mipi devcon 2016: mipi beyond mobile - an industrial computer-on-module case study

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MIPI Beyond Mobile Industrial Computer-on-Module Case Study Nikola Nenadić, pygmyTITAN

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Page 1: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

MIPI Beyond Mobile

Industrial Computer-on-Module Case

Study

Nikola Nenadić, pygmyTITAN

Page 2: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

“Industrial Mobile” Market •  Non-consumer applications of mobile technology •  Potential to disrupt a number of industries • Medical, robotics, instrumentation, retail, logistics &

transportation, emerging markets (VR/AR, IoT, drones) •  People are already doing it…

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www.happymed.com www.mobisante.com www.imageholders.com www.oscium.com

Page 3: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Market Forecasts by 2020

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Page 4: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Benefits of Mobile Technology •  Driven by smartphone form factor •  Low power, small form factor •  Latest ARM processor architectures •  Superior video processing with hardware acceleration •  Integrated signal processing capability •  Integrated radio (cellular, Wi-Fi, BT) •  Advanced power management

•  Pervasive technology (over 2 billion devices) •  Rich mobile software application ecosystem

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Page 5: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

The Most Popular Invention in History

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Telephone

1.6BTelevision1.26B

Page 6: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Mobile Application Space is Huge

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AppleAppStore–2millionapplica?onsasofJune2016

Page 7: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

ARM Landscape is Changing • Mobile ARM market consolidation is in progress •  A number of suppliers left the mobile market recently

(TI, Nvidia, Broadcom, Marvell, Intel)

• Only pure play mobile suppliers stay in the game (Qualcomm, Samsung, MediaTek, HiSilicon)

•  Disproportion: $400B1 mobile vs. $25B2 embedded •  Budgets for innovation in mobile are much bigger •  Reduced supply of high-end ARM platforms for

embedded ! Growing pressure to employ consumer mobile

SoCs in embedded applications

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1)Globalrevenuefromsmartphonesalesin2016,GfK;2)EmbeddedBoardsandIntegratedcomputersystemsmarketsizein2018,VDCResearch,2016

Page 8: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Key Obstacle for Industrial Mobile

•  Pure play mobile suppliers are focused on a small number of high volume customers

•  Embedded systems market is highly fragmented, with thousands of different clients and applications

• Mobile components are short-lived, driven by consumer market dynamics

!  Mobile technology stays inaccessible for embedded developers

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Page 9: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Lesson from the Past – Industrial PC

•  In the early 90’s technology landscape was similar •  There were 18 manufacturers of x86 processors •  IBM PC’s commercial success accelerated

development and consolidated the market •  Latest innovations were becoming cheap •  Pressure to use commercial PC technology

in industrial applications was rising •  1992 – PC/104 Consortium •  2005 – COM Express (PICMG) •  $3.5B1 market today

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1)IMSResearch,2011

Page 10: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Consumer vs. Industrial Applications

Consumer Products:

•  Fast time to market

•  Large volumes •  No customization •  Price pressure •  Short product lifetime

Industrial Devices:

•  Slower adoption rate, regulatory approvals

•  Low and medium volumes •  Tailored solutions •  Relaxed price margins •  Expected longevity

(> 5 years) •  Multi-vendor sourcing

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Page 11: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Mobile Computer-on-Module •  Smartphone electronics packed in a component • Open architecture •  Standardized form factor and pinout ! Solves longevity issue, enables multi-vendor sourcing

• Modular approach – reduced complexity & risk •  Building products on mainstream mobile technology ! Compatibility & continuous access to the latest innovations

•  Standardization of interfaces inside smartphones makes mobile COM possible ! Key role of MIPI Alliance

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Page 12: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Mobile Form Factor

•  Smartphone main boards takes approx. the same area •  High level of integration, small thickness

•  Power consumption: up to 3 W

•  Mobile COMs can be made small and thin, enabling smartphone-like industrial mobile devices

•  Heat dissipation, EMC/EMI, RF shielding

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Page 13: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

How We Did It

•  PCB area: 21.6 cm2

•  Total thickness: 5 mm •  Integrated heat spreader, EMC/EMI and RF shielding

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Page 14: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Mobile COM Module Pinout • Mobile by its nature: based on MIPI interfaces •  No power hungry/legacy industrial PC interfaces

(Ethernet, PCIe, SATA)

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Widely used mobile interfaces: •  MIPI Display Serial Interface

(DSI + LCD control) •  MIPI Camera Serial Interface (CSI + CCI) •  Universal File Storage (UFS + card signals) •  HSIC

Smartphone external interfaces: •  USB 2.0 / USB 3.0 •  HDMI

Integrated radio: •  Cellular •  Wi-Fi •  Bluetooth, NFC

Legacy mobile interfaces: •  SD Card, SDIO

Audio, sensors and control: •  Audio (MIPI SLIMbus/MIPI SoundWire/I2S) •  MIPI I3C, VGI

High-Performance: •  MIPI UniPort-M or M-PCIe?

Embedded Interfaces: •  UART, SPI, I2C, GPIO

Auxiliary Interfaces: •  SIM card, JTAG, boot selection,

power management, system management

Page 15: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Mobile COM System Block Diagram

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Page 16: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Mobile vs. PC COMs

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Feature IndustrialMobile IndustrialPC

CPUarchitecture: dominantlyARM dominantlyx86

Boardsize: 12.5–25cm2 45–90cm2

Powerconsump?on: <3W 6-55W

Integratedradio: " #

Ba]erypowermanag.: " #

So^ware: Android/Linux Windows/Linux

Totalsystemprice: low high

Page 17: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Mechanical and Thermal Considerations •  Connector solution ! Low mating height ! High density ! 250-400 signal pins

• Mobile use cases ! Constrained space inside device ! Power dissipation ! Mechanical robustness ! Low weight

• Maintenance and servicing ! Easy module replacement ! Easy device upgrade

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Anexample–pygmyTITANsolu?on

Page 18: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Mobile COM Ecosystem Challenges

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•  Industrial Mobile ecosystem do not exist today •  The idea is to take components and know-how

directly from consumer mobile •  Ease technology transfer by implementing mobile

standards without any changes •  SoCs, ICs, displays, cameras, sensors,

mechanical components suppliers – should have no extra effort

•  Unified Industrial Mobile software architecture is needed to ensure compatibility and enable re-usage of commercial mobile applications

Page 19: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

The Winner is Clear

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Page 20: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Software and Security •  Android is the winner of platform wars •  Embedded Android variant is needed

for Industrial Mobile to succeed •  Part of AOSP or middleware extension? •  Plug and play functionality, dynamic driver loading

• Mobile and IoT applications – security is key concern! •  Security Architecture should be

integral part of COM platform specification •  Hardware root of trust, secure boot, Trusted Zone

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Page 21: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Conclusions & Recommendations • Open architecture COM module standards facilitate

usage of mobile technology in industrial sector • Mobile is enabling technology for a number of

non-consumer applications with high-growth potential • Mobile industry is positioned well to capture significant

part of the industrial market in the future

•  PICMG led the effort for the Industrial PC • MIPI Alliance should lead it for the Industrial Mobile • Mobile computing module standard,

security architecture, and embedded Android

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Page 22: MIPI DevCon 2016: MIPI Beyond Mobile - An Industrial Computer-on-Module Case Study

Thank you for your time!

Any questions?

Nikola Nenadic Founder & CEO, pygmyTITAN

[email protected]