mipi cadence presentation

Confidential

Shri Jaganathan Solutions Architect Cadence Design Systems

MIPI MPHY OVERVIEW

2 © 2012 Cadence Design Systems, Inc. Cadence confidential. Internal use only.

•  Introduction •  Who is MIPI Alliance •  What MIPI Do •  MPhy Introduction •  TX- Key parameters •  RX-Key parameters

AGENDA


Who is MIPI® Alliance?

• MIPI drive mobile and mobile-influenced interface technology through the development of hardware and software specifications

• MIPI work globally and collaboratively with other standards bodies to benefit the mobile ecosystem

Copyright © 2013 MIPI Alliance. All rights reserved.


What MIPI Do

•  45+ interface specifications released to date • MIPI has full ecosystem of members to support

many types of mobile and mobile-influenced designs

• Specs are widely adopted for designs across the mobile industry and beyond

•  255 members worldwide

Copyright © 2013 MIPI Alliance. All rights reserved.


MIPI Overview


MIPI Interfaces / Stack

UniPro 1.5 and

2.0

Conf PIE

DDB

M-PHY

serial I/F

PTI

CMOS CMOS

M-PHY

serial I/F

CMOS-based

SLIMbus

CMOS-based

M-PHY

serial I/F

D-PHY

serial I/F

D-PHY

serial I/F

D-PHY

serial I/F

PHY

STP

HSI UniPro 1.5 and

2.0

UniPro 1.0

Transport

DigRF 4G

DigRF 3G

SPMI :

Power Mgmt.

RF-FE:

RF Control DSI-1 CSI-2

App-data

ICLC ICLC DCS

App-control

NAND SW IMF

Software

Gigabit Trace Trace Mass

Storage IPC BB-RF 4G BB-RF 3G Control Audio/ Data/Ctrl

UniPort- M

UniPort- D Display Camera

TWP OST

OST FrameWork

App-data

App-data

M-PHY

serial I/F

UniPro 1.5 and

2.0

Conf


•  M-PHY –  V1.0 board approved 08 FEB 2011 – 1.45Gbps –  V2.0 Released on June 2012 – extends operation to 2.9Gbps –  V3.0 Released on Oct 2013 – extends operation to 5.8Gbps –  V4.0 expected in 2014 extends operation to 11.6Gbps

–  Connects Modem DigRF v4 and Memory LLI v1.0 to the Application Processor – Next generation cameras CSI-3 v0.8, displays DSI-2 v0.1 – Joint Standard Development: JEDEC UFS v1.1, USB SSIC v1, PCI Mobile Express

–  Features – Custom Clock – Self Consistent – Aggressive Power Management – Optical/Repeater ready

MPHY Specification Overview


M-PHY Introduction: Lane, Link and More…

Picture taken from the MPHY specification document



M-TX = TX

Module

M-RX = RX

Module




Lane = unidirectional single-signal physical channel. Consists of one M-

TX, one M-RX and one line




SUB-LINK = a collection of lanes all in one direction



Link = 2 sublinks (one each in opposite direction) + Lane management function




M-TX State Diagram


M-RX State Diagram


M-PHY Burst Operation


M-PHY V1.0

•  HS Burst 25mW •  LS Burst 1mW •  Stall ns 10mW •  Sleep us 100uW •  Hibern8 0.1-1ms 10uW

state recovery power latency

Assumption: one M-TX and one M-RX (including clock multiplication)

Race to Halt Power Heuristics

HS Burst

Stall

LS Burst

Sleep

Hibern8

Disable

Power On

Power M-PHY States


M-PHY Configuration Using protocol configuration mechanism

•  Local protocol checks capabilities of local PHY and … … receives capabilities of remote PHY

•  Protocol decision on operation profile •  Profile request send to local PHY and via the protocol layer to the remote

PHY using the current PHY operation mode •  INIT-PCC cycle through the PHYs will activate the change •  Optical converters can be configured by flushing configuration data

during the INIT-PCC cycle

E/O O/E PHY PHY PROT PROT

E/O O/E LOCAL REMOTE









??


M-PHY Specification Roadmap

M-PHY v1

Bandwidth support -  HS GEAR 1 -  PWM G0-G3 -  SYSBURST Bandwidth Provisional -  HS-Gear 2 -  PWM G4-G5

Bandwidth support - HS GEAR 1 & 2 - PWM G0-G5 - SYSBURST Bandwidth Provisional -  HS-Gear 3 -  PWM G6-G7

Bandwidth support - HS GEAR 1,2 & 3 - PWM G0-G7 - SYSBURST Bandwidth Provisional HS-Gear 4

v2.0

M-PHY v3

2011 2012 2013

v1.0

v3.0

Bandwidth support - HS GEAR 1, 2, 3 & 4 - PWM G0-G7 - SYSBURST

M-PHY v4

v4.0

2014

1.45Gbps 2.9Gbps 5.8Gbps 11.6Gbps

DigRF v4

UFS

LLI/SSIC

CSI-3/Mobile Express

M-P

HY

supp

orts

:

M-PHY v2


DPHY and MPHY Comparison Feature DPHY MPHY

Min. number of pins per direction 4 2

Minimum configuration (# of pins) 4 4

Data traffic for minimum configuration

Unidirectional or half-duplex dual-simplex

Medium <30 cm PCB, flex,micro-coax

< 30 cm PCB, flex,micro coax,<1.2 m cable, optical

Data rate per lane

HS Mode 80 Mb/s - 1.5 Gb/s ~ 1.25, 2.5, 5 Gb/s (A series); ~ 1.5, 3, 6 Gb/s (B series)

LP Mode < 10 Mb/s 10k-600Mb/s

Electrical signaling

HS Mode SLVS - 200 mV SLVS - 200 mV

LP Mode LVCMOS - 1.2V SLVS - 200 mV w/o RX-RT

HS Clocking method DDR Source-Sync Clk Embedded Clk

HS Line coding None or 8b-9b 8b-10b

Power – Energy/bit Low Lower than DPHY

Receiver Complexity CDR not required CDR required

LP only PHY’s Disallowed Allowed


•  High-Speed data transfer per lane –  Multiple transmission speed ranges and rates per BURST mode to further scale

bandwidth to application needs; Mitigates interference problems.

•  Supports both SYS and PWM mode LS operation –  Flexibility in data rates

•  Low power dissipation –  Multiple power saving modes, where power consumption can be traded-off

against recovery time •  Clocking flexibility: designed to be able to operate with independent local

reference clocks at each side, but suitable to exploit the benefits of a shared reference clock

•  Optical friendly: enables low-complexity electro-optical signal conversion and optical data

•  Distance: optimized for short interconnect (<10 cm) but extendable to a meter with good quality interconnect or even further with optical converters and optical waveguides.

•  Configurability: differences in supported functionality (to reduce cost) and tune for best performance (implementation) without hampering interoperability

MIPI M-PHY IP Key Feature List


MPHY – Key Features v3.0

• Supports 2 Low speed modes – Type-1 (PWM Signaling) – Type-2

•  Supports 2 amplitude modes – LA – SA

•  Supports 3 Speed modes and 2 rates per mode •  Supports 8b-10b encoding •  Supports Termination and no Termination modes •  Standard RMMI interface definition


PWM Bit waveform and Bit Stream Example


Line Conditions and States



DIF-P and DIF-N : States during normal operation and used for data-transmission



DIF-Z : Possible only during power-up and power-saving states



DIF-Q : Possible only when the M-RX has been powered off.


MPHY TX Architecture

PPI Interface

HS / LS FSM

DATA PATH

DATA Serializer & Clock Gen

DRIVERS

TX_DP

TX_DN

CONTROL + BIST

LOOPBACK

HSCLK LSCLK

HSCLK LSCLK

BIST

CFGCLK

CTRLInterface

DATAInterface

CLK from CMN Block

RM

MI I

nter

face

Driver +

Term


PPI Interface

HS / LS FSM

DATA PATH

DATA DeSerializer & CDR

PREAMP + TERM

RX_DP

RX_DN

CONTROL

LOOPBACK

REFCLK

CFGCLK

CTRLInterface

DATAInterface

SYMCLK

DATA

MPHY RX Architecture

RM

MI I

nter

face


PPI Interface

HS / LS FSM

DATA PATH


PREAMP + TERM

RX_DP

RX_DN

CONTROL

LOOPBACK

REFCLK

CFGCLK

CTRLInterface

DATAInterface

SYMCLK

DATA


RM

MI I

nter

face

HS Amp for G1/G2/G3

modes


PPI Interface

HS / LS FSM

DATA PATH


PREAMP + TERM

RX_DP

RX_DN

CONTROL

LOOPBACK

REFCLK

CFGCLK

CTRLInterface

DATAInterface

SYMCLK

DATA


RM

MI I

nter

face

LP Amp for low-speed

modes


PPI Interface

HS / LS FSM

DATA PATH


PREAMP + TERM

RX_DP

RX_DN

CONTROL

LOOPBACK

REFCLK

CFGCLK

CTRLInterface

DATAInterface

SYMCLK

DATA


RM

MI I

nter

face

Ultra low power squelch detector

for Hibernate mode


Data Transfer Modes

Data Transfer Modes

HS Mode

HS-Gear1 (Mandatory)

HS-Gear2 (Optional)

HS-Gear3 (Optional)

LS Mode

PWM Mode (Type-1)

SYS mode (Type-2)

OR

AND

AND

AND


BIST Details

BISTGenerator

InputLatch

BISTSelect

Encoding+ Serializer

TXP

TXN

RXP

RXN

Decoding+ Deserializer

Output Latch

BISTChecker

from PPI/RMMI

to PPI/RMMI

BIST_FLAG

•  Comprehensive BIST functionality to o  Ease production testing o  Support standalone bring-up of the IP.

•  The BIST modules can generate and check various patterns ranging from simple data ramps to complex jitter-inducing patterns.


•  Option to –  generate and check various patterns like PRBS, CRPAT, CJTPAT

etc. –  run the BIST infinitely or in a burst mode. –  control the burst length. –  control the idle time between bursts, within limits of the MPHY

specification. –  send patterns that repeat in every burst or differ in every burst. –  inject a single-bit error at a programmable point in the data stream.

•  Supports observable BIST status •  BIST error signal is observable at the IP port if required •  BIST error counters are readable as status registers

BIST Features


•  Burn-in Mode: Stress testing by putting TX and RX in maximum power consumption modes with the help of external loopback.

•  Loopback Mode: Provides a transparent bit-by-bit path from an M-RX serial input to an M-TX serial output.

BIST Modes


MPHY – Silicon Validation

• No certification or Sigfest

• Conformance Test suite (CTS) – Developed as part of the PHY Work group – Defines Test procedures – Tek presentation will have details of this


MPHY – Silicon Validation

• Tx Test setup requirements – 20GHz BW Oscilloscope – 20GHz Active Probe – Clock Source – Digital IO Source/Capture card – Power supplies & Multimeters

•  Rx Test setup requirements – BERT (with Datarate of atleast 7.5Gbps)

–  Rj & Sj Jitter injection capabilities –  ISI channel


MPHY – Silicon Validation Key Tx Parameters

•  Jitter Test

•  Eye Mask Test – Channel de-embedding

• PWM signal Test


•  Jitter separation is a time consuming process if Spectral method is followed to get the exact Jitter separation.

•  Dual Dirac method can be used to get the Jitter split much faster and if lesser number of samples can be taken and extrapolate the RJ numbers to reduce the time much lower.

•  HS default mode is terminated mode and this has to be a 100ohm differential termination across Dp and Dn. This has to be measure at the pin. This can be achieved only through probing directly on a 100ohm terminated very near to the Dp/Dn pin using an active probe.

•  Active probes normally have a high noise floor which adds RJ to the measurement and this is reflected on the TX measurements

Jitter Test


Eye Mask Test

G1 and G2 eye diagram G3 Eye Diagram


Impact of active probe noise


•  Unterminated mode probing

•  PWM data decoding

PWM Test Challenges


MPHY – Silicon Validation Key Rx Parameters

•  Jitter Calibration and Test

• PWM signal and PPM Offset Test


RX calibration Setup

DUT RX

Oscilloscope

Physical Calibration Setup

Pattern Generator

+ De-emphasis

+ Jitter Sources

SMA Cables

Replica Channel

Active Probe

Block diagram taken from CTS discussion PPT


Jitter Mask for G3A

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

1.8

2

0.8 8 10 26 100 166.4

Tota

l Jitt

er(U

I)

SJ Frequency(MHz)

Spec TJ


•  RX input should have following components –  Low frequency Jitter component as shown in the Jitter Mask –  Low frequency RJ – High Frequency RJ – High frequency SJ tone –  ISI to meet the Spec defines channel loss

•  No Channel defined- RX spec is defined at the Pin

Jitter Components


•  For PWM test data need to be sourced from 10kHz to 576MHz

•  This test cannot be done directly using a BERT •  Sourcing can be done by creating the PWM patterns by

adding 1’s and 0’s. •  BER cannot be measured using BERT for PWM and this

need to be done by an On Chip Error counter or need to be captured using FPGA and compare. Another option is to loopback to TX and compare using BER counter in oscilloscope.

•  PPM offset cannot be measure in loopback mode because of data rate mismatch.

PWM test and PPM offset


Questions???


Thank You

mipi cadence presentation

Documents

cadence confidential

internal use

phy v1

mipi alliance

dphy serial

mipi overview

date mipi

mipi interfaces stack