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Research

The Center for Hierarchical Manufacturing is focused on the discovery, development andplatforming of methodologies and processes that yield well-defined nanostructured

materials and elements essential for the manufacturing of next generation devices toenhance computing and information processing, energy conversion and human health.

The emphasis is on versatile tools and high-rate processes for well-defined nanostructuresthat can be systematically integrated into existing manufacturing flows, an objective that

reuires the bridging of bottom-up techniues to yield sub-!" nm structures with top-

down techniues to yield device elements at larger length scales. These processes arebased on recogni#ed CHM research strengths that comprise core technologies within the

center.

The essential research structure of the CHM consists of three Technical $esearch %roups

&T$%s' and system level test beds in which the (ey scientific barriers to the

manufacturing of device nanostructures using the CHM platform tools are identified,systematically addressed, and resolved. The T$%s provide multi-disciplinary

collaborative structure to enable high-impact fundamental research and new discoveriesthat drive innovation.

Figure 1: Vision and Systems-Level Organization

The CHM)s vision for the development of nanomanufacturing platform technologies and

their applications is presented in *igure +.

Platform Technologies

http://www.umass.edu/chm/images/chm_vision.gif

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The unifying theme of the CHM is an integrated processing platform that spans the new

technologies for nanofabrication and conventional process tools for device fabrication. n

*igure +, the six process areas within T$% + represent core CHM technologies fornanofabrication. The process platforms in blue represent manufacturing technologies into

which the nanofabrication technologies must be integrated. The test beds serve as

practical vehicles to reali#e and demonstrate this integration. eginning from the left,strategic challenges that must be addressed include

Farication of !anostructures "Structure #eneration$% nthe definition of

sub-!" nm device elements, the challenge is to identify techniues that are

reliable, massively-parallel, cost-effective and that provide exceptional controlover the si#e, shape and long range order, and addressability of the nanoscopic

domains. These challenges will be met using /Mass 0mherst strengths in

directed self-assembly of synthetic polymers and organic molecules, nanoimprintlithography, and over the long term bio-directed assembly using 120 constructs.

*or directed assembly the fundamental challenges include eradication of defects,

increasing the strength of segregation to reduce domain si#e, and developinghighly ordered systems from low cost components that can be implemented in

large scale commodity applications. *or nanoimprint lithography, the

fundamental challenges include minimi#ation of feature si#e, creation of function

materials and resists and understanding adhesion and release for defectmanagement. The 120 constructs are a seed effort. The fundamental challenges

include precise registration folded !-1 120 structures on surfaces and non-

destructive functionali#ation of the constructs to yield functional materials.

Functionalization of !anostructures% 3hile the nanostructure discussed above

can serve as substrates or templates, their use in devices reuires their

functionali#ation via incorporation of metal, metal oxide, semiconductor or

biological elements. These challenges will be met usingo !-1 replication techniues in which structure of a self assembled bloc(

copolymer of 24 generated template can be transformed via phase

selective reactions to yield high fidelity replicas in metal oxide materials

o ncorporation of functional additives including semiconductor

nanoparticles and nanorods via cooperative assembly within self-

assembled templates and nanoscale deposition techniues that yieldconformal films within confined geometries.

*or the !-1 replication techniues the fundamental challenges include maintaining order

and template fidelity during the chemistry, developing new template materials by 24

and establishing techniues to pattern multiple length scales simultaneously. *orfunctional additives, the fundamental challenges are tailoring surface chemistry and si#e

such that the additives partition to the desired domain and assist with, rather than

frustrate, self-assembly. *or nanoscale deposition techniues the fundamental challengesinclude scale up and development of new chemistries.

&ntegration 'ith To(-)o'n Processes% High-volume production reuires

integration of the fabrication and functionali#ation of nanostructures with high-

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volume manufacturing. The CHM platform technologies are compatible with 5i

wafer based technologies and with roll-to-roll processing. ntegration is not

purely seuential and in many cases patterns generated at the device scale candirect assemble at the nanoscale6 in some cases pattern generation at multiple

length scales is accomplished simultaneously. ntegration presents several

crosscutting challenges. These include developing materials and systems that selfassemble and anneal on time scales compatible with typical wafer cycle times or

roll-to-roll platforms, establishing addressability of individual domains,

stabili#ing the self-assembled structures for further possessing and establishingproper metrology and uality control, and adapting the fabrication scheme for

process-friendly solvents. The development process includes a first-level analysis

of the environmental, health and safety considerations of the test bed processes. n

addition, tool platforms must be developed for technology transfer. *or siliconwafer platforms, the CHM wor(s with leading industry partners such as 5$C,

M, 2ovellus 5ystems, and 5eagate Technology. *or roll-to-roll processing, the

CHM collaborates with the Center for 0dvanced Microelectronics Manufacturing

7rocessing at inghamton /niversity.