traction inverter bdom - future · pdf file 2020. 6. 10. · automotive traction...
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Solution Description Product Recommendations Interactive Block Diagram (onsemi.com)
https://www.onsemi.com/PowerSolutions/content.do?id=16816#15068.163 ON Semiconductor Block Diagram of the Month Click on green blocks to obtain additional information.
Blocks containing multiple product options will take you to the product recommendation table labeled by block name. Blocks with only one product recommendation will take you to the product page at onsemi.com.
Automotive Traction Inverter Solution Description
Introducing the Block Diagram of the Month for October 2019 – The Automotive Traction Inverter
Solution. Global legislation to reduce CO2 emissions and enhancement of fuel economy is driving
automotive manufacturers to design electrified powertrain systems with reduced size and weight
that exhibit optimal power efficiency. The primary function of the traction inverter is to convert the
DC voltage from the high voltage battery (350-800 VDC) to a three-phase AC sinusoidal current
that in turn rotates an electric induction motor and propels the vehicle. Our broad automotive
portfolio contains technologies to facilitate a cost effective, robust and competitive solution for
operation of the three-phase induction motor infull, plug-in hybrid and hybrid electric vehicles using
a traction inverter.
Primary blocks of the topology:
Isolated Power Supplies
Three Phase Inverter Stage
Signal Processing and Conditioning
Communication Bus
Isolated Power Supplies:
The function depicted by the power management block in the
traction inverter solution is to generate isolated power supplies
that create a barrier between the high and low voltage circuit
topologies contained within the system to prevent connection of
the grounds between the low voltage and high voltage batteries.
Resonant controllers, flyback controllers and linear voltage
regulators are used to generate power sources for digital circuits,
analog circuits, integrated circuit voltage references and high
voltage gate drivers used to control the conduction of the separate
phases in three-phase inverter. Numerous high efficiency
resonant and flyback controller topologies can be constructed
using the ON Semiconductor recommended solutions listed in the
product selection table depending on the system level
requirements.
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Three Phase Inverter Stage:
The primary components of the three-phase
inverter stage are the high and low side
switches of each of the inverter ½ bridge
phases and the corresponding high voltage
isolated gate drivers that turn on and off those
switches that generate a three-phase AC
sinusoidal waveform to operate the induction
motor. The high and low side switch control on
each inverter phase is managed through a
variable frequency drive control algorithm
deployed by a microprocessor. Besides
providing the galvanic isolation for separation
of the high voltage system from the low voltage
system, one of the key features of our high
voltage gate driver technology is the DESAT
(desaturation) detect feature that prevents a
“shoot through” effect during an IGBT short
circuit condition. In addition, our high voltage
gate drivers have miller clamp capability to
prevent un-intentional parasitic turn on of one
of the switches. For enhanced protection, the
device has fault indicator capability to inform the system of malfunction and an enable input. For the ½ bridge inverter stages, discrete and modular solutions
are offered in our automotive portfolio. The traction inverter phases can be constructed using discrete IGBT’s, integrated modules from the VE-TracTM
(vehicle electrification Traction) family and discrete SiC MOSFETS. All these solutions are able to interface with the high voltage gate driver. Bare die
products with the IGBT and fast recovery diode are also available to build the three-phase inverter stage and are included in the product selection table.
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ON Semiconductor offers AECQ-101 qualified 650V discrete IGBT parts rated at 120 and 160 Amps that exhibit superior thermal
and electric performance. Due to the IGBT having a characteristically low VCE(sat) and gate charge, conduction and switching losses
are minimized thereby translating into high efficiency operation. Our IGBT’s are co-packaged with a fast reverse recovery diode
and are constructed using the competitive field stop trench technology utilizing a fine cell pitch design to create a high power density
part with rugged immunity to dynamic latch-up conditions. Depending on the power requirement for the motor, multiple IGBT’s can
be placed in parallel on each high and low side switches of the inverter ½ bridge phases.
The VE-TracTM Dual Side Cooling ½ bridge modules consist of 2 IGBT’s co-packaged
with fast recovery diodes connected in a high and low side configuration. The IGBT’s are
constructed using the Field Stop 4 Trench Technology with characteristic low switching
and conduction losses. Each module represents one phase of the three separate phases
required for the traction inverter system. The device offers top side and bottom side
cooling with surfaces attaching to heat sinks encapsulated throughout the system
resulting in lower thermal resistance. The lower thermal resistance allows for higher
magnitudes of current to pass through a small, compact footprint translating into a high
power system with cost and size reductions. The dual side cooling modules allow for
modular scalability as units can be stacked in parallel configurations to create a higher
power solution. The module is capable of continuous operation up to 175°C, with wire
free bonding essential for higher reliability and longer part lifetime. The device features
overcurrent and over temperature protection.
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The VE-TracTM Single Side Direct Cooling Module
integrates IGBT’s in a six-pack configuration with each
IGBT having the co-packaged fast recovery diode. Like the
dual side cooling modules and the discrete IGBT parts, the
technology integrated in the design has characteristic low
conduction and switching losses resulting in high efficiency.
The device is configured in three high and low side ½ bridge
configurations that make up the three-phase inverter to
enable operation of the electric induction motor. The module
is a “plug and play” type of device targeting ease of
assembly and integration. The module has a direct cooling
surface with an integrated pin fin heat sink resulting in a lower thermal resistance that enables a high current operation.
The flip side of the device contains press-fit type pins on the signal terminals for ease of assembly and integration. This modular solution is not easily scalble
and limited to between 160-180kW power class operation. The module can operate continuously at 175°C with integrated temperature sensing for all ½
bridge inverter phases.
For electric vehicle systems with an 800V battery, discrete 1200V rated 20, 80 mΩ SiC MOSFETS released in D2PAK-7L and
TO-247 packages can be inserted into each high and low side switch in the three inverter phases. Compared to silicon, SiC
MOSFETS provide superior switching performance and higher reliability. The devices have low ON resistance and compact
chip size to ensure low capacitance and gate charge. These characteristics result in system benefits that include high efficiency,
fast operation frequency, increased power density, reduced EMI and facilitation of space reduction.
The Diode and IGBT bare die optimized for traction inverter applications is rated for continuous operation at 175°C having
low VCE(sat) and VF featuring enhanced reliability and ruggedness. The bare die selections are listed in the product selection
table.
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Signal Processing and Conditioning:
The primary function of the analog measurement and signal conditioning block is to process the current and temperature sense signals from the inverter along with the current and motor position sense signals from the induction motor. The isolated power supplies constructed using the resonant and flyback controllers can provide power sources to the microcontroller, signal conditioning and analog measurement circuits. ON Semiconductor offers AECQ qualified logic components, comparators, operational amplifiers and current sense amplifiers to construct the signal processing circuitry to interface with the microcontroller A/D converter unit to complete the closed loop system.
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Communication Bus:
ON Semiconductor offers CAN, CAN-FD, LIN, Flexray and SBC based transceivers that ensure robust in- vehicle communication at data rates beyond one Mbps to adhere to requirements of contemporary in-vehicle networks. In addition, ON Semiconductor offers AECQ- 101 qualified communication bus protection devices with a 175°C Tj Max rating designed to protect vehicle communication lines from ESD and