grid.pdf grid.pdf april 2010 · april 2010 visit us at page 4 ieee professional skills courses...
TRANSCRIPT
Ap r i l 2 0 1 0 w w w . e - g r i d . n e t P a g e 1
GRID.pdf GRID.pdf
April 2010
CHAPTER MEETINGS SCV-GOLD - 3/30 | Volunteer Information Evening - Presentations on Engineering Volunteering Opportunities - in education, robotics ... [more]
SPECTRUM - 3/31 | Multiphysics Simulations for Low and High Frequency - Webinar: relevant physical effects, EM fields ... [more]
SCV-TMC - 4/1 | Successful Job Searching in Today's Environment - complete program, a full-time job, keeping focused, energized ... [more]
SCV-Phot - 4/6 | Field Trip to Tour SLAC X-Ray Laser - IEEE Members Only - ultra-short-pulse electrons, hard x-ray laser, billion times brighter ... [more]
SCV-MTT - 4/7 | Antenna Technology for Commercial Satcom - antenna design methodology ... [more]
TheTech - 4/8 | Star Trek - The Exhibition (Engineers' Evening) - no cost, engineer & family, where science meets science fiction ... [more]
SCV-EDS - 4/13 | The Semiconductor Industry's Nanoelectronics Research Initiative (NRI): Motivation and Overview – challenges ... [more]
SCV-CS+CES - 4/13 | Android: A 9,000-foot Overview - open technologies, novel experience, vendor tables ... [more]
SCV-EMC - 4/13 | Demystifying Radio Frequency Fields; Capturing Key Performance Data on RF Power Amplifiers - history, immunity testing ... [more]
SCV-CPMT+Nano - 4/14 | Applications and Self-Packaging of Microscopically Small Electronic Components - self-packaging ... [more]
SCV-ComSoc - 4/14 | Architectures and Applications of Video Surveillance and Video Analytics Systems - three talks ... [more]
OEB-IAS - 4/15 | Energy Savings on Fans and Pumps Using Adjustable Frequency Drives - non-linear loads, flow control, energy savings ... [more]
SCV-SSC - 4/15 | Energy-Efficient Design of Digital Circuits - energy issues, power budget, minimal energy, optimal sizing ... [more]
SCV-CAS - 4/19 | The Smart Grid: A Convergence of IT, Communi-cations and Power & Energy Technologies - control, efficiency ... [more]
SCV-Nano - 4/20 | NanoImprint - Patterning Storage for Tablets/ Netbooks and NanoMedical Applications - resolution, overlay ... [more]
SCV-CNSV - 4/20 | Context Is King: Smartphone Augmented Reality - improved interfaces, better CPUs, mobile broadband, cloud computing ... [more]
SCV-PELS - 4/21 | Switched-Capacitor Converters: Big and Small - DC-DC conversion, wireless sensor circuit, on-die uP power circuit ... [more]
SF-IAS - 4/27 | Tier 4a Interim Emissions Standards - 751HP+ standby engines, installation guide ... [more]
SCV-Mag - 4/29 | Biomagnetics: An Interdisciplinary Field where Magnetics, Biology and Medicine Overlap - brain fields, MRI ... [more]
OEB-Mag - 4/30 | Biomagnetics: An Interdisciplinary Field where Magnetics, Biology and Medicine Overlap - brain fields, MRI ... [more]
SCV-MTT - 5/1 | Short Course: RF and Microwave Design for Future Technologies - full day: key designs, new application targets ... [more]
SCV-RAS - 5/6 | Next-Generation MEMS Inertial Sensors - vehicles, consumer electronics, wafer bonding, packaging ... [more]
May 11 and beyond – Next Page ==
Conference Calendar
April 8-9: Electronic Design Processes Symposium - Monterey Beach Hotel, Monterey [more]
April 16: Northern California Electronic Materials Symposium - Techmart Center, Santa Clara [more]
April 26-29: Embedded Systems Conference - Silicon Valley - San Jose Convention Center [more]
May 18-19: Social Media Strategies Conference - Hyatt Regency Hotel, Santa Clara [more]
May 23-28: IEEE-MTT International Microwave Symposium - Anaheim Convention Center [more]
May 24-25: Netbook Summit - Hyatt Regency Hotel, SF Airport [more]
June 7-9: IEEE Int’l Interconnect Technology Conference - Hyatt Regency Hotel, SF Airport [more]
June 13-18: 47th Design Automation Conference (DAC) - Anaheim Convention Center [more]
CALL FOR PAPERS: Nov 7-10: 44th Annual Asilomar Conf on Signals, Systems, and Computers - Pacific Grove [more] - Submit abstracts by June 1
Support our advertisers
MARKETPLACE – Services page 3 2010 Chapter, Section Officers pages 40-51
Star Trek: The Exhibition [more] Free night for IEEE members, at TheTech in San Jose
Career Development Professional Skills Courses [more] - Collaborative Negotiating - Strategic Thinking for Managers - Clear Business, Technical, and E-Mail Writing - Managing Time and Multiple Priorities - and more
Sustainability in Information Technology [more]- Full-Day Seminar - IEEE member discount
ProtoCase Custom Electronic Enclosures [more] - Custom enclosures - speed and convenience
(removed)
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 2
Your Networking Partner ®
April 2010 • Volume 57 • Number 4
IEEE-SFBAC ©2010
IEEE GRID is the monthly newsmagazine of the San Francisco Bay Area Council of the Institute of Electrical and Electronics Engineers, Inc. As a medium for news for technologists, managers and professors, the editorial objectives of IEEE GRID are to inform readers of newsworthy IEEE activities sponsored by local IEEE units (Chapters, Affinity Groups) taking place in and around the Bay Area; to publicize locally sponsored conferences and seminars; to publish paid advertising for conferences, workshops, symposia and classes coming to the Bay Area; and advertise services provided by local firms and entrepreneurs.
IEEE GRID is published as the GRID Online Edition residing at www.e-GRID.net, in a handy printable GRID.pdf edition at the end of each month, and also as the e-GRID sent by email twice each month to more than 24,000 Bay Area members and other professionals.
Editor: Paul Wesling IEEE GRID PO Box 2110 Cupertino CA 95015-2110 Tel: 408 331-0114 / 510 500-0106 / 415 367-7323 Fax: 408 904-6997 Email: edi tor@e-gr id.net www.e-GRID.net
Do you st i l l belong to one or more of IEEE’s
Societ ies? The IEEE has not iced that only about hal f of i ts members are also members of a Society.
The USA has been cutt ing back on i ts strategic investment in new science, infra-structure development and maintenance -- preferr ing to concentrate on expansion of social programs, better pensions and other matters. The country 's p lan is to "coast" for a few decades on what 's a lready in-place, f i l l ing some potholes to keep traf f ic moving ( f igurat ively speaking), paying Social Secur i ty benef i ts , and planning to de-orbi t the Space Stat ion.
Simi lar ly, some professionals, because of the modest expense, decide to "coast" in their careers by stopping their IEEE memberships and not acquir ing new technical informat ion f rom the wider community (eg, IEEE's Society publ icat ions, conferences, technical committees, network ing interact ions), preferr ing to r ide out the next 10 or 15 years to ret i rement.
Now, this doesn' t apply to everyone (and probably not to you) -- engineers MAY keep learning through other means, such as by at tendance at local chapter technical meet ings, or having access to IEEE's Xplore and i ts 1.7 mi l l ion documents and search resul ts through their company/ inst i tut ion or local l ibrary, and so don' t need to associate wi th any of the technical special t ies (Societ ies) d irect ly. But I s t i l l th ink the inc l inat ion to "coast" is there, when i t comes to deciding where to spend discret ionary t ime and funds.
Want to hear more about "coast ing"? Come to CPMT's SCV Chapter meeting on May 12 (or read the book Winner Take All by Elkus),
- - Paul
NOTE: This PDF version of the IEEE GRID – the GRID.pdf – is a monthly publication and is issued a few days before the first of the month. It is not updated after that. Please refer to the Online edition and Interactive Calendar for the latest information: www.e-GRID.net
DIRECTORS
Santa Clara Valley
Ram Sivaraman
Allen Earman
(Alt: Fred Jones)
Oakland East Bay
Victor Stepanians
Bill DeHope
San Francisco
Michael Butler
Dan Sparks
OFFICERS Chair: Allen Earman
Secretary: Bill DeHope Treasurer: Dan Sparks
IEEE-SFBAC PO Box 2110
Cupertino, CA 95015-2110
IEEE GRIDContinued from previous page …
CHAPTER MEETINGS
SCV-EDS - 5/11 | Directions for Silicon Technology Development as We Approach the End of CMOS Scaling - limits, SOI ... [more]
SCV-CS - 5/11 | Supercomputing at NASA: Current Impact, Future Challenges - modeling, simulation, analysis, application porting ... [more]
SCV-CPMT - 5/12 | Winner Take All: How Competitiveness Shapes the Fate of Nations - industrial base, exports, America losing ... [more]
OEB-Mag - 5/28 | Multiscale Magnetic Models; From Electronic Structure to Device Design - phase transition, ultrafast reversal ... [more]
OEB-Mag - 6/21 | An Investigation of Magnetic Reversal at Almost the Nanoscale - field-induced reversal, vortex, propagation ... [more]
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 3
Patent Agent Jay Chesavage, PE
MSEE Stanford 3833 Middlefield Road, Palo Alto 94303
www.File-EE-Patents.com
TEL: 650-619-5270 FAX: 650-494-3835
Do you provide a service? Would you like more inquiries?
Access 25,000 engineers and managers IEEE Members across the Bay Area Monthly and Annual Rates available
Visit our Marketplace (page 3)
Download Rates and Services information: www.e-grid.net/docs/marketplace-f lyer.pdf
GRID.pdf
e-GRID
Professional Services Marketplace – [email protected] for information
Say you found them in our GRID MARKETPLACE
MET Laboratories
EMC – Product Safety
US & Canada
• Electromagnetic Compatibility • Product Safety Cert. • Environmental Simulation • Full TCB Services • Design Consultations • MIL-STD testing • NEBS (Verizon ITL & FOC) • Telecom • Wireless, RFID (BQTF & EPCglobal Test Lab)
Facilities in Union City and Santa Clara
www.metlabs.com [email protected] 510-489-6300
• 20 Years of Experience • Fortune 500 Companies • Microsoft .Net, C#, C++, Java, … • Software, Firmware, Middleware, Web Applications • SCM, QA, and much more Experience/Expert ise
www.esw.com [email protected] (408) 328-9240
● Customized ADCs, PLLs, I/Os, SerDes ● Analog/Mixed-Signal IC design services
www.mobilitysemi.com Ph: 408-738-5509
2953 Bunker Hill Lane #400, Santa Clara
Channel Partner
Multiphysics, Multidisciplinary Engng CFD, Stress, Heat Transfer, Fracture Fatigue, Creep, Electromagnetics Linear/Nonlinear Finite Element Analyses Multi-objective Design Optimization BGA Reliability
Ozen Engineering (408) 732-4665
[email protected] www.ozeninc.com
IEEE-CNSV Consultants' Network
of Silicon Valley
• Become a member • Find a Consultant • Submit a Project
CaliforniaConsultants.org
• Patent application preparation, prosecution, IP Strategy • Enforcing, Licensing and Monetizing Patents • Broad Experience in many Electrical and Software arts • Our Experts: IEEE Fellow, SPIE Fellow, Technical and Legal Experts
Ph: 408-288-7588 www.StevensLawGroup.com
Email: [email protected]
1754 Technology Dr, #226 San Jose
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 4
IEEE Professional Skills Courses
Strategic Thinking for Managers – Date/Time: Wed, April 21, 9 AM – 5 PM – Location: – TIBCO Software, Palo Alto
Fee: $400 for IEEE Members; $500 non-members
Collaborative Negotiating – Date/Time: Tues, May 4, 9 AM – 5 PM – Location: – TIBCO Software, Palo Alto
Fee: $400 for IEEE Members; $500 non-members
"This was an excellent course for me; the lecture and participation were well balanced.” -Netgear, Inc., Engineering Product Manager
Presentation Skills – Date/Time: Tues, May 11, 9 AM – 5 PM – Location: – Sybase, Dublin
Fee: $500 for IEEE Members; $550 non-members
Managing Managers – Date/Time: Tues-Wed, May 18-19, 9 AM – 5 PM – Location: – TIBCO Software, Palo Alto
Fee: $625 for IEEE Members; $700 non-members
Upgrade your skill set – prepare for future challenges
During Microwave Week, there are 32 Workshops, 3 Short Courses, 98 Oral Sessions, 6 Interactive Forums, 9 Panel Sessions, and 13 Focused and Special Sessions to attend, in addition to the Exhibits. Be here!
Technical Papers Original research, development, and application work on radio-frequency and microwave theory and techniques, in the various areas within this broad discipline.
Sessions - Power-Amplifiers at HF, VHF, UHF, and GHz Signal Processing - Microwave Photonics and Low Noise Receivers - Guiding and Radiating Structures - Metamaterial Structures, Phenomena and Applications - Advanced Millimeter-Wave Packaging - MEMS Switches - Novel Techniques for Planar Filter Design - RF and Microwave in Medicine - Power Amplifier System Concepts - Microwave Photonic Technologies - RFID and power harvesting technologies - High-speed Signal Processing Circuits - Power Amplifier Circuits - Terahertz Electronics - MMIC Packaging - Silicon-based Millimeter-Wave Integrated Circuits - Active Device Modeling - Impact of Nanoelectronics on RF Technology - Advancements in Passive Circuitry - Biological Effects and Medical Applications of RF and Microwave - Non-Planar Passive Filters and Multiplexers … and many more.
Special Sessions Focused, honorary, and panel/rump sessions, dedicated to specific topics to allow an in-depth discussion of those topics.
SCV Chapters, Technology Management & Components, Packaging and Manufacturing Technology Societies
Clear Business, Technical, and E-Mail Writing
– Date/Time: Tues, May 25, 8:30 AM – 4:30 PM – Location: – Informatica, Redwood City
Fee: $425 for IEEE Members; $500 non-members
“Very practical and can use all lessons immediately in real life.” -Cisco, Manager
Managing Time & Multiple Priorities – Date/Time: Friday, June 11, 9:00AM-1:00PM – Instructor: Peter Turla – Location: Synopsys, Sunnyvale – Fee: $300 for IEEE Members; $350 non-members
"I enjoyed this class very much. I thought it was very informative and useful. It really made me more aware
of how I can organize my time."
For complete course information, schedule, and registration form, see our website:
www.EffectiveTraining.com
May 23-28, 2010 Anaheim Convention Center Exhibition dates: May 25-27
Workshops From expert-level seminars to tutorials and short courses, aimed at various levels of expertise and interest. Topics include: - Software Defined Radio - Ultra-Wideband (UWB) Technology - High Speed Signal Integrity - MOSFET Modeling for RFIC Design - Power Management for Integrated RF Circuits - RF Packaging Solutions - Microwave Filter Synthesis - Making Reliable Measurements - RF MEMS For Antennas and Front Ends - Low Phase Noise Oscillators - The Expanding Role of GaN - Wireless Power Transmission - Optical Modulator Technologies… and many more.
Applications Seminars MicroApps, presented by industry speakers who will introduce recent developments in products and processes employed in fabrication, instrumentation, computer-aided design, and field deployment of technologies at the cutting edge.
Earlybird Rates thru May 7 – Members save $200
For more information, and to register:
www.ims2010.org
INTERNATIONAL
MICROWAVE SYMPOSIUM
Sponsored by IEEE MTT
2010
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 5
Keep up-to-date on electrotechnology in the SF Bay Area – Join the email Distribution List for the IEEE’s e-GRID today!
www.e-grid.net/subscribe
News of upcoming meetings and conferences, delivered twice a month to your INBOX.
For an RSS feed of upcoming meetings/events, visit:
www.e-grid.net/rss
Choose from 10 different categories!
An Evening for Engineers You are invited to a Special Evening for IEEE, ASME and SVEC members (and families) only!
Members of any professional society belonging to SVEC (www.svec.org) qualify for this showing.
Thursday, April 8th from 5:30pm - 8:00pm (last admission: 7:00 PM)
Complimentary admission for Engineers and their families Limited Tickets (300) available – ALL HAVE BEEN TAKEN (3/30) Use special promotion code IEEE to register
– print out confirmation and bring it with you.
We apologize in advance if all tickets are reserved when you access the site.
Can’t make the Thursday evening event? Purchase tickets for other times at our discount: $18 (adults), $15 (children 3-17 years) Log in at this site: tickets.thetech.org/account (code “IEEE”)
STAR TREK®:THE EXHIBITION, Where Science Meets Science Fiction
You will be able to connect with iconic Star Trek moments and characters and celebrate the creative spirit of science fiction that gave rise to many of today's modern marvels. This exhibition will be spread across more
than 15,000-square-feet and features all five television series and eleven films that span over 40 years.
STAR TREK: THE EXHIBITION features over 200 artifacts:
An authentic replica of the bridge from the U.S.S Enterprise NCC-1701 as featured in the original Star Trek television series
The trifecta of the Star Trek universe: a tricorder; a phaser, and a communicator - from the original series A chance to ride through a Star Trek adventure in a full-motion flight simulator (extra fee) The actual shooting model for the Borg Cube, that impending vision of doom as seen on Star Trek:The
Next Generation, Voyager, and in the movie Star Trek: First Contact
Free Admission does not include IMAX and simulators.
For more information about the exhibition call 408-294-TECH
Or visit www.thetech.org or www.startrekexhibition.com
Underwritten by the SF Bay Area Council, IEEE
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 6
Social Media is the new enabler for business. It is becoming the touch point connecting all components of a business -- our customers, partners, suppliers and employees. Businesses of all types and sizes are leveraging social media for strategic and tactical initiatives. Attend, Learn, Plan.
Top Presentations: - Leveraging Social Media for Business - Tapping into the Power of Employees - Social Media Marketing - True Drivers of a Successful Strategy Best and Worst of Social Media Practices - Overcoming Objections - Branding, Reputation Management & Legal Issues - Thinking Vertically Across Social Media - - Tools For Social Media Marketing ... and more.
Who Should Attend: • Chief Marketing Officers • Social Media Strategists • Social Media Marketers & Online Advertisers • Online Community Managers • Interactive Agency Professionals • Search Engine Optimization Specialists • Web Marketers • e-Commerce Managers • Web Analytics Professionals • Corporate Communications & PR • Recruiting Professionals IEEE Electron Devices Society
The thirteenth annual IITC is sponsored by the IEEE Electron Devices Society as a premier conference for interconnect technology. IITC provides a forum for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exciting new science and technology. Sessions: - System Scaling - Systems and Interconnects - Process Integration - Materials And Unit Process - Back-End Memory & MEMS - Packaging, 3D & TSV - Reliability and Characterization - Novel Materials and Concepts - Plus poster sessions New Focus: Interconnect to Interconnections and Interfaces (for "More Moore" and "More than Moore" technologies)
-- Workshops: - How to Market your Business on Facebook
How you market your Facebook Fan Page to increase revenue, drive website visitors and create
brand awareness through customer engagement - How to Market on Twitter and YouTube
What You Will Learn: • How to create an effective Social Media strategy • How to measure the effectiveness of your social media strategy • Best practices to track, analyze, and improve your social media
marketing campaigns Optimization techniques to increase usage and engagement of
social media tools and applications • Trends and future direction of social media and how you can
best position your business to benefit.
Use coupon code "ieee2010" for $100 discount
For information and to register, visit
www.e-grid.net/conf/sms.html Short Course (Sunday, June 6) Topics: - Future Interconnects: Options, Challenges and Advances - Advanced Patterning Techniques for Interconnect Scaling - Plasma Process Challenges for Porous SiOCH Patterning - The Impact of Interconnect on Processor Architecture - Storage-Class Memory - Modeling Variation Register for the full conference, or only the Short Course:
www.his.com/~iitc IITC invites companies to exhibit products, materials and analytical tools related to interconnect technology. Suppliers are also invited to participate in Supplier Seminars which will be offered in the evenings on June 8 and 9. Contact [email protected]
IEEE 2010 International Interconnect Technology Conference June 7-9, 2010 Hyatt Regency SF Airport Hotel, Burlingame
Leveraging Social Media to achieve your business goals
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 7
The Netbook Summit provides attendees
with pract ical information on the role of netbooks, using netbooks effect ively, developing software for netbooks, netbooks in education, making netbooks perform better, and expanding netbooks. Netbooks are small , thin, l ightweight and energy eff ic ient portable computers that have experienced explosive growth among consumers, students, and even business users looking for an easy to use, mobi le, and cost effect ive alternative to a ful l s ize notebook computer.. Netbooks/tablets are optimized to accommodate the user with a longer battery l i fe, and are l ightweight and less intrusive than a larger laptop. Convenience and cost are key factors for these products, making them ideal for students at any level as wel l as professionals in a variety of market segments that are continual ly on the go. Chal lenges facing netbooks: extending battery l i fe, improving graphics, simpl i fy ing loading of software, improving performance, providing software better-suited to the environment, and typical appl ications.
Join industry leaders from: Adobe, ARM, Asus, AT&T, Broadcom, CA, Dell, McAfee, Microsoft, Mozy, NVIDIA, Phoenix, Samsung, Skype, and Toshiba, as well as startups and new entries.
“The netbook has become one of the most popular
consumer devices in the market today, but its true potential has been limited by applications that are not optimized for its mobility and smaller screen size.” – Renee James, VP, Intel, September 2009
Sponsored by Dell, AMD, Toshiba and LAPTOP Magazine
Join the Revolution in Low-Cost Mobile Computing
Half-DayTutorials to bring you up to date on the latest developments - Nebooks in the Enterprise - Improving Netbook Performance - Networking Netbooks - Netbook Securi ty
Sessions - New Paradigms in Networks - Doing More with Netbooks - Netbooks in Education - Operating System Shootout (Windows, Linux, Android, Chrome, etc.) - Storage/Backup for Netbooks - Applicat ions - Netbooks: The New Hub of Distr ibuted Computing - Processor Shootout (Atom, ARM, others) - Market Research
Panel: Netbook Report Card What Has Hap-pened in the Past Year; Where We Are Heading
Keynotes by NVIDIA, AMD, Dell , and Asus
Unique “Ask the Experts” session for one-on-one interaction
Shootouts on Processors, Operating Systems, Platforms
All Industry Reception ( in Exhibi t Hal l)
Evening Open: - Beer, Pizza and Chat with the Experts - Kishore Jotwani, Atheros Communications; - Sasch Pallenberg, Netbook News; - Rob Halligan, Syncables; - Walker Blount, Web-Feet Research; - Don Ryan, CMB; - Mary Lasica and Linda Uhrenholt , AT&T; - Bob Morris , ARM; - Simon Hunt, McAfee
Free pass for Exhibits and Open Sessions
Discounts are available to qualified educators and government employees
Save $300 through May 19t h
www.netbooksummit.com
Special exhibitor packages st i l l available: contact Kat Pate, 505.238.3208, or
email [email protected]
9 egaP ten.dirg-e.www 0102 lirpA
April 16, 2010 -- 8:00 AM – 5:00 PM Techmart Network Meeting Center, Santa Clara
The Electronic Materials Symposium is an inter-disciplinary conference that presents a broad spectrum of expert views on problems at the intersection of electronic materials and devices. It informs participants about challenges that excite today's materials scientists through a series of invited talks by experts in their respective fields. The program features presentations on advanced electronic materials processing techniques and devices, and analytical techniques by outstanding speakers who have made significant contributions to their respective fields.
Confirmed speakers: • Prof. Alexis Bell, UC-Berkeley, "Artificial Photosynthesis" • Dr. Joerg Jinschek, FEI "Aberration Corrected TEM" • Prof. Steven Quake, Stanford, "Bio-LSI & Microfluids" • Dr. Tom Albrecht, Hitachi Research, "Nano-Patterned
Media"• Dr. Markus Beck, First Solar, Inc.,"Photovoltaics" • Prof. Roger Falcone, U. C. Berkeley/LBNL "ALS and
Warm Dense Matter"
Lunch Speaker: • Dr. Lewis Terman, IBM & past IEEE President, "IEEE’s
125th Anniversary/CCD Physics Prize"
Registration fees:
General: $100 (after April 3rd - $110) Students: $50 (after April 3rd - $55) Retired: $90 (after April 3rd - $100)
For more information, and to register:
www.mse.berkeley.edu/~jwu/ems
You are invited to exhibit and/or recruit. Bring displays and product information on process materials, equipment, or analytical instruments/services. Recruiters bring displays and job descriptions to match their needs with Silicon Valley talent. For information: Ning Cheng, [email protected].
Co-sponsored by TMS and the IEEE Electron Devices Society, SCV Chapter
38th Annual Northern California ElectronicMaterials Symposium
CALL FOR PAPERS 44th Annual Asilomar Conference on Signals, Systems, and Computers
Asilomar Hotel and Conference Grounds Pacific Grove, California
November 7-10, 2010 www.asilomarssc.org
Authors are invited to submit papers before June 1st, 2010, in the following areas:
Submissions should include a 50 to 100 word abstract and an extended summary (500 to 1000 words, plus figures). Submissions must include the title of the paper, each author's name and affiliation, and the technical area(s) in which the paper falls with number(s) from the above list. Check the conference website (www.asilomarssc.org) for specific information on the electronic submission process. Submissions will be accepted starting February 1, 2010. No more than FOUR submissions are allowed per contributor, as author or co-author. All submissions must be received by June 1st, 2010. Notifications of acceptance will be mailed by mid August 2010, and author information will be available on the conference website by late August 2010. Full papers will be due shortly after the conference and published in early 2011. All technical questions should be directed to the Technical Program Chair, Dr. Miloš Doroslovački, e-mail [email protected], or the General Chair, Dr. Linda DeBrunner, e-mail [email protected].
CONFERENCE COMMITTEE
General Chair: Linda DeBrunner, Florida State University Technical Program Chair: Miloš Doroslovački, The George Washington University Conference Coordinator: Monique P. Fargues, Naval Postgraduate School Publication Chair: Michael Matthews, ATK Mission Research Publicity Chair: Murali Tummala, Naval Postgraduate School Finance Chair: Frank Kragh, Naval Postgraduate School
The site for the 2010 Conference is at the Asilomar Conference Grounds, in Pacific Grove, CA. The grounds border the Pacific Ocean and are close to Monterey, Carmel, and the scenic Seventeen Mile Drive in Pebble Beach.
The Conference is organized in cooperation with the Naval Postgraduate School, Monterey, CA, and ATK Mission Research, Monterey, CA. The IEEE Signal Processing Society is a technical co-sponsor of the conference.
9. Compressive Sensing, 10. Information Theoretic Signal Processing, 11. Spectral Analysis F. Biomedical Signal and Image Processing: 1. Medical Image Analysis, 2. Imaging Modalities, 3. Advances in Medical Imaging, 4. Biomedical Signal Processing, 5. Biomedical Applications, 6. Bioinformatics, 7. Image Registration and Multi-modal Imaging, 8. Image Reconstruction, 9. Computer Aided Diagnosis, 10. Functional Imaging, 11. Visualization G. Architecture and Implementation: 1. Programmable and Reconfigurable Architectures, 2. SOC Architectures, 3. Low-power Methods, 4. Compilers and Tools, 5. Integrated Algorithm and Architecture Implementation, 6. Computer Arithmetic, 7. Numerical Processing H. Speech, Image and Video Processing: 1. Speech Processing, 2. Speech Coding, 3. Speech Recognition, 4. Narrowband / Wideband Speech and Audio Coding, 5. Document Processing, 6. Models for Signal and Image Processing, 7. Image and Video Coding, 8. Image and Video Segmentation, 9. Image and Video Analysis, 10. Image / Video Security, Retrieval and Watermarking, 11. Image and Video Enhancement / Filtering, 12. Biometrics and Security, 13. Wavelets
A. Communications Systems: 1. Error Control Coding, 2. CDMA, 3. Modulation and Detection, 4. Performance Bounds, 5. Synchronization, 6. Ultra Wideband, 7. OFDM / Multicarrier, 8. Wireless Communications, 9. Optical Communications, 10. Cognitive SDR, 11. Adaptive Waveform Design B. MIMO Communications and Signal Processing: 1. Space-Time Coding and Decoding, 2. Channel Estimation and Equalization, 3. Multi-User and Multi-Access Methods, 4. Cooperative Diversity. C. Networks: 1. Transmission Techniques for Ad Hoc Networks, 2. Wireless Sensor Networks, 3. Network Information Theory, 4. Optical Networks D. Adaptive Systems and Processing: 1. Adaptive Filtering, 2. Fast Algorithms for Adaptive Filtering, 3. Frequency-Domain and Subband Adaptive Filtering, 4. Adaptive Blind Processing E. Array Processing and Statistical Signal Processing: 1. Array Processing and Beamforming, 2. Sonar and Acoustical Array Processing, 3. Radar Array Processing, 4. Remote Sensing, 5. Signal Separation, 6. Estimation and Detection, 7. Non-Gaussian and Nonlinear Methods, 8. Identification,
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 10
If you can only attend one event this year, the ESC Silicon Valley is the must-attend event for embedded systems engineers. ESC is the largest gathering of 250+ exhibitors showcasing the latest embedded technologies available today.
Embeddy Awards Access to Live Product Teardowns Exhibits (Tuesday, Wednesday, Thursday)
Customize your educational experiences by selecting from over 250 sessions in 22 tracks specific to your interests.
Tracks: ● Build Your Own Embedded System ● Green Engineering ● Aerospace and Military ● Real-Time Development ● Designing with Open-Source Software ● Developing for Windows Embedded ● SW Debugging Techniques ● Internet/Telecom ● Medical (and more)
The 5th annual Multicore Expo will be co-located with ESC Silicon Valley and will provide 3 days of dedicated multicore technology training options and multicore-related exhibits.
Technical Tracks Headliners Multicore Expo Pavilion Tracks: ● Multicore Architectures and Processors ● Multicore Development and Design Tools ● System-Level Multicore Implementations ● Hypervisors and Operating Environments
San Jose McEnery Convention Center
Keynote Speakers Dr. Michio Kaku, Theoretical Physicist & Science
Popularizer Richard Templeton, Chairman, President, CTO,
Texas Instruments Jason Wolf, Vice President, Better Place
Flexible Registration Packages • 1-day, 3-day, or the 4-day All-Access Pass value • Free Exhibits Pass (with Keynote and sponsored sessions) • Choose exactly what suits your needs and schedule • Group rates – bring your team (save up to 25%)
For more information:
www.embedded.com/esc/sv
EMBEDDED SYSTEMS CONFERENCE
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 11
DAC is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. The DAC technical program is made up of tutorials, workshops, Pavilion panels and dozens of technical sessions divided into 12 Topical Areas, plus keynotes, panels, and over 200 exhibits.
See the listing of Keynote Speakers, Workshops, highlights ofTracks and
Sessions , etc, in the next GRID.
Workshops and Colocated Events:
• International Workshop on Diagnostic Services in Network-on-Chips
• NASA/ESA Conference on Adaptive Hardware and Systems
• Workshop on Mobile and Cloud Computing
• Workshop on Synergies between Design Automation and Smart Grid
• Workshop on Bio-Design Automation
• Workshop on System-Level Interconnect Prediction
• 4th IEEE International Workshop on DFM&Y
• High-Level Design, Validation and Test Workshop
• Symposium on Hardware-Oriented Security and Trust
• Workshop on Logic and Synthesis
• Symposium on Application-Specific Processors
• Symposium on Nanoscale Architectures
Sponsors
Over 50 research paper sessions arranged
in six parallel tracks User Track, with papers and posters on
tool use and methodologies Pavilion panels DAC User Track: With its focus on significant contributions from the EDA tool user community, this track shares challenges and benefits of tool usage and provides educational and networking benefits for end users as well as tool developers. The User Track differs from vendor-specific user forums in that it is not tied to a specific EDA vendor. Presentations highlight the challenges and benefits of EDA tool usage, including tools from EDA vendors, tools developed in-house, and combinations.
Exhibits: Exhibitors, you should know that DAC is a great showcase for your products. It's the one place you have to be. Attendees comprise thousands of highly qualified decision-makers from leading semiconductor, telecom, and consumer electronics companies and related organizations, including: * Design Engineers * Corporate and Engineering Management * Developers and Researchers * Financial and Industry analysts * Media Professionals
Substantial discount for IEEE and ACM members, students
Access the Advance Program on the website beginning on April 9th:
www.DAC.com
47th Design Automation ConferenceAnaheim Convention Center June 13-18, 2010
Where The Electronic Design Community Meets…
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 12
Volunteer Information Evening - Presentations on Engineering
Volunteering Opportunities
5 Speakers: robotics, educational outreach, science
fairs, mentoring, other volunteering Time: Pizza and drinks at 6:30 PM, Talks and
interaction from 7:00 - 8:30 PM Cost: none Place: Qualcomm, 3165 Kifer Road, Santa Clara RSVP: not required Web: www.e-grid.net/docs/1003-scv-gold.pdf
If you've always wanted to get involved in
professional engineering volunteering activities but did not known how, this is the event for you. GOLD hosts a night of presentations/demos on opportunities relevant to younger members / Graduates Of the Last Decade.
5-10 featured organizations will cover opportunities
in: Ram Sivaraman - "Leveraging volunteering for your
Engineering Career" or "How to select the right volunteering opportunity for YOU"
Charlie Neuhauser: - Science Fairs (Synopsys & Intel)
Lee Colby - K-12 outreach activities (e.g. Project Solar) demonstration of hybrid fuel-cell car he uses as a hands-on project in classrooms
Jonathan David - BotBall. Call for volunteers. Bring a robot and have fun.
Information about FirstRobotics
Hillary Aitken Fernandes - BUILD (mentoring school kids)
Brian Cook - RAFT (Resource Area For Teachers) - donation and science kit center for educators - volunteers needed for sorting donations etc.
Lynn Guest - SVEC Discover-“E” Program - volunteers to make presentations to high school classes between February and May
Stephen McInerney - URL to wiki and brief calendar of 2010 events
We will have handouts and further contact details on how to get involved with each of these organizations. Free. Non-IEEE members very welcome.
TUESDAY March 30, 2010SCV Grads of the Last Decade (GOLD)
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 13
Successful Job Searching in Today's Environment
Speaker: Mahmood Khan, President, G-ESI Time: Guided Networking at 6:30 PM, Light
dinner at 7:15 PM, Presentation at 7:45 PM Cost: $10 (IEEE member), $13 (non member),
cash or check at the door Place: Ramada Inn, 1217 Wildwood Ave,
Sunnyvale RSVP: Through the website Web: www.ieee-scv-tmc.org
Mahmood Khan, MBA, PMP, is president of G-ESI, an IT consulting and Program/Project implementation services corporation. He is an entrepreneur, a coach and a public speaker on the subject of job search. During the past eighteen years Mahmood has been in the roles of Program/Project Director and a Principal Consultant managing large programs/projects at Hewlett Packard, IBM GS, and a Bay Area start-up. He has been involved in community development for the past 9 years as a board member of the San Jose Conservation Corp. and Charter school and a member of the Advisory Committee at Foothill-DeAnza College.
To be prepared for a job in this new economy with lack of jobs and many excellent resources, and to perform a successful job search, you need more than Resumes and Cover Letters. You need a complete program, “a full-time job”, to keep you focused and energized. A quick “acid test” below will reveal if you are doing the right things. Q1. Do you have your job search collateral ready
(elevator speech, professional objectives, brand, target industry and employers, resumes, cover letters, campaign plan)?
Q2. Do you have your job search plan, and are you executing your job search campaign?
Q4. Have you created your Career Roadmap and are in the execution phase?
Q5. Have you identified your best values for the employers – the ones that make you stand out from the crowd?
If you answered no to any of the above, here is a five step program – a 30 Day Job Search-Creation Program – to get you on the right track.
#1 - Job Search Preparation: 1. Self Assessment and Discovery 2. Define your A-B-C jobs descriptions 3. Discover companies with target A-B-C jobs 4. Analyze the A-B-C Job descriptions - exhaustive
analysis to prepare resume, cover letter and your job application submission
5. Search insiders and target companies 6. Prepare for phone screening, interviews, Q&A 7. Practice Interviewing – video interviewing (if
possible) 8. Post-interview follow-up, planning and “keeping
it warm” techniques 9. Negotiation with BATNA (Best Alternative To
Negotiated Agreement) 10. Settling into your New Job 11. Bullet-proofing your career future – continuous
improvement roadmap and building 12. Techniques for building your network and brand 13. Many others ... too many to list here
#2 - Job Search Plan 1. Personalized Job Search Program 2. Technology-based plan (XLS, MS Project,
SharePoint) 3. Status and reporting
#3 One-on-one coaching and mentoring:
(continued, next page)
THURSDAY April 1, 2010
SCV Technology Management
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 14
1. Discovery 2. Preparation of personalized Job Search Plan 3. Execution 4 .Interview prep 5 .Creating BATNA 6 .Monitoring 7. Reviews throughout the job search program
#4 - Daily “Drop-In” 1. Ad hoc help to execute the job search program 2. Search for hidden jobs 3. Use of LinkedIn 4. Other job search aids 5. Interviewing techniques 6. Mock Interviews 7. Many others
#5 – Hands-On Skills Honing/Training • Skills training for the current marketplace, e.g.
Microsoft Windows 7, Office Suite, Project, Project Server, SharePoint, IT infrastructure installation and network setup, Web portal technologies, Databases, Programming tools and SDLC techniques, and many more.
• Small setting/groups, with hands-on projects to maximize skills transfer.
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 15
Field Trip to Tour SLAC X-Ray Laser – IEEE Members Only
Tour Leader and Speaker: Dr. John Arthur,
SLAC Time: Networking/light dinner at 6:00 PM,
Presentation and tours at 7:00 PM Cost: $11.54 Place: SLAC (Check-in at SLAC guard gate), 2575
Sand Hill Rd, Menlo Park RSVP: First 30 registrants before April 1st (no
walk-in's) Web: www.ewh.ieee.org/r6/scv/leos
John Arthur received his PhD from MIT, studying neutron interferometry. He has been at SLAC since 1986, spending most of his time exploring new techniques for studying materials with x-rays. He was intrigued by a proposal presented at a conference in 1992 that described how the SLAC linac could drive an x-ray laser. He helped organize a number of workshops which developed the basis for the scientific case for the project that became LCLS, and led the team that designed the LCLS x-ray beamline. He now serves as head of the LCLS X-ray Operations Department.
The Linac Coherent Light Source (LCLS) began operation in 2009 as the world's first hard x-ray free-electron laser facility. Driven by high-energy, ultra-short pulses of electrons prepared by the venerable linear accelerator at the Stanford Linear Accelerator Center (SLAC) in Menlo Park, LCLS is more than a billion times brighter than any other x-ray source. Its sub-picosecond x-ray pulses will be used to study the ultra-fast dynamics of nanoscale and atomic-scale systems. LCLS has already surpassed its design goals, and is poised to take a place as one of the premier scientific facilities in the country.
Since the spaces are limited, this event is for IEEE members only. The registration is limited to the first 30 sign-ups and will be cut off at the end of the day on April 1. NO WALK-INS.
TUESDAY April 6, 2010
SCV Photonics
Patent Agent Jay Chesavage, PE
MSEE Stanford 3833 Middlefield Road, Palo Alto 94303
www.File-EE-Patents.com
TEL: 650-619-5270 FAX: 650-494-3835
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 16
Antenna Technology for Commercial Satcom
Speaker: Michael Thorburn, Space Systems/Loral Time: Networking and refreshments at 6:00 PM,
Presentation at 6:30 PM Cost: none Place: Agilent Technologies, Main Building,
Aristotle Room, 5301 Stevens Creek Blvd, Santa Clara
RSVP: not required Web: www.mtt-scv.org
Dr. Michael Thorburn is Director of Engineering in the Antenna Subsystem Operation at Space Systems/Loral. Prior to accepting this role 20 months ago, he was Manager of the Communications Payload Systems Engineering Department. He is a Senior Member of the IEEE and a Senior Member of the AIAA.
A variety of topics in antenna technology and
antenna design methodology will be presented to give the audience an overview of this exciting field.
WEDNESDAY April 7, 2010
SCV Microwave Theory and Techniques, with Antennas and Propagation
Channel Partner
Multiphysics, Multidisciplinary Engng CFD, Stress, Heat Transfer, Fracture Fatigue, Creep, Electromagnetics Linear/Nonlinear Finite Element Analyses Multi-objective Design Optimization BGA Reliability
Ozen Engineering (408) 732-4665
[email protected] www.ozeninc.com
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 17
The Semiconductor Industry's Nanoelectronics Research
Initiative (NRI): Motivation and Overview
Speaker: Jeff Welser, IBM / Executive Director of NRI Time: Pizza and Salad at 6:00 PM; Presentation
at 6:15 PM Cost: none Place: National Semiconductor Building E
Auditorium, 2900 Semiconductor Drive, Santa Clara
RSVP: not required Web: www.ewh.ieee.org/r6/scv/eds
Jeff Welser received his PhD in Electrical
Engineering from Stanford University in 1995, and joined IBM's Research Division at the IBM Thomas J. Watson Research Center, Yorktown Heights, New York. His graduate work was focused on utilizing strained-Si and SiGe materials for FET devices. Since joining IBM, Jeff has worked on a variety of novel devices, including nano-crystal and quantum-dot memories, vertical-FET DRAM, and Si-based optical detectors. He eventually took over managing the Novel Silicon Device group at the IBM T.J. Watson Research Center. He was also working at the time as an adjunct professor at Columbia University, teaching semiconductor device physics.
He has held a variety of management positions in IBM research, as well as in IBM's SOI technology development organizations. In 2000, Dr. Welser took an assignment in Technology group headquarters, and then joined the Microelectronics division in 2001 as project manager for the high-performance CMOS device design groups. After later being named Director of high-performance SOI and BEOL technology development, he continued to work as the IBM Management Committee Member for the Sony, Toshiba and AMD development alliances. Dr. Welser returned to the Research division as the Director of Next Generation Technology Components where he worked on the Next Generation Computing project, looking at technology, hardware and software components for systems in the 2008-2012 timeframe.
Since mid-2006, Dr. Welser has been on assignment from the IBM Corporation to the Semiconductor Research Corporation (SRC), where he serves as the Director of the Nanoelectronics Research Initiative (NRI), and is based at the IBM Almaden Research Center in San Jose.
In this talk, the scaling challenges facing current
CMOS technology will be discussed, along with the ultimate limits for charge-switching based semiconductor devices. From this motivation, the current status of the SRC Nanoelectronics Research Initiative (NRI) program will be discussed, with an overview of the current research topics being investigated at the various SRC NRI university research centers.
For over 35 years, the ability to achieve increased performance per dollar in microprocessor chips by scaling the dimensions of the field-effect transistor (FET) in Complimentary Metal Oxide Semiconductor (CMOS) technology has been the driving engine behind the global semiconductor industry.
However, in recent generations, exponentially increasing power density due to leakage currents as well as active switching energy of these nanoscale transistors is limiting our ability to reap the historical benefits of continued scaling. We are now forced to trade-off performance and density for reduced power consumption, and hence the fundamental physics of the CMOS transistor operation, rather than fabrication capability, will eventually be the ultimate limit for future device scaling.
As the ultimate limits to the scaling of CMOS technology are getting closer, completely new approaches in emerging areas in electronics at the nanoscale level need to be explored. Recognizing this critical challenge, the SRC Nanoelectronics Research Initiative (NRI) was chartered in 2005 by a consortium of Semiconductor Industry Association (SIA) member companies to develop and administer a university-based program to address this issue.
The SRC NRI Mission is to demonstrate novel computing devices capable of replacing the CMOS FET as a logic switch in the 2020 time frame.
TUESDAY April 13, 2010
SCV Electron Devices
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 18
Android: A 9,000-foot Overview
Speakers: Mike Demler, Senior Strategic Analyst,
DIGDIA; and Marko Gargenta, Marakana Time: Pizza/sodas and networking with
sponsoring vendors at 6:00 PM; Presentations at 7:00 PM
Cost: none Place: Microsoft Research, 1288 Pear Ave.,
Mountain View RSVP: Required; from website Web: ewh.ieee.org/r6/scv/computer
Mike Demler has more than thirty years of experience in hi-tech industries spanning semiconductors, software, digital media and wireless technology. Along with an MBA from San Jose State University, he earned his MSEE at Southern Methodist University, and a BSEE degree from the State University of New York at Buffalo.
Mike's current role is Senior Strategic Analyst with DIGDIA. Mike focuses on the impact of disruptive technologies throughout the wireless industry ecosystem. His recently published reports include “The Emerging 4G Wireless Landscape in the U.S.” and “The Android Invasion: New Devices & Technology”.
His career began as an IC designer with Texas Instruments, followed by the GE Corporate R&D Labs, Datel and Micro Networks - where he authored the book “High Speed Analog to Digital Conversion”. He then moved on to the EDA industry, where he has held business development, strategic and product marketing positions at Synopsys, Nassda, Cadence, and Antrim Design Systems. Mike is also an inventor with eight U.S. patents.
Android is based on Linux, but quite different. You
write Java, but don't run Java. Learn how Android packs some of the most successful open technologies in a novel way to create the best possible user experience. This talk will give you a high-level understanding of the entire Android stack and its main building blocks. You will know what it takes to build an Android app and how it all works.
Mike Demler will give a 15 minute overview of the Android ecosystem. Then Marko Gargenta will give a 45 minute technical talk.
Marko Gargenta founded Marakana back in 2001
to help underprivileged youth, minorities, and inner-city kids learn web technologies and get ahead in life. So Marakana emerged with the goal of helping people get better at what they do professionally, focused on open-source software training.
Marko is the developer of the Marakana Android Training series. He has taught Android for companies such as Sony-Ericsson, Qualcomm, Ericsson Canada, and many others. Marko is a co-founder of the San Francisco Android Users Group and regularly teaches Android Bootcamp at Marakana.
In 2006 Marko Gargenta published "PHP and MySQL By Example", a collection on PHP examples. The book was published by Prentice Hall, the world's largest technology publisher, and has also been translated to Spanish.
Marko Gargenta obtained his Bachelor of Mathematics Degree from University of Waterloo (Canada's MIT) and has been developing in Java since 1996. He lives in San Francisco.
TUESDAY April 13, 2010
SCV Computer, with Consumer Electronics
• 20 Years of Experience • Fortune 500 Companies • Microsoft .Net, C#, C++, Java, … • Software, Firmware, Middleware, Web Applications • SCM, QA, and much more Experience/Expert ise
www.esw.com [email protected] (408) 328-9240
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 19
Demystifying Radio Frequency Fields and Radio Frequency
Components; Aiding the 17025 Laboratory Accreditation Process
by Capturing Key Performance Data on RF Power Amplifiers
Speaker: Tom Mullineaux, MILMEGA Limited Time: Networking and light dinner at 5:30 PM;
Presentation at 6:30 PM Cost: fee for dinner; free drinks/snacks Place: Applied Materials Bowers Cafeteria, 3090
Bowers Ave., Santa Clara RSVP: not required Web: www.ewh.ieee.org/r6/scv/emc
Tom Mullineaux is an RF engineer with experience in leading RF design teams in the design and development of high-power microwave amplifiers for use in defense and commercial applications. Tom received his degree in electrical and electronic engineering from Portsmouth University, England in 1989. He has delivered both practical and theoretical presentations to IEEE EMC Society sponsored events including 'Linearization of an RF Amplifier for Immunity Testing' at the 2004 Santa Clara EMC Symposium, and has had many technical articles published, including 'Rating Power Amplifiers for RF Immunity Testing' for Evaluation Engineering Magazine , 2003; 'Selecting antenna/power amplifier combinations for the coming new RF immunity standards' for Interference Technology Magazine 2004; 'Using radar amplifiers for automotive RF immunity tests' for Evaluation Engineering Magazine, 2005.
First talk:
This presentation looks at the situation that great 18th and 19th century masters faced along the uncharted road from static electricity to the prediction and discovery of RF fields. The story picks up with Benjamin Franklin's contribution to static electricity and then describes the 'great race' that followed the accidental discovery that an electric current deflects a compass needle. The talk is rounded off with an explanation of the working of common RF components.
2nd Talk: RF immunity standards do not require periodic
calibration of the RF amplifiers used in RF immunity testing. This is justified from a strictly technical point of view, yet creates the situation where there is no data on file for the most expensive piece of equipment in the test set-up. This presentation goes through the key amplifier performance metrics, and introduces a simple/swift method of capturing key data that can be held on file as 'trend-analysis' data.
TUESDAY April 13, 2010
SCV Electromagnetic Compatibility
MET Laboratories
EMC – Product Safety
US & Canada
• Electromagnetic Compatibility • Product Safety Cert. • Environmental Simulation • Full TCB Services • Design Consultations • MIL-STD testing • NEBS (Verizon ITL & FOC) • Telecom • Wireless, RFID (BQTF & EPCglobal Test Lab)
Facilities in Union City and Santa Clara
www.metlabs.com [email protected] 510-489-6300
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 20
Applications and Self-Packaging
of Microscopically Small Electronic Components
Speaker: Babak A. Parviz, Assoc. Professor of
Innovation & Assoc. Director of the Micro-Scale Life Sciences Center, University of Washington
Time: Dinner at 6:00 PM; Presentation at 6:45 PM (note new times!)
Cost: $20 if reserved by April 12; $25 after & at door; vegetarian available; no cost for presentation only
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: Through the website link Web: www.cpmt.org/scv
Dr. Babak Parviz is the Gerald McMorrow
Associate Professor of Innovation and the Associate Director of the Micro-scale Life Sciences Center at the University of Washington. He received his graduate degrees in physics and electrical engineering from the University of Michigan. After working as a product manager in integrated photonics and completing his postdoctoral training in chemistry and chemical biology at Harvard University, he joined the University of Washington as a faculty member in 2003. His research is focused on nanotechnology, bionanotechnolgy, and microsystems. He is the recipient of the NSF CAREER Award and was selected as one of the top innovators under the age of 35 in the world by the MIT Technology Review in 2007. His research work has been put on display in the London Museum of Science and has been reported by hundreds of news organizations including in the New York Times, The Economist, Washington Post, Business Week, CNN, NPR, and BBC among others. Time Magazine chose his work as one of the top inventions of the year 2008. He has been selected as an organizer of the United States National Academies Frontiers of Engineering meeting for 2010.
The current trend in the semiconductor industry requires further miniaturization of components, their precise placement, and integration of an ever-increasing number of parts made in various technologies into a single platform. To extend the range of robotic and pick-and-place tools for microsystem integration, designing systems that can participate in their own packaging is being considered. In self-packaging, the components of the system are made independently and programmed to spontaneously self-organize into the final structure. This presentation provides and overview of recent work on self-assembling devices and systems from the nano to the micro scales and discusses building functional contact lenses as an example of how self-assembly/self-packaging may be used as an enabling technology.
WEDNESDAY April 14, 2010
SCV Components, Packaging and Manufacturing Technology, with Nanotechnology
• Patent application preparation, prosecution, IP Strategy • Enforcing, Licensing and Monetizing Patents • Broad Experience in many Electrical and Software arts • Our Experts: IEEE Fellow, SPIE Fellow, Technical and Legal Experts
Ph: 408-288-7588 www.StevensLawGroup.com
Email: [email protected]
1754 Technology Dr, #226 San Jose
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 21
Architectures and Applications of Video Surveillance and Video
Analytics Systems
Speakers: Robb Henshaw, Proxim Wireless; Suhas Patil, Cradle Technologies; Basant Khaitan, Videonetics
Time: Food/drink and networking at 6:00 PM; Presentations at 6:30 PM
Cost: Donation for food/drinks Place: National Semiconductor, Building E,
Conference Room, 2900 Semiconductor Dr, Santa Clara
RSVP: By April 12 to [email protected] Web: www.ewh.ieee.org/r6/scv/comsoc
See next page for speaker biographies.
The program this month includes three talks:
A Primer on Wireless Network Architectures and Applications for Video Surveillance, Robb Henshaw, VP Marketing & Channels, Proxim Wireless
In recent years, there has been explosive growth in the video surveillance market due to an increased need to secure the world's ports, airports, cities and transportation infrastructure as well as schools, hospitals, government and other critical environments. Organizations of all kinds are being challenged to install video surveillance in areas that are too remote, too costly or even physically impossible to reach with additional wired cabling . As a result, wireless solutions have been a boon to the video surveillance market as they enable the ability to cost-effectively leap over these barriers, allowing a virtually unlimited number of video surveillance cameras to be deployed quickly, easily and affordably. Though there are many wired video surveillance networks already in use today, the need to expand and scale those networks cost-effectively and in a timely manner introduces an opportunity for wireless solutions to take over where wire left off.
Today, there are two predominant wireless technologies that are being utilized for the successful deployment of wireless video surveillance networks – point-to-point (P2P), and point-to-multipoint (P2MP). This presentation will provide a primer on these primary wireless technologies, and how each of them stacks up as a solution for video surveillance networks.
Video Surveillance, Security and Smart Energy Management Systems, Suhas Patil, Chairman and CEO of Cradle Technologies
This presentation and discussion will be centered on how the technology underlying Video Surveillance is changing from that of traditional CCTV and video recorders to that of computers, wired and wireless computer IP networks, cellular and wireless mesh networks, cloud computing, video and data analytics and correlation of data and integration with distributed sensors. Various components of high technologies from Silicon Valley such as computer, semiconductor, sensors, communications and software technologies are coming together to create systems that are proactive in nature and generate actionable information with ubiquitous access from anywhere and at any time . The deep monitoring capability of such a system combined with control electronics is
WEDNESDAY April 14, 2010
SCV Communications
● Customized ADCs, PLLs, I/Os, SerDes ● Analog/Mixed-Signal IC design services
www.mobilitysemi.com Ph: 408-738-5509
2953 Bunker Hill Lane #400, Santa Clara
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 22
likely to provide the foundation for implementing Smart Energy Management at affordable prices.
The Role of Video Analytics in Video Servers and Network Edge Products, Basant Khaitan, Co-founder and CEO of Videonetics
The video surveillance systems landscape in recent years has changed due to the advent of digital video and networking platforms. Worldwide physical security concerns have provided further impetus for acceleration in innovations and deployment of sophisticated video surveillance systems. Video analytics or video content processing, a technology that enables real time detection, classification and tracking of people, traffic and other classifiable objects, has emerged as an important tool in many such systems.
When effectively deployed, a video analytics system, at the very least, adds reliability and productivity to a surveillance system. A number of end-user published case studies clearly demonstrate such systems also provide a solid return in operational and capital cost savings relative to incrementally higher investment. A video analytics enabled video storage management system provides for event- or rules-based indexing or logging, event-based archiving and event-based retrieval. Many well designed video management platforms offer integrated communication system for real-time alerts, secure and flexible viewing anytime-anywhere, and, added flexibility in network architecture design.
Besides physical-security-driven video surveillance systems, several video analytics deployments are beginning to gain a foothold in traffic control applications. Mission-critical and perpetual traffic control system solutions must often adapt to unique and challenging road conditions in many older and larger cities.
Newer video analytics software architectures perform in centralized, high channel density, video server configurations as well as compact, low-density, network-edge products with symmetry and equal effectiveness. Video content processing is recognized as an evolving and strategic technology with a promising potential in wide-ranging application segments including automotive, medical, manufacturing, robotics, etc.
Speaker Biographies:
Robb Henshaw is the Vice President of Marketing & Channels at Proxim Wireless, a manufacturer of end-to-end broadband wireless systems, where he oversees the company’s global marketing, communications, and channel development efforts. For the last 8 years he has been dedicated to helping develop the wireless industry and raise awareness for new technologies, with expertise ranging from enterprise WLANs, to carrier-grade wireless backhaul, to WiMAX and point-to-multipoint broadband wireless access (BWA) solutions. Prior to joining Proxim Wireless, Robb held PR/marketing positions where he helped establish wireless industry leaders including Airespace (acquired by Cisco), Good Technology (acquired by Motorola), Network Chemistry (acquired by Aruba Networks), HP’s ProCurve networking division, and DiVitas Networks.
Suhas Patil, ScD is Chairman and CEO of Cradle Technologies - a Silicon Valley company that makes advanced networked video surveillance products. He is founder and Chairman Emeritus of Cirrus Logic, where he deveoped the fabless business model for a semiconductor company and pioneered the first commercially successful silicon compiler for the layout of VLSI chips. Before becoming an entrepreneur and starting Cirrus Logic in 1981 Dr. Patil spent ten years in academicis. Dr. Patil was an Associate Professor of Electrical Engineering and Computer Science at MIT and the University of Utah. In 1992, Suhas founded The Indus Entrepreneurs (TiE) non-profit organization and served as its first president. Suhas has served on the board of trustees of The Computer History Museum, The Tech Museum and the World Affairs Council of Northern California.
Basant Khaitan is co-founder and CEO of Videonetics, an India-based start-up with innovative offerings in video analytics or intelligent video content processing technology. The company's innovative software platform offers real-time, video analytics processing for detection and tracking of people, vehicles and other classifiable objects. The Videonetics server product enables pioneering video management and storage systems through integration of video analytics into a unified platform. Prior to Videonetics, Basant held executive position at Centillium Communications, Inc.,vEngines, Veridicom and Hitachi Semiconductor in San Jose.
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 23
Energy Savings on Fans and Pumps Using
Adjustable Frequency Drives
Speaker: Jim McGeough, Western Regional Sales
Manager, Eaton Corporation Time: Social at 5:30 PM, Presentation at 6:15
PM, Dinner at 7:15 PM Cost: $20 for IEEE members;
$25 for non-members Place: Marie Callender's Restaurant - The Garden
Room; 2090 Diamond Blvd in Concord RSVP: Please email by April 14th to Gregg Boltz,
[email protected], (925) 210-2571 Web: www.e-grid.net/docs/1004-oeb-ias.pdf
Jim McGeough is the Western Regional Sales
Manager for low-voltage and medium-voltage Adjustable Frequency Drives for Eaton Corporation. He joined Eaton Corporation in 1980 as a Drives Sales Engineer and has been applying variable-speed drives throughout the West for over 30 years. He has extensive experience with various drive applications including constant torque, variable torque, multi-motor, pumping, HVAC, regenerative, wind/solar, load-sharing, process, and discrete control. His 30-year experience with the entire Eaton product offering (including Westinghouse, Cutler-Hammer, Moeller, PowerWare, Dynamatic, IDT, Opcon, PhoenixTec, etc) enables him to provide turn-key solutions to the customer's needs. Jim is a LEED Accredited Professional and carries the LEED AP Building Design and Construction credential.
As the cost of energy rises, there are many ways
that facilities can address the efficiency of energy consumption. AC Motor loads can typically be the largest percentage of energy consumers in a facility. AC Motors and other non-linear loads can also affect facility power-factor concerns and create excessive costs brought on by the power utility provider. Utilizing Low Voltage and Medium Voltage Adjustable Frequency Drives (AFD’s) on new or existing AC Motors for fan and pump applications can provide energy savings and quick payback periods.
The following topics will be discussed to help bring a better understanding on how, where, when, and why a facility would want to use AFD's for energy savings: The electrical and mechanical disadvantages of
starting fans and pumps across the line Reduced-Voltage Starters will only get you part
way there! Existing flow control techniques and restrictive
devices How AFD's work - 101 The pump and fan Affinity Laws Review some real-life HVAC applications and
calculate carbon footprint and payback periods
THURSDAY April 15, 2010OEB Industry Applications
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 24
Energy-Efficient Design of Digital Circuits
Speaker: Prof. Vojin Oklobdzija, IEEE-SSCS
Distinguished Lecturer Time: Refreshments at 6:00 PM, Presentation at
6:30 PM Cost: small donation to cover food Place: Qualcomm, Building B, 3165 Kifer Road
Santa Clara (this meeting only) RSVP: not required Web: ewh.ieee.org/mu/scv-sscs
Vojin G. Oklobdzija, is an IEEE Fellow, a Distinguished Lecturer of the IEEE Solid-State Circuits Society, Vice-President of IEEE CAS and aMember of the IEEE CAS Board of Governors. He received his Dipl. Ing. degree from the School of Electrical Engineering, University of Belgrade in 1971, and a Ph.D. from the UCLA in 1982.
Techniques for designing and optimizing digital circuits have for a long time been driven by performance. Power is now the limiting factor to performance. Logical Effort technique helps to determine transistor sizes for speed as an objective function. However, it neglects energy issues and fails to provide a guideline when designing with power budget. Other techniques have been presented which opportunistically improve power, or degrade performance to reduce power. These approaches do not directly address the true concern of digital designers, which is obtaining the minimal energy for a given performance. How to make energy-delay trade-offs for the optimal design point is neither well understood nor well defined. Design space is bound by maximally achievable speed and minimal achievable power. This presentation addresses the factors impacting optimization of digital circuits, and a framework for the optimal sizing, comparison, and analysis of energy-efficient designs.
THURSDAY April 15, 2010SCV Solid State Circuits
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 25
The Smart Grid: A Convergence of IT,
Communications and Power & Energy Technologies
Speaker: Claudio Lima, Managing Director, Sonoma
Innovation Time: Networking/Pizza Social at 6:30 PM;
Presentation at 7:00 PM Cost: $2 donation for food Place: QualComm, Building B, 3165 Kifer Road,
Santa Clara RSVP: not required Web: ewh.ieee.org/r6/scv/cas
Claudio Lima is the Managing Director of Sonoma Innovation; a Silicon Valley-based Smart Grid consulting firm, specializing in SmartGrid Communications Strategy, Next Generation Smart Grid Architectures and Advanced Smart Grid Technologies. He's a Member of The Smart Grid Council (SGC) and The IEEE Smart Grid Steering Committees (SGSC), Vice-Chair of the IEEE Smart Grid Architecture work group and serves as a Member of the NIST Cybersecurity Smart Grid Architecture and the IEEE P2030 Smart Grid Standards Committee.
He's actively involved in developing the NIST Smart Grid Interoperability (SGIP) Standards, defining the role of IP in Smart Grid and the developing an End-to-End Smart Grid Communications Architecture Framework. Prior to joining Sonoma, Dr Lima headed several teams and strategic initiatives for Sprint-Nextel at the Sprint Advanced Technologies/CTO organization in Silicon Valley, including Sprint's Next Generation Networks, Emerging Services, and Digital Media Innovation (DMI)/Venture-R&D, responsible for new technologies and business development for Sprint-Nextel. He has 22 years of experience Leading Advanced Telecommunications Systems, Architectures and Next Generation Communications Services Development. He holds a Ph.D. in Electronic Engineering from the University of Kent, Canterbury-England and an Executive MBA from Dom Cabral Foundation (FDC).
The Smart Grid is emerging as a convergence of
Information Technology (IT), Communications and Control technology with Power and Energy System Engineering. Today's electricity grid is inefficient, where 8% of its output is lost along its transmission line and an over dimensioned generation capacity of 20% exists to meet peak demand that it's used only 5% of the time. Also, the lack of real-time information and control of the critical processes and assets creates the domino-effect that is responsible for major blackouts and failures in the system, which accounts for billions of dollars in losses. The next-generation electricity grid is a "smarter" grid, where pervasive and intelligent control devices and bi-directional and real-time communications systems are overlaid on existing electricity infrastructure to provide new energy services to the end customers and make the grid more secure, reliable and efficient.
The Smart Grid is also being considered as the next big "Internet of Things" as billions of pervasive and intelligent devices will be deployed and controlled at the customer premises and throughout the transmission and distribution networks. It is estimated that each house will have at least six new intelligent devices, each with its own IP address. This "data explosion" will unleash new opportunities in IT, software, communications and semiconductor development, creating the next big wave" of innovation for start-ups, VCs, and entrepreneurs in Silicon Valley.
The attendees will gain a broad perspective of the key Smart Grid concepts; the drivers, benefits and key challenges for deploying Smart Grid systems today. The talk introduces the Smart Grid building blocks, identifies the key elements of an End-to-End Smart Grid system, introduces the NIST Smart Grid standards roadmap and the Smart Grid Innovation Zones.
MONDAY April 19, 2010
SCV Circuits and Systems
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 26
NanoImprint - Patterning Storage for Tablets/Netbooks and NanoMedical Applications
Speaker: Paul Hofemann, VP of Emerging Markets,
Molecular Imprint Inc. Time: Registration and light lunch at 11:30 AM;
Presentation at Noon Cost: IEEE Members and Students $5; Non-
Members $10 Place: National Semiconductor Bldg E-1 CMA
Room. 2900 Semiconductor Drive, Santa Clara
RSVP: from the website Web: www.ieee.org/nano
Paul Hofemann has over twenty years of
experience in sales, marketing and business development within the semiconductor, hard disk drive, and compound semiconductor industries. He started his professional career as a captain in the Air Force in the mid-1980s. After leaving the military, he spent 10 years in Silicon Valley where he held senior marketing positions at Applied Materials, Semi-Gas Systems and KLA-Tencor. He relocated to the East Coast in late 2000 to manage corporate marketing and business development for Veeco Instruments and most recently was VP of Sales for Photronics. Paul joined Molecular Imprints in November 2007 to focus on high growth emerging market opportunities. He holds a B.S. and M.S. in Mechanical Engineering.
NanoImprint technology is entering its third
generation of equipment that is targeted at high volume production. The equipment, based on the evolution of the J-FIL technology, can now produce sufficient resolution, overlay and field size, to provide the capability for patterning the 2.5" and 3.5" high capacity HDDs needed for the new media based tablet PC, eReaders and netbooks. To accompany this printing capability, new NanoMastering technology for creating cost effective working material for the imprinting has been developed. The talk will review how the J-FIL technology works, the challenges and solutions needed for ultra high density (Tb/in2) HDD media and the applicability of the same patterning technology in a mixed 193i CMOS lithographic/NanoImprint application. The talk will review the technology behind the image resolution and patterning method and also the extendability to nanomedicine and solar applications.
TUESDAY April 20, 2010
SCV Nanotechnology
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 27
Context Is King: Smartphone Augmented Reality
Speaker: Clark Dodsworth, Osage Associates
Consulting Time: Presentation at 7:00 PM Cost: none Place: KeyPoint Credit Union, 2805 Bowers Ave.,
Santa Clara RSVP: from the website Web: www.CaliforniaConsultants.org
Clark Dodsworth co-authored the original Ambient Intelligence strategy for Philips, later adopted by the EU for its 6th Framework Programme for Research and Technological Development on ICT (Information and Communication Technology) Research from 2002-2006, and was part of the first wireless, nationwide, location-aware Business-to-Consumer (B2C) startup. Clark has spoken at SIGGRAPH, and has keynoted at both entertainment and military simulation conferences. He was recently involved in the ISMAR 2009 International Symposium on Mixed and Augmented Reality. Clark is on the editorial board of the Entertainment Technology Center Press at Carnegie Mellon Univ., and the advisory board of Simiosys.com.
In 2005 he was program co-chair of the Design for User eXperience conference in San Francisco. He has been a papers reviewer for IEEE Computer Graphics and Applications, the International Conference on Audio Display (ICAD), and the Web3D conferences. He has also guest-edited ACM SIGGRAPH Computer Graphics Quarterly and SIGGRAPH Video Review.
Augmented Reality (AR) blends a physical environment with computer-generated imagery. "The Product is the Experience" is a key consideration for a quality user AR experience in hand-held devices. In this talk, Clark Dodsworth will describe the current state of AR in smartphones. This technology area is driven by a convergence of:
* improving interfaces, * better low-power CPUs, * mobile broadband, and * cloud computing
Clark will present the historical background of AR technology, and will discuss current developments in a framework of the broader trend toward locational, hyperpersonalized, context-driven, information services management. He will also describe work he did on an unprecedented smartphone AR-based system for the Dubailand theme parks project.
TUESDAY April 20, 2010
SCV Consultants' Network of Silicon Valley
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 28
Switched-Capacitor Converters: Big and Small
Speaker: Michael Seeman, Ph.D., Solar
Semiconductor Inc. Time: Networking & Pizza at 6:30 PM;
Presentation at 7:00 PM Cost: Donation for food accepted Place: National Semiconductor Building E
Auditorium, 2900 Semiconductor Drive, Santa Clara
RSVP: from the website Web: www.ewh.ieee.org/r6/scv/pels
Michael Seeman received S.B. degrees in
Electrical Engineering and Physics from MIT in 2004 and received the M.S. and Ph.D. degrees in Electrical Engineering from U.C. Berkeley in 2006 and 2009, respectively. Michael performed research under the supervision of Prof. Seth Sanders on switched-capacitor DC-DC converter fundamentals and applications. His research on energy-conversion ICs for wireless sensor nodes earned him a best paper award at PESC 2008.
Dr. Seeman is now working at Solar Semiconductor Inc. as a Senior Design Engineer in their power management group.
Switched-capacitor (SC) DC-DC converters have
historically been relegated to utilitarian low-power applications where high efficiency and regulation have not been important. Through our recent developments in analyzing SC converters, their suitability for a wide range of applications has become apparent. Two applications of SC converters: First, an integrated wireless sensor node power conditioning circuit will be presented with a standby power of less than 6 uW; Then, an on-die power conversion circuit for microprocessors will be discussed.
WEDNESDAY April 21, 2010
SCV Power Electronics
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 29
Tier 4a Interim Emissions Standards
Speaker: Armen Kludjian, Peterson Power Systems Time: Social at 5:30 PM; Presentation at 6:00
PM; Dinner at 7:00 PM Cost: $30; student members $10 (pay at the
door) Place: Sinbad’s Restaurant, Pier 2 The
Embarcadero, San Francisco RSVP: Please email Frank Sylvester,
[email protected] for reservations and to qualify for the drawing
Web: www.e-grid.net/docs/1004-sf-ias.pdf
For more than 20 years Armen Kludjian of Peterson Power Systems has been designing, selling and applying Generator Systems, Paralleling Switchgear and Flywheel UPS for Hospitals, Data Centers, and Water Treatment Plants from 80kW to 3MW, with voltage ranges of 208V, 480, 4160 and 12kV.
1) Beginning January 1, 2011 the EPA kicks off
new tighter emission standards. 2) Our presentation will focus on the 751HP and
above Standby Engines. 3) Action is currently pending at the state level and
the information presented is extremely timely. This presentation will be generic in nature and
questions from participants are encouraged. Copies of Caterpillar’s “Application and Installation Guide" will be handed out to all attendees.
TUESDAY April 27, 2010
SF Industry Applications
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 30
Biomagnetics: An Interdisciplinary Field where Magnetics, Biology
and Medicine Overlap
Speaker: Prof. Shoogo Ueno, University of Tokyo, and 2010 IEEE Magnetics Society Distinguished Lecturer
Time: Networking and pizza at 7:00 PM, Presentation at 7:30 PM
Cost: none Place: Western Digital, 1710 Automation Parkway,
San Jose RSVP: Not required Web: ewh.ieee.org/r6/scv/mag
Ueno Shoogo Ueno received the B.S., M.S. and Ph.D. degrees in electronic engineering from Kyushu University, Fukuoka, in 1966, 1968, and 1972, respectively. Dr. Ueno was an associate professor with the Department of Electronics, Kyushu University, from 1976 to 1986. From 1979 to 1981, he spent his sabbatical with the Department of Biomedical Engineering, Linkoping University, Sweden, as a guest scientist. He subsequently served as a professor in the Department of Electronics, Kyushu University (1986-1994) and in the Department of Biomedical Engineering, Graduate School of Medicine, University of Tokyo (1994-2006). In 2006 he retired from the University of Tokyo as professor emeritus. Since 2006 he has been a professor with the Department of Applied Quantum Physics, Graduate School of Engineering, Kyushu University, and is also dean of the Faculty of Medical Technology, Teikyo University, Fukuoka.
Dr. Ueno is a Fellow of the IEEE and of the American Institute for Medical and Biological Engineering. He is a Fellow and Member-at-Large of the Governing Council of the International Academy for Medical and Biological Engineering. He was an elected member of the IEEE Magnetics Society Administrative Committee (2004-2009), President of the Bioelectromagnetics Society (2003-2004), Chairman of the International Union of Radio Science’s Commission K on Electromagnetics in Biology and Medicine (2000-2003), President of the Japan Biomagnetism and Bioelectromagnetics Society (1999-2001), and President of the Japanese Society for Medical and Biological Engineering (2002-2004). He received the Doctor Honoris Causa from Linkoping University (1998). He was a 150th Anniversary Jubilee Visiting Professor at Chalmers University of Technology, Sweden (2006), and a visiting professor at Simon Frasier University, Burnaby, Canada (1994) and Swinburne University of Technology, Hawthorn, Australia (2008).
Biomagnetics is an interdisciplinary field where magnetics, biology and medicine overlap. It has a long history since 1600, when William Gilbert published his book De Magnete. Recent advances in biomagnetics have enabled us not only to detect extremely weak magnetic fields from the human brain, but also to control cell orientation and cell growth by extremely high magnetic fields. Pulsed magnetic fields are used for transcranial magnetic stimulation (TMS) of the human brain, and both high frequency magnetic fields and magnetic nanoparticles have promising therapeutic applications for treatments of cancers and brain diseases such as Alzheimer’s and Parkinson's. On the imaging front, magnetic resonance imaging (MRI) is now a powerful tool for basic and clinical medicine. New methods of MRI based on the imaging of impedance of the
human body, called impedance MRI, and the imaging of neuronal current activities in the human brain, called current MRI, are also being developed.
This lecture focuses on the advances in biomagnetics and bioimaging obtained mostly in our laboratory in recent years. The lecture describes: (1) a method of localized magnetic stimulation of the
human brain by TMS with a figure-eight coil; (2) magneto-encephalography (MEG) to measure extremely weak magnetic fields produced from brain electrical activity using superconducting quantum interference device (SQUID) systems; (3) impedance MRI and current MRI; (4) cancer therapy and control of iron-ion release from, and uptake into, ferritin, an iron-storage protein, by using both high frequency and pulsed magnetic fields and magnetic nanoparticles; and (5) magnetic control of biological cell orientation and cell growth by strong static magnetic fields. These new biomagnetic approaches will open new horizons in brain research, brain treatment, and regenerative medicine.
THURSDAY April 29, 2010SCV Magnetics
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 31
Biomagnetics: An Interdisciplinary Field where Magnetics, Biology
and Medicine Overlap
Speaker: Prof. Shoogo Ueno, Kyushu University, and 2010 IEEE Magnetics Society Distinguished Lecturer
Time: 11:00 AM Cost: none Place: Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley RSVP: Please respond by email with name,
company, to Peter Fischer, [email protected] by April 26
Web: ewh.ieee.org/r6/oeb/mag
Ueno Shoogo Ueno received the B.S., M.S. and Ph.D. degrees in electronic engineering from Kyushu University, Fukuoka, in 1966, 1968, and 1972, respectively. Dr. Ueno was an associate professor with the Department of Electronics, Kyushu University, from 1976 to 1986. From 1979 to 1981, he spent his sabbatical with the Department of Biomedical Engineering, Linkoping University, Sweden, as a guest scientist. He subsequently served as a professor in the Department of Electronics, Kyushu University (1986-1994) and in the Department of Biomedical Engineering, Graduate School of Medicine, University of Tokyo (1994-2006). In 2006 he retired from the University of Tokyo as professor emeritus. Since 2006 he has been a professor with the Department of Applied Quantum Physics, Graduate School of Engineering, Kyushu University, and is also dean of the Faculty of Medical Technology, Teikyo University, Fukuoka.
Dr. Ueno is a Fellow of the IEEE and of the American Institute for Medical and Biological Engineering. He is a Fellow and Member-at-Large of the Governing Council of the International Academy for Medical and Biological Engineering. He was an elected member of the IEEE Magnetics Society Administrative Committee (2004-2009), President of the Bioelectromagnetics Society (2003-2004), Chairman of the International Union of Radio Science’s Commission K on Electromagnetics in Biology and Medicine (2000-2003), President of the Japan Biomagnetism and Bioelectromagnetics Society (1999-2001), and President of the Japanese Society for Medical and Biological Engineering (2002-2004). He received the Doctor Honoris Causa from Linkoping University (1998). He was a 150th Anniversary Jubilee Visiting Professor at Chalmers University of Technology, Sweden (2006), and a visiting professor at Simon Frasier University, Burnaby, Canada (1994) and Swinburne University of Technology, Hawthorn, Australia (2008).
Biomagnetics is an interdisciplinary field where magnetics, biology and medicine overlap. It has a long history since 1600, when William Gilbert published his book De Magnete. Recent advances in biomagnetics have enabled us not only to detect extremely weak magnetic fields from the human brain, but also to control cell orientation and cell growth by extremely high magnetic fields. Pulsed magnetic fields are used for transcranial magnetic stimulation (TMS) of the human brain, and both high frequency magnetic fields and magnetic nanoparticles have promising therapeutic applications for treatments of cancers and brain diseases such as Alzheimer’s and Parkinson's. On the imaging front, magnetic resonance imaging (MRI) is now a powerful tool for basic and clinical medicine. New methods of MRI based on the imaging of impedance of the human body, called impedance MRI, and the imaging
of neuronal current activities in the human brain, called current MRI, are also being developed.
This lecture focuses on the advances in biomagnetics and bioimaging obtained mostly in our laboratory in recent years. The lecture describes: (1) a method of localized magnetic stimulation of the human brain by TMS with a figure-eight coil;
(2) magneto-encephalography (MEG) to measure extremely weak magnetic fields produced from brain electrical activity using superconducting quantum interference device (SQUID) systems; (3) impedance MRI and current MRI; (4) cancer therapy and control of iron-ion release from, and uptake into, ferritin, an iron-storage protein, by using both high frequency and pulsed magnetic fields and magnetic nanoparticles; and (5) magnetic control of biological cell orientation and cell growth by strong static magnetic fields. These new biomagnetic approaches will open new horizons in brain research, brain treatment, and regenerative medicine.
FRIDAY April 30, 2010OEB Magnetics
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 32
Short Course: RF and Microwave Design for Future Technologies
Speakers: Prof Ali Niknejad, UC-Berkeley; Dr R
Srinavasan, Intel Corp; Dr Rich Ruby, Avago; Prof Gabriel Rebeiz, UC-San Diego; Prof Pham, UC-Davis; Prof Tom Lee, Stanford
Time: Registration 7:30 - 8:00 AM; Presentations 8:00 AM - 3:00 PM
Cost: Advance Reg: $60 IEEE members, $70 non-members, $50 Students/Unemployed ($10 more on-site)
Place: Michaels at Shoreline, 2960 N Shoreline Blvd, Mountain View
RSVP: Register online Web: www.mtt-scv.org
In recent years the area of RF and microwave design has expanded into many new application areas, generated new technologies and adapted many new technologies into it’s products. This short course will give an overview of some key technologies and designs that will be used for these new applications. A description of the technology and designs will be given as well as the application(s) that are targeted. Registration/Breakfast Introduction - Jay Banwait, IEEE MTT-SCV Short
Course Chair Why RF Engineers Should Learn Digital (and Vice
Versa) - Prof Ali Niknejad, University of Caliifornia, Berkeley
The New Wimax Standard - Dr R Srinavasan, Intel Corporation
Filters - Dr Rich Ruby, Avago Tunable RF MEMS Filters for 3G and 4G Systems
- Prof Gabriel Rebeiz, University of California San Diego
Lunch High Freq Packaging - Prof Pham, University of
California Davis Historical Radio - Prof Tom Lee, Stanford University Wrap up, raffle and giveaways - Jay Banwait
SATURDAY May 1, 2010
SCV Microwave Theory and Techniques
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 33
Next-Generation MEMS Inertial Sensors
Speaker: Dr. Peter G. Hartwell, Hewlett-Packard
Laboratories Time: Networking at 6:15 PM; Presentation at
6:30 PM Cost: none Place: Carnegie Mellon Silicon Valley, NASA
Research Park, Bldg. 23, Moffett Field RSVP: not required Web: www.ewh.ieee.org/r6/scv/ras
Dr. Peter G. Hartwell is currently a senior researcher at Hewlett-Packard Laboratories in Palo Alto. As a member of the Information and Quantum Systems Lab, he is the lead of the Central Nervous System for the Earth (CeNSE) team developing a broad sensing system to bring environmental awareness to information technology infrastructure. CeNSE was selected one of 20 “World Changing Ideas” in the December 2009 issue of Scientific American. Peter has extensive experience in commercializing silicon MEMS products, working on advanced sensors and actuators, and specializes in MEMS testing techniques. He graduated from the University of Michigan in 1992 with a B.S.E in Materials Science and from Cornell University in 1999 with a Ph. D. in Electrical Engineering. He did brief post doctoral work at HP Labs before joining the staff in 2000. His work at HP has been documented in numerous technical papers, patents, and articles in publications such as The New York Times, Forbes, IEEE Spectrum, and EETimes.
MEMS inertial sensors have been around for more than 25 years, from the first prototypes developed in universities to initial product offerings. While the goal has always been enabling inertial navigation in mobile devices with high performance accelerometers and gyroscopes, MEMS inertial sensors saw their first commercial success as collision detectors in vehicle airbag systems.
Fast-forward 20 years. Airbags that started on high-end cars are now available on every vehicle. The use of inertial sensors in cars has expanded into all manner of vehicle dynamics. Improvements in the cost, size and power of current sensors, along with expansion of the vendor base, have allowed MEMS
sensors to spill over into consumer electronics such as game controllers and smartphones. Their performance, however, remains largely unchanged and MEMS gyroscopes have only recently come to market in volume.
I will examine why MEMS inertial sensors have failed to live up to their initial promise, and to propose a different approach that could jump-start advancements. MEMS
fabrication technologies, such as high-aspect-ratio etching, wafer bonding, and packaging, have all seen dramatic improvements from the first university prototypes. Hewlett-Packard has applied 25-plus years of nanofabrication experience creating MEMS inkjet printheads to create a new generation of MEMS inertial sensors. I will highlight performance goals now within reach and the application space the new sensors enable.
THURSDAY May 6, 2010
SCV Robotics and Automation
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 34
Directions for Silicon Technology Development as We Approach
the End of CMOS Scaling Speaker: Tak H. Ning, IBM T.J. Watson Research
Center Time: Pizza and Salad at 6:00 PM; Presentation
at 6:15 PM Cost: none Place: National Semiconductor Building E
Auditorium, 2900 Semiconductor Drive, Santa Clara
RSVP: not required Web: www.ewh.ieee.org/r6/scv/eds
Tak H. Ning received his Ph.D. degree in physics
from the University of Illinois at Urbana-Champaign in 1971. Prior to joining IBM at Thomas J. Watson Research Center in 1973, he was a research assistant professor at the University of Illinois. At Illinois, he did research on the theory of impurity centers in silicon, the transport of electrons in MOS surface inversion layers, and developed a theory for the oxide-charge scattering of electrons in MOS inversion layers.
During the early part of his IBM career, Tak and his colleagues made significant contributions to the understanding of hot-electron effects and electron and hole trapping in MOSFET’s, including the discovery and modeling of substrate hot-electron effects. They demonstrated the shallow-emitter effect and its dependence on emitter-contact material. They invented and developed the polysilicon-emitter self-aligned bipolar transistor, which is the basis of all modern bipolar transistor technology. They also invented the substrate-plate trench-capacitor DRAM cell, which is widely used in stand-alone and embedded DRAM products.
As senior manager of the silicon device technology department between 1982 and 1991, he directed and contributed to the development of submicron bipolar and CMOS technologies in IBM Research as well as led his team in exploring SOI and EEPROM devices.
In 1991, Tak was appointed an IBM Fellow. Since then, he has focused much of his technical work on understanding the limits of CMOS and exploring the opportunities in silicon technology beyond CMOS. He also represents IBM at the Executive Advisory Board of the Semiconductor Research Corporation, a consortium of semiconductor companies funding university research in semiconductors. (continued, at right)
CMOS at the 45-nm node has been in production for
a couple of years now, and if everything goes according to plan, CMOS at the 15nm lithographic node should be in production in less than ten years. However, every technology has its limits and CMOS is no exception. While there will be billions of CMOS devices on a chip, and “mobility engineering” will continue to enable ever faster CMOS devices, band-to-band tunneling will push up the standby currents and severely cap the speed of any transistor requiring low standby power dissipation.
Nonetheless, the glass for continuing the rapid progress in silicon technology appears half full because system designers need a lot more than fast transistors. These needs include increasingly large memory capacity and increasingly large memory bandwidth, huge amounts of data storage, especially storage that can be accessed at much larger bandwidth than traditional magnetic disk storage, system-on-chip (SoC) integration and volumetrically dense system-level packaging. And, of course, the power dissipation must be consistent with the thermal and power dissipation requirements of the systems.
In this talk, the fundamentals that could limit the scaling of CMOS at or beyond the 15nm lithographic node will be discussed, and some thoughts on silicon opportunities for meeting the system needs of “besides faster CMOS transistors” will be offered. The emphases will be on opportunities in memory technologies and in exploiting SOI CMOS as a SoC platform.
Tak has participated in many IEEE and professional
society activities, including serving as a member of the Administrative Committee of the IEEE Electron Device Society, a program committee member of several technical conferences, and a member or chair of several IEEE award committees, including the IEEE Fellow Committee. He has been a member of the SEMATECH Committee that publishes the International Technology Roadmap for Semiconductors (ITRS) since 1992.
Tak has authored or co-authored more than 120 technical papers and 36 U.S. patents. He co-authored (with Yuan Taur) a book titled "Fundamentals of Modern VLSI Devices" (1998), which has been adopted as a graduate text by many universities worldwide and translated into Japanese.
He is a fellow of the American Physical Society and of the IEEE, and a member of the US National Academy of Engineering. He received several awards, including the 2007 ECS Gordon E. Moore Medal, the IEEE Electron Device Society 1989 J.J. Ebers Award, the IEEE 1991 Jack A. Morton Award, the 1998 Pan Wen-Yuan Foundation (Taiwan) Outstanding Research Award, and the IEEE 2000 Custom Integrated Circuits Conference Best Paper Award.
TUESDAY May 11, 2010
SCV Electron Devices
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 35
Supercomputing at NASA: Current Impact, Future Challenges Speakers: Dr. Rupak Biswas, Division Chief, NASA
Advanced Supercomputing Time: Pizza/sodas and networking at 6:30 PM;
Presentations at 7:00 PM Cost: none Place: Microsoft Research, 1288 Pear Ave.,
Mountain View RSVP: from website Web: ewh.ieee.org/r6/scv/computer
As acting chief of the NASA Advanced Supercomputing (NAS) Division, Dr. Rupak Biswas oversees the full range of high-performance computing services for NASA's primary supercomputing center. Dr. Biswas is a nationally recognized expert in the areas of parallel programming models and paradigms; benchmarking and performance characterization of emerging and innovative architectures for high-end computing systems; novel partitioning and load balancing techniques for large-scale computational science problems; and scheduling algorithms for distributed computing environments. Due to his broad knowledge in advanced computing technologies and federal agencies, Dr. Biswas was chosen to serve as a member of the inter-agency High End Computing Revitalization Task Force (HECRTF), as a mission partner representative on the DARPA High Productivity Computing Systems (HPCS) Project, and one of five expert panelists to assess all high-end computing R&D activities in Japan.
Biswas received his Ph.D. in Computer Science from Rensselaer Polytechnic Institute in 1991, and has been at NASA ever since. During this time, he has received several NASA awards, including the Outstanding Leadership Medal in 2009, and two Best Paper prizes given at the international "SC" conference on high-performance computing, network, and storage. He has published more than 140 technical papers on a variety of scientific computing topics in archival journals and at major peer-reviewed conferences, given numerous talks at home and abroad, and edited several journal special issues.
In this talk, Dr. Biswas will describe NASA's fully-
integrated supercomputing environment, its recent impact in several NASA mission areas, and discuss some pacing challenges to be overcome to make the next revolutionary advances in this field. High-fidelity modeling, simulation, and analysis, enabled by supercomputing, are becoming increasingly important to NASA’s mission to pioneer the future in space exploration, scientific discovery, and aeronautics research. High performance computing for computational modeling and simulation is now integral to the space agency’s work in all mission areas. The NASA Advanced Supercomputing (NAS) Division at Ames Research Center hosts the majority of the Agency’s supercomputing assets, which consists of over 900 teraflops of computational capability, more than 6 petabytes of filesystem. The NAS facility also provides full-service support to scientists and engineers in the areas of application porting, performance optimization, large-scale data analysis and rendering, and multi-terabyte data transfers.
TUESDAY May 11, 2010
SCV Computer
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 36
Winner Take All: How Competitiveness
Shapes the Fate of Nations
Speaker: Richard J. Elkus, Jr., Vice Chairman of the
Board, Tencor Instruments Time: Dinner at 6:00 PM; Presentation at 6:45 PM Cost: $20 if reserved by May 10 ($10 for students,
unemployed); $25 after & at door; vegetarian available; no cost for presentation only
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: Through the website link Web: www.cpmt.org/scv
Richard J. Elkus, Jr., has been intimately
connected with the development and evolution of Silicon Valley. His business career as an executive and entrepreneur has been integrated with organizations and committees involved in national and international policy development pertaining to economic competitiveness.
Elkus spent the first decade of his career at Ampex Corporation serving in managerial positions of increasing responsibility. He wrote the original product plan for the home video recorder and headed the team that introduced what would become the VCR to the world in 1970. During his career, he served as chief executive and on the board of several high-tech companies, including Executive Vice President and General Manager of Geometrics, Inc., Director and Chairman of Pacific Measurements and Integrated Systems, Inc., Co-Founder, Chairman and CEO of Prometrix Corporation, Director and Vice Chairman of Tencor Instruments, Director of KLA-Tencor, Director of OnTrak Systems and Director of Lam Research. In addition, he served as a Director of Tomex Corporation, Virage Logic, SOPRA-SA, and Cameca-France.
His professional affiliations, past and present, include serving as Chairman of the Selection Committee for the National Medal of Technology, presented each year by the President of the United States; member of the Board of Directors and executive committee of the National Science and Technology Medals foundation, member of the Board of the American Electronics Association,
(continued, next page)
The strategic dilemmas now confronting America
are deep and daunting. Though we face no immediate threat of another world war or Great Depression, we find ourselves in what could become a zero sum game. And we are losing. At the core of our growing problems is an exorbitant level of public and private debt relative to savings and the nation's capacity to repay its creditors. And beyond America's insatiable demand for credit lies another problem, one potentially much worse. The United States is rapidly losing its ability to commercialize its innovative strengths in the form of advancements in technology, products, and markets that are potentially explosive and scalable and thus strategic to any great nation. As a result of these losses, our ability to innovate, produce, and employ continues to decline. In the end, the country becomes unable to regenerate itself.
This is not a danger that looms on the horizon. It is the condition that faces America today. We are on the verge of losing our ability to compete —- the only viable means to paying down the nation's horrendous financial obligations.
The United States is no longer a significant factor in the consumer electronics industry, including television, cameras, recorders, and cell phones. Without the resources of China and other Asian countries, neither computers, iPhones, HDTVs, nor myriad other consumer electronics would be on the shelves of American stores. Two of America's three automobile companies went bankrupt. We are no longer competitive in nuclear power. We face fierce competition in aircraft and ship building. We are no longer a significant supplier of machine tools. By 2007 nearly 80 percent of all semiconductor fabrication tools were being purchased for manufacturing facilities in Asia. The loss of these markets will ultimately hinder technological advances in the U.S. military establishment.
The high dependence of our industrial base on foreign design and manufacturing has ominous implications. Assuming China and India increase domestic consumption, substantially reducing their reliance on the U.S. consumer, America could become marginalized. Asia will be able to get along without us while we remain significantly dependant on them.
To resolve this situation will cost hundreds of billions in new investment over many years. As the nation tries to live within its means, our standard of living will fall. America will have to develop a totally different competitive strategy. We will have to
WEDNESDAY May 12, 2010SCV Components, Packaging and Manufacturing Technology
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 37
become an exporting nation, selling more than we buy. In many respects the United States will have to take lessons from the Asian book of competitiveness. Without that understanding we will be unable to meet our assumed obligations. The America to which we have become accustomed will cease to exist.
We Americans went to get money from woefully overdrawn bank accounts only to find the banking system could loan no more. We then called upon the government not only to assume those debts that individuals and corporations could not meet, but to loan considerably more, hoping to avoid another depression. Deep in the national memory is the civil unrest and global savagery brought on by the Great Depression, which ended only through the winning of a world war. With our competitors devastated by the war and our homeland unscathed, we became the greatest industrial power ever known. Until the early 1970s, America had a positive balance of trade, dominating virtually every technology, product, and market. We have been living off that once lofty position ever since.
But for the last 30 years competitiveness has not been about the nation's commercialization of innovative products in highly scalable markets, but about short-term returns on investment —- returns offered by other nations happy to do our manufacturing and design for a fraction of our cost in wages and investment. The result today is the gutting of our industrial base, a structural imbalance in trade, and a fundamental loss in our ability to innovate and commercialize —- two functions, inexorably tied together, without which America can never pay down its debt nor provide enough jobs.
Turning this situation around will demand great individual and collective sacrifice. It will also require that we grasp the principles of competitiveness: As end-use products, markets, and related technologies evolve, they become increasingly interrelated, interdependent, and integrated. They converge. As this infrastructure grows it becomes very difficult to define the difference between the functions of marketing, engineering, and manufacturing, let alone pick and choose what function you want to control. The development of the infrastructure is always evolutionary, never revolutionary. As it grows in scale, the amount of money invested in it grows exponentially. A semiconductor manufacturing plant that cost $50 million in 1984 could cost $6 billion today. Dropping out of the game often means you don’t get back in.
The United States has been exiting the game for nearly thirty years, a strategy rationalized through short term monetary gains and the dream that technology can be developed apart from the infrastructure that supports it. We assume a good idea will win no matter which nation builds the
infrastructure. While a good idea might be worth a few dollars, the cost of technological innovation and ability to commercialize it will often run in the billions. America is in serious danger. It is time to develop a national strategy for international competitiveness.
Speaker Biography (continued) member of the Board of Trustees for The Scripps Research Institute, member of the Board of Trustees of the Palo Alto Medical Foundation, member of the University of California (UC) President's Board on Science and Innovation, and the UC Merced Foundation, Chairman of the National Science Foundation Panel on High-Definition Products and Systems, Co-Chairman of the American Electronics Association Committee on High-Definition Television, Vice Chairman of Government Policies Committee of the Defense Science Board, member of the Council on Competitiveness and member of the Board of International Counselors of the Center for Strategic and International Studies. He has also provided testimony on U.S. Competitiveness before the Senate Banking Committee and House Subcommittee on Science and Technology.
Elkus is a strong advocate for the accessibility and affordability of higher education. He served as a member and mentor of the Stanford University's Future Professors Program. He is the author of WINNER TAKE ALL: How Competiveness Shapes the Fate of Nations (Basic Books, 2008). He earned his undergraduate degree from Stanford University and his MBA from Dartmouth College, Tuck School of Business Administration. Richard Elkus will be introduced by Stanley Myers, President and Chief Executive Officer of SEMI, in San Jose, since 1996.
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 38
Multiscale Magnetic Models: From Electronic Structure
to Device Design Speaker: Roy Chantrell, Physics Department, The
University of York Time: 11:00 AM Cost: none Place: Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley RSVP: Please respond by email with name,
company, to Peter Fischer, [email protected] by May 24
Web: ewh.ieee.org/r6/oeb/mag Professor Roy Chantrell has made a number of
contributions to the theory of magnetism, in particular the development of models of spin dynamics in complex magnetic systems. He has published around 340 refereed research papers with over 5000 citations and has given invited papers at the major international magnetism conferences (MMM and Intermag) and at specialist magnetism meetings. Until 1989 he was Professor at the University of Central Lancashire, moving to the Universities of Keele (1989), Bangor (1996) and Durham (1999). His research group consisted of around 7 students and postdoctoral researchers and received extensive support from the national funding councils, the EU and industry. In 2001 he moved to Seagate research (Pittsburgh) to establish and lead a theory group carrying out work on lengthscales ranging from ab-initio calculations to large-scale micromagnetic simulations. Here he initiated pioneering research into the development of atomistic calculations with parametrised ab-initio information. This was applied especially to nanoparticles of FePt, to an understanding of the physics of heat-assisted magnetic recording, and to the development of atomistic models of read elements. Chantrell was the recipient of a Seagate Technical Achievement Award in 2004. In August 2004 he was appointed to a chair of Condensed Matter Theory at the University of York, UK. He currently leads a group comprising 1 academic member of staff, 1 postdoctoral researcher and 8 postgraduate students.
(Continued, next column)
Magnetic materials make a vital contribution to a number of technologies, including of course magnetic recording. Increasingly, materials are structured on the nanoscale in order to produce the desired properties for specific applications. In addition, future applications may require heating of the material up to and beyond the Curie temperature characteristic of the magnetic phase transition. The important consequence is that the usual formalism, termed ‘micromagnetics’, cannot be used to investigate such complex phenomena. I will describe the development of new approaches linking electronic structure calculations and atomistic spin models of magnetic materials and outline applications to the fundamental understanding of ultrafast magnetisation reversal. In particular I will show that magnetisation reversal in a timescale of 300 femtoseconds is possible, and will describe the implications for heat assisted magnetic recording.
Finally, I will outline recent developments which allow the bridging of the atomistic and mesoscopic lengthscales, allowing the models to be applied to the understanding of macroscopic experiments and ultimately to device design. This model will be applied to the investigation of heat assisted magnetic reversal and also opto-magnetic reversal, in which magnetisation reversal occurs in response to a pulse of circularly polarised laser light.
It is shown (in agreement with experiment) that switching times on the sub-picosecond timescale are possible, with important implications for magnetic recording and spin-electronic devices.
- - - - - - - - - - - - - - - - - - - - From Oct 1986 - Sept 1987 he was Visiting Fellow,
Mathematics Department, Imperial College, London. Since then Chantrell has held numerous visiting scientist positions, most recently at the Universite Pierre et Marie Curie (Paris), Fudan University (Shanghai) and the National University of Singapore, where he has been appointed visiting Professor from 2009-2012. He is Editor of the Journal of Magnetism and Magnetic Materials, a member of the advisory board of a number of international conferences, and make regular contributions as member of the program and publications committees of these meetings. He was a member of the management committee of the UK EPSRC Advanced Magnetics Program (1995-1998). He is a member of the AdCom of the IEEE Magnetics Society, and Coordinator of the IEEE Magnetics Society Distinguished Lecturer Programme.
FRIDAY May 28, 2010
OEB Magnetics
Apr i l 2010 V is i t us a t w w w . e - G R I D . n e t Page 39
An Investigation of Magnetic Reversal at Almost the Nanoscale
Speaker: E. Dan Dahlberg, School of Physics and
Astronomy, University of Minnesota Time: 11:00 AM Cost: none Place: Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley RSVP: Please respond by email with name,
company, to Peter Fischer, [email protected] by June 16
Web: ewh.ieee.org/r6/oeb/mag
E. Dan Dahlberg received the B.S. and M.S. in physics from the University of Texas at Arlington in 1970 and 1972, respectively, and the Ph.D. from University of California, Los Angeles, in 1978. He joined the faculty at the University of Minnesota in 1980 and is currently a professor of physics and an Institute of Technology Distinguished Professor. He is the director and principal investigator of the Magnetic Microscopy Center (MMC) at the university. His recent research is on exchange bias, the physics of magnetic tunnel junctions, and noise in magnetic devices. Some of his previous research includes magnetotransport and other magnetic properties of thin films and multilayers, the dynamics of spin glasses, nonequilibrium superconductivity, the thermodynamics of magnetic superconductors, and the quantum Hall effect.
Prof. Dahlberg is a member of Sigma Pi Sigma (1971) and a Fellow of the American Association for the Advancement of Science (1995) and the American Physical Society (1996). He was an Alfred P. Sloan Foundation Research Fellow (1981-1985). He served as general chair of the 2001 Joint Magnetism and Magnetic Materials (MMM)-Intermag Conference and as an editor of several MMM and MMM-Intermag conferences. He was divisional councilor to the Division of Condensed Matter Physics of the American Physical Society (1999-2002), a member of the Executive Board of American Physical Society (2001-2002), and Vice President of the International Union of Pure and Applied Physics (IUPAP) (2006-2009).
One of the current frontiers in magnetism is to
understand the domain structure and the magnetization reversal in nanometer-sized particles.
Explorations at these length scales have been aided by the development of new magnetic imaging techniques, one of which is the magnetic force microscope (MFM), a variant of the atomic force microscope. We have utilized the high resolution MFM (30 nm) we developed to increase our fundamental understanding of magnetism on this length scale. I will discuss the field-induced magnetic reversal in particles on the order of hundreds of nanometers in width and about twice that in length. In general, for the small aspect (length to width) ratio, the magnetization reverses by the formation of a single vortex and its propagation down the length of a particle (when the fields are applied perpendicular to the long axis). There are some surprises when the aspect ratio of the particles increases.
Monday June 21, 2010
OEB Magnetics