature and concentration of ions on the

board or component, as well as cross-

sectioning and SEM/EDS. The in-house

work is conducted in a 240 sq ft contained

environment, maintained to better than ISO

Class 8 cleanroom requirements.

March 7, 2019

William Maltz - President and founder of Electronic Cooling Solutions, has

over 30 years of experience in thermal management of electronic systems.

Mr. Maltz has worked on the design of thermal solutions for products that

range from low power consumer products to high performance multiprocessor

computer systems and high-end core routers. His technical responsibilities

include managing multiple projects and working closely with engineering

management at a number of companies.

Mr. Maltz has been an active organizer of SemiTherm and the IMAPS

Advanced Technical Workshop on Thermal Management. He is also a co-

author for a number of technical papers.

Guy Wagner - Director, ECS Rocky Mountain Office has over 45 years of

R&D experience in the electronics industry. His experience includes: IC and

system cooling and packaging technology, disk drive design, thermal design of

computer systems, medical and aerospace equipment, telephone switching

systems, and consumer electronic products.

His expertise includes both electronics system cooling as well as cooling of IC

packages. Guy has authored and presented more than 40 papers at

international technical conferences and has 29 patents.

Prior to joining ECS, Mr. Wagner was Chief Scientist at HP in Fort Collins and

a Member of the Technical Staff as Bell Laboratories. Mr. Wagner received his

MS in Mechanical Engineering at Iowa State University.

March 7, 2019

Arjan Kole - Staff Thermal Engineer First joined Electronic Cooling

Solutions in 2009 and recently returned to the ECS team. He has close to 20

years of experience in thermal management. Prior to joining ECS, he worked

at Philips Electronics in the Netherlands, Varian Medical Systems and Varex

Imaging.

While at Philips he had an opportunity to work on a wide variety of products

including medical equipment, semiconductor process equipment, as well as

electronic products. At Varian Medical System and Varex Imaging he worked

on process development for X-ray tubes. At ECS, Arjan has been engaged in

products ranging from telecommunication equipment to hand held devices.

Ceferino Sanchez - Senior Thermal Engineer joined the ECS team in

2006. He has 20 years of thermal design experience, including four years as

an instructor at the University of the Philippines.

Prior to joining ECS he worked for the Astec Division of Emerson Network

Power where worked on power supply thermal design and simulation.

Ceferino is a proficient user of FloTHERM, FloTherm XT, IcePak and other

CFD tools. He has experience working on a broad range of products ranging

from high-end telecommunications equipment to handheld consumer

electronics products.

March 7, 2019

Albert Chan - Senior Thermal Engineer recently joined the ECS team. He has

over 20 year of experience. Albert has extensive package level design

experience and a working knowledge of laboratory tools used for package design

and package failure analysis. He has also worked with liquid cooling and other

cooling technologies needed for cooling of high performance IC packages.

Prior to joining ECS he worked at Oracle Sparc Server Group, Maxim Integrated

Packages, Fujitsu Laboratories, and Fujitsu Computer Packaging Technologies.

Albert has a Bachelors of Science in Chemical Engineering from Mapua Institute

of Technology and a PhD in Chemical Engineering from the University of

Cincinnati.

Nayana Ghantiwala - Senior Thermal Engineer recently joined the ECS team.

Nayana has over 20 years of experience, mainly as a thermal engineer. Prior to

working at ECS Nayana held thermal design positions at Google-Alphabet,

Oclaro, HP, and Apple Computer. Nayana has also worked as a mechanical

design engineer at both Applied Materials and Design Continuum. She has

experience working on the cooling design for a broad range of electronics

products. She is an experienced CFD analysist, using both FloTHERM and

IcePak. Nayana also has a good working knowledge of test methodologies and

requirements.

Nayana has a Bachelors of Science in Mechanical Engineering from the

Massachusetts Institute of Technology.

March 7, 2019

Justin Dixon – Thermal Engineer has been working at ECS for over 4

years. He is highly competent using both CFD tools such as Flotherm

and designing and running experimental work. Justin completed his

Bachelors in Mechanical Engineering at San Jose State University.

Justin has become a valued member of the ECS team. He shows a

passion for developing new skill sets. The ECS team has come to rely on

him to provide critical support on key projects.

Md Malekkul Islam - Thermal Engineer joined ECS in early 2017. Md

received his BS in Mechanical Engineering from Bangladesh University of

Engineering and Technology and his MS in Mechanical Engineering from

the University of Texas at Arlington. Md has experience using FloTHERM,

IcePak, and 6SigmatET. He has a passion for learning and has shown that

he is effective doing both experimental and analytical work.

March 7, 2019

Angelo Alcantara - System Engineer graduated from the University of

Santo Tomas in Manila, Philippines. He has been with ECS for 11 years.

Prior to ECS, he worked as a software engineer at Accenture, Manila. At

ECS, Angelo manages the company's computer network, databases and

applications. He is also responsible for lab management and project

testing. He is proficient in instrumentation, airflow testing, thermal testing

and supports a number of key ECS clients.

Ritul Gandhi – Thermal Engineer Intern recently joined ECS. Ritul

completed his Master of Science at University of Texas, Arlington. His

studies focused on the thermal sciences and included fan and heatsink

optimization projects. Ritul used a wide variety of analytical tools including

Ansys IcePak and Fluent, Comsol Multiphysics, Abaqus, and MatLabs, as

well as both SolidWorks and Creo.

March 7, 2019

Raul Vargas – Thermal Engineer joined ECS on June 2017. Raul completed his

Bachelors at University of California, Davis and is currently working on an MS degree

in Mechanical Engineering at San Jose State University. His studies have focused

on the thermal sciences and has included use of analytical methodologies, CFD

simulation, and thermal test design. Raul previously worked at Huawei as an

engineering intern and at NTFB Combustion Equipment as an applications engineer.

Raul has demonstrated enthusiasm and ability to handle practical design work.

Arvind Modekurti – Thermal Engineer has been with ECS for one year. Arvind

completed his Master of Science at University of Cincinnati. His studies focused on

the thermal sciences with an emphasis in Computational Fluid Dynamics (CFD).

Previous work experience includes an internship at AMD. Arvind has shown that he

has an understanding of engineering fundamental and ability to handle new

problems and to develop new skill sets.

March 7, 2019

David Lew – Engineering Consultant has almost 35 years of thermal

design and test experience in the electronics cooling and data center

industry. David worked as first a Senior Engineer and more recently as Staff

Engineer at ECS. David also has 30 years of experience at IBM where he

held positions focusing on storage products cooling and then real-time

monitoring and control of cooling in data centers. David has a BS in

Mechanical Engineering from Cal Poly SLO and MS in Mechanical

Engineering from Stanford University.

Dr. Charles Ortloff - Thermal Design Contractor/Advisor - Dr. Charles

Ortloff serves as a Research Associate at the University of Chicago in the

Department of Anthropology and is the author of the recent Oxford Press

book "Water Engineering in the Ancient World: Archaeological and Climate

Perspectives on Ancient Societies of South America, the Middle East and

South East Asia.” He has 40 years experience as a R&D engineer for the

defense, chemical, petroleum, energy, food processing, electronic cooling,

medical device and nuclear industries specializing in CFD and heat transfer

solutions for domestic and international clients.

March 7, 2019

_____

Electronic Cooling Solutions Inc.2344B Walsh Avenue (Bldg. F), Santa Clara, CA 95051

Phone: (408) 507-0712

Email: info@ecooling.com

Website: www.ecooling.com

March 7, 2019